Malaysia has emerged as a global hub for electronics manufacturing—thanks to its strategic location, skilled workforce, strong infrastructure, and supportive government policies. In 2019, PICA Manufacturing Solutions expanded into Malaysia, establishing a cutting-edge assembly facility to better serve our customers worldwide.Want to see why Malaysia is a smart choice for...
Flexible Printed Circuits (FPCs) are widely used due to their lightweight, flexible, and compact nature, making them ideal for applications requiring bending and folding. However, designing FPCs involves several critical considerations. Engineers should approach FPC design very differently from Printed Circuit Boards (PCBs). PICA Manufacturing Solutions has the...
As an important part of the electrical system, the performance of the wiring harness directly affects the reliability and safety of the equipment. In harsh environments, such as high temperature, low temperature, high humidity, high salt fog, and mechanical vibration, traditional wiring harness designs can deteriorate due to environmental factors,...
In Part 1, we explored the challenges of manufacturing ultra-thin flexible circuits with a focus on the conductive layers, highlighting innovations like adhesiveless copper solutions, precision imaging, and additive technologies. These advancements address the critical need for high-performance conductors in ultra-thin applications.In this continuation, we shift our focus to the dielectric...
One of our key customers approached PICA with the challenge of manufacturing ultra-thin flexible circuits. A critical component of this technology is the conductor, typically made from copper. Traditional methods, such as copper cladding with adhesive layers, are insufficient for the thinner profiles demanded by our customer. To meet this...
In the world of flexible electronics, the shift from traditional flexible copper-clad laminates (FCCLs) to adhesiveless materials represents a significant leap forward. Flexible copper-clad laminates, which consist of copper foil bonded to a substrate using adhesive layers, have long been the backbone of flexible circuits. However, their reliance on adhesives...
When developing and manufacturing flexible printed circuits (FPCs), adhering to industry standards ensures reliability, safety, and performance. Two pivotal standards in the FPC industry are UL 796 and IPC 6013. While both standards guide the design and production of printed circuit boards, their focuses and requirements differ significantly, impacting how...
Part #2: Functional Testing of Complete Circuit AssembliesIntroductionIn the second part of our series, we delve into the verification processes for circuitry once components are mounted. This phase is crucial for assessing the functional integration and overall performance of our PCBs and FPCs. Through a series of targeted tests, we...
Welcome to our two-part blog series on Electrical Verification Protocols at PICA Manufacturing Solutions. Ensuring the quality and reliability of our printed circuit boards (PCBs) and flexible printed circuits (FPCs) is paramount. This series delves into our rigorous verification processes, starting from the preliminary testing of unpopulated circuit boards,...
In Part 1 of this series, we discussed the essential role of mechanical tooling in Flexible Printed Circuit (FPC) manufacturing. Now, in Part 2, we will explore the use of fixtures, artwork films, CNC machining, vision punching, screen printing, and electrical testing to ensure precision and quality at every stage...
Design for Manufacturability (DFM) is a proactive process integral to the PICA Way, ensuring a product design aligns with each step of the manufacturing process from the outset. This methodology is crucial in avoiding revisions due to manufacturing issues. At PICA Manufacturing Solutions, our DFM process focuses on reducing development...
Part 2: Comparing Panel Array vs. Singulated Carrier AssemblyIn the first part of this series, we explored the key considerations for choosing between panel array assembly and singulated flex circuit assembly on a carrier in Surface Mount Technology (SMT). Now, in Part 2, we will directly compare these two methods,...
At PICA Manufacturing Solutions, producing high-quality Flexible Printed Circuits (FPCs) involves a variety of specialized tooling and processes. This blog post, split into two parts, focuses first on the essential mechanical tooling required for FPC manufacturing. Understanding these tools and their functions is crucial for achieving the precision, efficiency, and...
In the continuation of our series on optimizing flexible circuit designs, we delve into additional critical aspects that ensure functionality and durability in challenging environments. PICA Manufacturing Solutions brings you expert insights into managing mechanical stresses and enhancing the robustness of your flexible circuits.Strain ReliefWhen integrating thick FR4 stiffeners, consider...
Flexible circuits are essential in today’s compact, lightweight devices—thanks to their ability to bend, twist, and conform to tight spaces. But designing them for reliability and performance takes more than just a flexible substrate. At PICA Manufacturing Solutions, we specialize in helping engineers navigate the unique challenges of flex design...
This blog is the first in a two-part series that delves into the critical factors you need to consider when deciding between panel arrays and singulated carriers for your project. In this first installment, we’ll explore the key considerations that can impact your choice and how they align with your...
When placing an order with PICA Manufacturing Solutions for bare Printed Circuit Boards (PCBs) or Flexible Printed Circuits (FPCs), having the correct documentation and files is crucial. This ensures smooth production, meets quality standards, and aligns with your specific requirements. This article outlines the mandatory and good-to-have documents...
Soldering is a critical process that involves joining electronic components to printed circuit boards (PCBs) using a metal alloy, known as solder. This process not only provides mechanical strength but also ensures reliable electrical connections.The metal alloy used for soldering varies based on the required properties such as melting...
Customer: A leading innovator in inkjet technology, our customer is renowned for their advanced and precise printheads. Serving various sectors within the industrial, commercial, and consumer printing industries, their commitment to continuous innovation and quality underscores their prominent role in the printing technology sector.Challenge: The customer required a Flexible...
This blog is an introduction to a white paper that contains additional information on surface finishes including: Immersion Silver or Tin, OSP (Organic Solderability Preservatives), HASL (Hot Air Solder Leveling), Carbon Ink, and Combination Finishes (e.g., Hard Gold/OSP, Soft Gold/OSP, Gold Immersion/OSP). Click the button below to request the full...
