Request a PICAKit

Explore What's Possible

Put PICA
Technology in
Your Hands.

This sample kit showcases just a few of the many ways flex circuits can be manufactured. Since every flex circuit is completely custom, the possible variations are nearly unlimited. Key factors that influence design include substrate material, copper foil thickness, trace layout, bending requirements, component placement, controlled impedance, layer quantity, and overall flexibility—considering potential stress points during bending.

Each sample in the PICAKit collection measures 1 inch x 5 inches, providing a tangible and standardized format for engineers to assess and evaluate our technology.

PICA flex circuit sample kit displaying multiple flexible circuit constructions

The Six Constructions in Your PICAKit

Six Constructions. One Practical Kit.

Each construction highlights a different combination of materials and capabilities so you can compare, evaluate, and find the right solution for your application.

01

Flex-to-Install

Flex-to-install flexible circuit stackup construction
  • Standard two-layer flex with 35 µm RA Cu on both sides
  • Designed for limited flexing, mainly during installation
  • Thicker construction for robust design
02

Dynamic Flex

Dynamic flex circuit stackup construction
  • Built for repeated flexing
  • 18 µm RA Cu per layer
  • Adhesiveless polyimide for thinner, more flexible 3D packaging
03

Highly Dynamic Flex

Highly dynamic flex circuit stackup construction
  • For continuous bending
  • 2 µm High-Ductility Electrodeposited
    (HDED) Cu
  • Ultra-thin construction for extreme flexibility
  • Exceptional endurance from hundreds of thousands to millions of cycles
04

High Current Flex

High current flex circuit stackup construction
  • For high current with minimal bending
  • 2 oz copper (Cu)
  • Thicker adhesive and base film for better performance
05

Impedance Control

Controlled impedance flex circuit stackup construction
  • Three layers of ½ oz Cu
  • Polyimide layers act as shield
  • Polyimide thickness varies with impedance
06

EMI Shield

EMI shielded flex circuit stackup construction
  • One layer of ½ oz Cu
  • Two outer layers of 8 µm EMI film
  • Maintains flexibility with EMI protection

See the PICAKit in Action

Inside the PICAKit

Watch how the PICAKit brings six flexible circuit constructions together in one practical engineering resource for comparing materials, capabilities, and design possibilities.

Experience It Yourself

Request Your PICAKit

Fill out the form below to receive a PICAKit. Include any questions or details about your application so our team can better understand your design needs.