PICA Assembly Capabilities

At PICA, we offer advanced assembly and manufacturing using state-of-the-art technology. Below are our capabilities in SMT Component Specifications, Solder Paste Dispensing Method and Specifications, Conformal Coating, and Quality Control. For more information on SMT Pick and Place Machine Specifications, and Reflow Furnace Specification, please fill out the form below to request the full PDF capabilities download or click the button to contact a PICA engineer.

SMT Component Specifications

Solder Paste Dispensing Method and Specifications

Conformal Coating

Conformal coating is a lightweight material applied to PCBs that acts as a protective layer. It protects circuit boards and components against various environmental factors, including heat, humidity, moisture, ultraviolet light, chemical contaminants, and abrasive materials. Conformal coatings also have thermal and electrical insulation properties to help manage the circuit’s operating characteristics. The key benefit of applying a conformal coating is that the protection will extend the circuit board’s life and reduce component failure rates due to environmental factors. This protection consequently improves the reliability of the device, reducing costs associated with replacing hardware that has prematurely failed.

PICA utilizes a high-performance conformal coating system that is simple to program and operate, the robust frame structure and advanced motion configuration systems ensure speed and precision for an endless variety of coating demands.

Quality Control

Automated Optical Inspection

X-Ray Machine

PICA is equipped with a high-quality X-ray machine that detect a wide range of manufacturing defects including BGA, QFN and IGBT attachment, PTH filling, interfacial voiding, component cracking and counterfeit devices.

Additional equipment & methods to ensure best quality

  • Environmental Chamber
  • In-Circuit Test
  • X-Section Lab
  • 3.5x-180x Trinocular Microscope
  • Functional Test

Other assembly manufacturing service

  • Cable and Wire Harness
  • Turnkey Electronic Box Builds
  • Membrane Switch
  • Potting/Encapsulation
  • 3D Printing

Fill out the form below to request the full PICA Assembly Capabilities sheet.