PCB Assembly Services / FPCBA & PCBA
Custom PCB Assembly Solutions for High-Reliability Electronics
Why Choose FPCBA & PCBA Assemblies from PICA?
End-to-End Expertise – From bare board fabrication to component sourcing, assembly, and final testing, we provide a seamless, single-source solution.
Flexible & Rigid Support – Whether your design requires dynamic flexing or traditional rigid stability, we specialize in both PCBA and FPCBA, giving you the best fit for your application.
Global Capacity – With facilities in the U.S. and Malaysia, we combine responsive engineering with scalable production and logistics support to meet your timelines.
Reliability at Scale – Our process controls, ESD protection, and functional testing ensure assemblies meet stringent performance standards, from prototypes to high-volume runs.
Customized Solutions – Every project is different. We tailor materials, adhesives, stiffeners, and inspection strategies to ensure durability, flexibility, and long-term reliability.
PCB Assembly Capabilities – Highlights
PICA’s component assembly services include advanced techniques and strict process controls:
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Surface-mount technology (SMT) and through-hole assembly
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Conformal coating and protective finishes
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Automated optical inspection (AOI) and X-ray inspection
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Functional and in-circuit testing
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DFM analysis and engineering support
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Prototype to high-volume production readiness
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Global logistics with U.S. and Malaysia facilities
For technical information on PICA’s Assembly capabilities, click the button below.
SMT Component Specifications
| Specifications | Value (unit: mm) | ||
|---|---|---|---|
| Nominal | Min | ||
| Positional Accuracy | F1 | 0.1 | 0.05 |
| Pitch of R/C | F2 | 0.3 | |
| Space of IC to R/C | F3 | 0.4 | |
| Space of chip to outline | F4 | 0.8 | |
| Pitch of chip | F5 | 0.2 | |
| Shift of chip | F6 | 1/3 size of pad | 0.1 |
| Chip size | F7 | MAX 32*32 | 01005 |
| Underfill flow size | F8 | 0.8 - 1.2 | 0.5 - 0.6 |
Solder Paste Dispensing Method and Specifications
| Solder Paste Dispensing Method | Specifications | Value |
|---|---|---|
| Selective Solder Paste Jetting | Smallest solder dot & pad size | Min dot diamter = 250μm Pad size (min) = 250μm |
| Jet printing frequency | 1,080,000 dph (high speed option) | |
| Single dot accuracy | 40μm | |
| Position resolution | 0.2μm | |
| Maximum board size | 508 x 508mm (20" x 20") | |
| Minimum board size | 70 x 40mm (2.7" x 1.6") | |
| Board thickness range | 0.4 - 0.6mm (0.016" - 0.24") | |
| Max board weight | 5kg (11lbs) | |
| Stencil Printer | Stencil size (mm) | 340*470 - 737*737 |
| Print position accuracy | ±25μm | |
| Printing size (mm) | 50*50 - 510*508.5 | |
| Stencil thickness (mm) | 0.05 - 5mm | |
| Warpage | < Diagonal 1% | |
| Minimum printing component size (mm) | 01005 & 0.3mm PITCH (IC) | |
| Applicable Product | PCB, FPC, & R-Flex |
Reflow Furnace Specifications
| Specification | Value |
|---|---|
| Number of Zones | 8 heating zones |
| Heating Method | Upper hot air + far infrared heating/lower far infrared heating method |
| Maximum Set Temperature | Upper 320°C / Lower 450°C |
| Effective Board Width | 35 - 558mm (1.378" x 22") |
| Transport Method (selection type) | Pin chain transfer/ mesh transfer |
| Accuracy of Temperature Controller | +/- 0.1°C |
| Transport Speed | 0.3 - 1.88 m/min |
| Applicable Product | PCB, FPC, & R-Flex |
SMT Pick and Place Machine Specifications
| Specification | Value |
|---|---|
| SMT Range (mm) | 50*50 - 460*510 |
| Minimum SMT component size (mm) | 01005, 0.3mm PITCH (IC) |
| SMT accuracy | ±0.035mm |
| Max board dimension | 457.2 x 508mm (18" x 20") |
| Max board weight | 4kg (8.8lbs) |
| Board thickness | 0.4 - 6.0mm |
| Maxiumum SMT thickness (mm) | < = 15mm |
| Maximum capacity | 46000 chip/hour |
| Feeding package | Tape & Reel, Tube, Tray |
| Component size | 01005 ~ W55*L100mm |
| Applicable component package | DPAK/SOP/SOJ.QFP/PLCC/BGA/Tantalum/SMT connector, etc |
| Applicable product | PCB, FPC, & R-Flex |
Conformal Coating
Conformal coating is a lightweight material applied to PCBs that acts as a protective layer. It protects circuit boards and components against various environmental factors, including heat, humidity, moisture, ultraviolet light, chemical contaminants, and abrasive materials. Conformal coatings also have thermal and electrical insulation properties to help manage the circuit’s operating characteristics. The key benefit of applying a conformal coating is that the protection will extend the circuit board’s life and reduce component failure rates due to environmental factors. This protection consequently improves the reliability of the device, reducing costs associated with replacing hardware that has prematurely failed.
PICA utilizes a high-performance conformal coating system that is simple to program and operate, the robust frame structure and advanced motion configuration systems ensure speed and precision for an endless variety of coating demands.
Quality Control
Automated Optical Inspection
| Inspection | Detectable Defect |
|---|---|
| Component | Missing Components |
| Tombstoning | |
| Billboarding | |
| Polarity | |
| Rotation | |
| Shift | |
| Wrong Marking (OCV) | |
| Defective | |
| Upside Down | |
| Extra Component | |
| Foreign Material | |
| Lifted Component | |
| Solder | Excess Solder |
| Insufficient Solder | |
| Bridging | |
| Through-hole Pins | |
| Lifted Lead | |
| Golden Finger | |
| Scratch/Contamination |
X-Ray Machine
PICA is equipped with a high-quality X-ray machine that detect a wide range of manufacturing defects including BGA, QFN and IGBT attachment, PTH filling, interfacial voiding, component cracking and counterfeit devices.
Additional equipment & methods to ensure best quality
- Environmental Chamber
- In-Circuit Test
- X-Section Lab
- 3.5x-180x Trinocular Microscope
- Functional Test
Other assembly manufacturing service
- Cable and Wire Harness
- Turnkey Electronic Box Builds
- Membrane Switch
- Potting/Encapsulation
- 3D Printing
Benefits of PICA PCB Assembly
Versatile Assembly
Complete support for both rigid PCB assemblies (PCBA) and flexible circuit assemblies (FPCBA), giving you a single partner for any project.
Comprehensive Services
SMT, through-hole, conformal coating, inspection, and testing are all handled in-house for end-to-end quality assurance.
Reliability & Quality
Every board goes through strict inspection and testing, ensuring dependable performance in critical applications.
Scalable Production
From small prototype runs to high-volume global builds, PICA adapts to your project’s size and timeline.
Engineering Expertise
Our design-for-manufacturing (DFM) support helps optimize layouts, reduce errors, and improve yields before production begins.
Markets We Serve with PCB Assembly
Medical
High-reliability assemblies for implants, diagnostic systems, and surgical tools.
Wearables
Compact, high-density assemblies for wearables, tablets, and smart devices.
Automotive
Durable PCBA and FPCBA assemblies for control systems, lighting, and infotainment.
Defense & Security
Mission-critical assemblies built to endure vibration, shock, and extreme conditions.
Industrial
Rugged assemblies for robotics, automation, and harsh environments.
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We want you to take a look at what we can produce for you by offering you a PICAKit which includes a variety of flexible pcb, shields, & flat flexible cables.
