At PICA, we offer advanced assembly and manufacturing using state-of-the-art technology. Below are our capabilities in SMT Component Specifications, Solder Paste Dispensing Method and Specifications, Conformal Coating, and Quality Control. For more information on SMT Pick and Place Machine Specifications, and Reflow Furnace Specification, please fill out the form below to request the full PDF capabilities download or click the button to contact a PICA engineer.
SMT Component Specifications
| Specifications | Value (unit: mm) | ||
|---|---|---|---|
| Nominal | Min | ||
| Positional Accuracy | F1 | 0.1 | 0.05 |
| Pitch of R/C | F2 | 0.3 | |
| Space of IC to R/C | F3 | 0.4 | |
| Space of chip to outline | F4 | 0.8 | |
| Pitch of chip | F5 | 0.2 | |
| Shift of chip | F6 | 1/3 size of pad | 0.1 |
| Chip size | F7 | MAX 32*32 | 01005 |
| Underfill flow size | F8 | 0.8 - 1.2 | 0.5 - 0.6 |
Solder Paste Dispensing Method and Specifications
| Solder Paste Dispensing Method | Specifications | Value |
|---|---|---|
| Selective Solder Paste Jetting | Smallest solder dot & pad size | Min dot diamter = 250μm Pad size (min) = 250μm |
| Jet printing frequency | 1,080,000 dph (high speed option) | |
| Single dot accuracy | 40μm | |
| Position resolution | 0.2μm | |
| Maximum board size | 508 x 508mm (20" x 20") | |
| Minimum board size | 70 x 40mm (2.7" x 1.6") | |
| Board thickness range | 0.4 - 0.6mm (0.016" - 0.24") | |
| Stencil Printer | Stencil size (mm) | 340*470 - 737*737 |
| Print position accuracy | ±25μm | |
| Printing size (mm) | 50*50 - 510*508.5 | |
| Stencil thickness (mm) | 0.05 - 5mm | |
| Warpage | < Diagonal 1% | |
| Minimum printing component size (mm) | 01005 & 0.3mm PITCH (IC) | |
| Applicable Product | PCB, FPC, & R-Flex |
Reflow Furnace Specifications
| Specification | Value |
|---|---|
| Number of Zones | 8 heating zones |
| Heating Method | Upper hot air + far infrared heating/lower far infrared heating method |
| Maximum Set Temperature | Upper 320°C / Lower 450°C |
| Effective Board Width | 35 - 558 mm |
| Transport Method (selection type) | Pin chain transfer/ mesh transfer |
| Accuracy of Temperature Controller | +/- 0.1°C |
| Transport Speed | 0.3 - 1.88 m/min |
| Applicable Product | PCB, FPC, & R-Flex |
SMT Pick and Place Machine Specifications
| Specification | Value |
|---|---|
| SMT Range (mm) | 50*50 - 460*510 |
| Minimum SMT component size (mm) | 01005, 0.3mm PITCH (IC) |
| SMT accuracy | ±0.035mm |
| Board thickness | 0.4 - 6.0mm |
| Maxiumum SMT thickness (mm) | < = 15mm |
| Maximum capacity | 46000 chip/hour |
| Feeding package | Tape & Reel, Tube, Tray |
| Component size | 01005 ~ W55*L100mm |
| Applicable component package | DPAK/SOP/SOJ.QFP/PLCC/BGA/Tantalum/SMT connector, etc |
| Applicable product | PCB, FPC, & R-Flex |
Conformal Coating
Conformal coating is a lightweight material applied to PCBs that acts as a protective layer. It protects circuit boards and components against various environmental factors, including heat, humidity, moisture, ultraviolet light, chemical contaminants, and abrasive materials. Conformal coatings also have thermal and electrical insulation properties to help manage the circuit’s operating characteristics. The key benefit of applying a conformal coating is that the protection will extend the circuit board’s life and reduce component failure rates due to environmental factors. This protection consequently improves the reliability of the device, reducing costs associated with replacing hardware that has prematurely failed.
PICA utilizes a high-performance conformal coating system that is simple to program and operate, the robust frame structure and advanced motion configuration systems ensure speed and precision for an endless variety of coating demands.
Quality Control
Automated Optical Inspection
| Inspection | Detectable Defect |
|---|---|
| Component | Missing Components |
| Tombstoning | |
| Billboarding | |
| Polarity | |
| Rotation | |
| Shift | |
| Wrong Marking (OCV) | |
| Defective | |
| Upside Down | |
| Extra Component | |
| Foreign Material | |
| Lifted Component | |
| Solder | Excess Solder |
| Insufficient Solder | |
| Bridging | |
| Through-hole Pins | |
| Lifted Lead | |
| Golden Finger | |
| Scratch/Contamination |
X-Ray Machine
PICA is equipped with a high-quality X-ray machine that detect a wide range of manufacturing defects including BGA, QFN and IGBT attachment, PTH filling, interfacial voiding, component cracking and counterfeit devices.
Additional equipment & methods to ensure best quality
- Environmental Chamber
- In-Circuit Test
- X-Section Lab
- 3.5x-180x Trinocular Microscope
- Functional Test
Other assembly manufacturing service
- Cable and Wire Harness
- Turnkey Electronic Box Builds
- Membrane Switch
- Potting/Encapsulation
- 3D Printing