Expertise

Dynamic FPCs are able to undergo repeated bending and flexing without degradation in performance. This is particularly important in applications where the circuit will experience the movement of bending throughout its’ operational life. Our expertise in this area includes the design and fabrication of flexible circuits that excel in dynamic performance, air gap implementation (creating small… READ MORE

PICA manufacturing has the unique capability to provide our customers with extra-long FPC and PCBs as long as 1.2 M (47.2 inches), making us one of the few suppliers who can provide boards this size. We can provide these boards by having extra-large window exposure equipment designed to handle this size of the board (special… READ MORE

PICA Manufacturing provides our customers with Ultra-Thin Flexible Printed Circuit Boards using 3 µm Copper on 25 µm polyimide or 18 µm copper on 12.5 µm polyimide. Two-layer Flexible Printed Circuit Boards as thin as 0.20mm +/-.08mm thick. When space and weight are critical for products for the wearable and medical markets among others. Special design… READ MORE

PICA Manufacturing can produce and ship your boards in a number of variations including R2R (Reel to Reel) products which are shipped in reel form or in very high production volumes. We are able to define materials, hold tight tolerances (+/- 2mils, dimstab control (subjected to MD/TD properties and demanding cosmetic requirements. Additionally, we offer… READ MORE

As technology continues to advance at a rapid pace, the demand for smaller, faster, and more powerful electronic devices has reached an all-time high. This is where High Density Interconnect (HDI) PCB Electronics Manufacturing comes into play, revolutionizing the world of electronics. These cutting-edge circuit boards are becoming the go-to solution for designers and engineers,… READ MORE

Our customers require blind and buried Microvias to achieve higher density and more complex interconnections. This technology requires creating smaller holes and vias in the PCN substrate to establish connections throughout the board. Blind Microvias connect the outermost layer of the PCB to one or more inner layers but do not extend all the way… READ MORE

PICA produces normal substrate carriers with 30/30 um (R&D with 20/20um with vias 50um). Laser size can be defined as needed. We participate in material selection recommending suitable materials to be used  with a very high Tg, 250 to 300 degrees C and a very low x7y CTE 2-5ppm/C By acting as our customers’ technical… READ MORE

EMI (Electromagnetic Interference) Shielding is used to reduce or block the electromagnetic radiation emitted by electronic devices or systems as well as preventing external electromagnetic radiation from entering and interfering with these devices. EMI materials work by providing a conductive barrier that absorbs or reflects electromagnetic waves, preventing them from propagating through the material and… READ MORE

Heavy Copper PCBs are widely used in applications where high current carrying capacity, improved thermal management, and enhanced reliability are essential. To ensure the optimum PCB performance, material selection is critical. PICA offers heavy copper up to 12 ounces in volume production. We offer expert guidance for material selection for optimum PCB performance. We offer… READ MORE

Impedance Control is the measure of the opposition that an electrical circuit presents to the flow of alternating current (AC). It is a combination of resistance, inductance, and capacitance and it is represented as a complex value with both magnitude and phase.   Impedance is a crucial parameter in high-frequency and digital signal transmission as it… READ MORE

By strategically investing in Xray inspection technology, PICA has not only opened doors of opportunity for itself but also for a lot of its customers. With our state-of-the-art 2D and 3D x-ray equipment, PICA offers real-time inspections for PCB components, assemblies, and other electronic devices. Our team of trained and certified process engineers ensures that… READ MORE

Thermal Management is a crucial consideration in electronic devices to ensure they operate within safe temperature ranges and maintain optimal performance and reliability. Both thermal vias and copper inlays/embedded solutions are effective methods of enhancing heat transfer and dissipation of circuit boards PICA provides a number of thermal management solutions to reduce heat transfer and… READ MORE