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When placing an order with PICA Manufacturing Solutions for bare Printed Circuit Boards (PCBs) or Flexible Printed Circuits (FPCs), having the correct documentation and files is crucial. This ensures smooth production, meets quality standards, and aligns with your specific requirements. This article outlines the mandatory and good-to-have documents and files...
Customer: A leading innovator in inkjet technology, our customer is renowned for their advanced and precise printheads. Serving various sectors within the industrial, commercial, and consumer printing industries, their commitment to continuous innovation and quality underscores their prominent role in the printing technology sector.Challenge: The customer required a Flexible...
The Customer: A renowned multinational company, well known for its pioneering work in imaging and photography. They have developed a cutting-edge inkjet printing system that is highly regarded for its precision, reliability, and versatility in various applications including graphic arts, electronics, and material deposition. The Challenge: To address the need for...
The Customer: A manufacturer in the motorcycle industry sought to enhance the design of their motorcycle steering wheels. They required a solution that was not only effective but also cost-efficient. The Challenge: The primary challenge was to develop a steering wheel component that could integrate electronic and mechanical elements effectively. Traditional...
In the fast-paced realm of the PCB (Printed Circuit Board) industry, achieving optimal signal integrity is crucial for the success of high-speed digital communications. As technology advances at a breakneck pace, the demand for faster and more efficient data transmission grows exponentially. This is where differential impedance, a vital...
At PICA, we pride ourselves on being at the forefront of new technological advancements, including embedded passives. Through this blog post, we aim to shed light on the broad realm of embedded passives and showcase how PICA and their manufacturing partners leverages this transformative technology to empower our customers in...
In the realm of flexible printed circuit assembly (FPCA) and printed circuit board assembly (PCBA), X-ray inspection plays a crucial role in ensuring product quality and meeting stringent requirements. This is particularly vital when incorporating surface mount components such as ball grid array (BGA), land grid array...
At PICA, we have recently undergone a transformative journey to redefine our brand identity and market positioning. This blog post aims to unveil the process, showcase the outcomes, and share the valuable insights we've gained about ourselves along the way. Brand Evolution: A Testament to Modernity and Commitment: Embarking on a journey...
A 6-Layer ELIC (Every Layer Inter-connect) Rigid Flex Printed Circuit Board / Rigid Flex PCB is an advanced and highly specialized printed circuit board technology designed to meet the ever-increasing demand for smaller and more densely packed electronic devices. It plays a crucial role in enabling the integration...
We are thrilled to announce that our team at PICA has successfully completed a 5-day training program on the OMRON Automatic Optical Inspection (AOI) equipment model VT-S1080. Thanks to OMRON, this training has equipped our workforce with the essential expertise required to program, operate, and maintain this advanced technology. By...
The most obvious benefit to a Flexible Printed Circuit (FPC) is the ability to bend and flex in order to allow for three dimensional packaging. However, the flexibility of an Flexible Printed Circuit is not always inherent in the design. When looking at a Flex circuit in a 2-D...
In the mid-1990s, the landscape of electronic manufacturing in the United States was thriving. The rapid growth of telecommunication infrastructure and the increasing demand for portable electronics and automotive applications created a fertile ground for companies to expand their capacity and experience low unemployment rates. Research and Development (R&D) departments...
Despite an abundance of literature about oven reflow soldering, PICA has found that setting up a reflow profile remains a challenge to many. The following post is intended to provide process engineers with hands-on recommendations. Reflow processes are generally defined by their heat application methods. Common examples include convection, infra-red (IR),...
I was recently visiting a client to discuss a new flex circuit application. They were trying to fit 10 pounds of electronics into an existing 5 pound package by utilizing flex circuit technology without making any changes to the current overall industrial design package. Everything had to fit into the...
So you need a flex circuit but your application demands a black substrate to keep the light out? There was a time when you simply could not get what you wanted. Times have changed. The need for colors other than the typical amber for flex PCBs has grown over...
Ever increasing signal speeds and high noise environments make EMI/RFI shielding an essential requirement for FFC’s (Flat Flexible Cables). PICA can offer various shielding options. The least expensive option is a foil laminated to the outside of the cable. This can be applied to one or both sides....
