The PICA Engineering Team has released EMI Shielding for Flex Printed Circuits, a new white paper offering practical guidance for engineers, designers, and product teams. It explores shielding materials, grounding, signal integrity, and the design tradeoffs that affect flexibility, cost, and performance. With clear illustrations and a quick-reference table covering common shielding failure modes, the paper helps readers evaluate options and prepare for more productive design reviews. Download the white paper to learn more about planning effective EMI shielding for your next flex PCB project.
