We’re pleased to share that our white paper, The Essential Guide to PCB Via Protection: Strategies and Standards, has been featured in the 2026 PCB Magazine from PCB Directory.Publications like this help bring together valuable technical knowledge from across the PCB industry, and this edition does a great job of...
Electronics manufacturing is heading into 2026 under pressure from several directions at once. Rising metals costs, laminate and prepreg repricing, labor shifts in key manufacturing regions, foreign exchange movement, and tighter capacity tied to AI and data-center demand are all contributing to higher PCB,
At PICA Manufacturing Solutions, we believe the future of electronics is not built component by component, it is engineered as a fully integrated system.As products become smaller, more functional, and more design-driven, the traditional model of separating electrical, mechanical, and assembly processes across multiple suppliers is no longer efficient. It...
Electromagnetic interference (EMI) and radio frequency interference (RFI) can disrupt signal quality, create data errors, and reduce overall circuit reliability. As electronics become smaller, faster, and more densely packaged, shielding has become an increasingly important part of flex PCB design. This is especially true in products that...
Flexible circuits are often chosen for their ability to route signals through tight spaces while tolerating bending and movement. However, the connection points of a flex circuit can experience significant mechanical and electrical stress, especially in high-power or high-reliability applications.One solution used in advanced flex circuit assemblies...
A practical step-by-step method for choosing materials that hold up in bending, assembly, and real environmentsFlex material selection is a tradeoff exercise. The right stack-up is the one that meets the mechanical mission first, then satisfies electrical, thermal, environmental, and compliance constraints without creating cost or lead-time...
At PICA Manufacturing Solutions, we believe strong supply chains are built on relationships, not just processes. While we have a strong team across China and Southeast Asia, our leadership continues to travel regularly to meet the engineers, operators, and managers behind the work.These visits reinforce our Human-to-Human approach, strengthen trust,...
Copper has been the backbone of flexible printed circuits (FPCs) for decades, and for good reasons. While new materials and additive technologies are expanding the design toolbox, copper remains the benchmark conductor for traditional flexible circuits made using subtractive processes.Before exploring alternatives, it’s important to understand why...
Stiffener, EMI Shielding, Release liners, spacers, marking inks, thermally conductive adhesive films, and PSA selection guidance.When engineers talk about flex PCB materials, the focus is usually on the core stack-up: substrate film, copper, adhesives, and coverlay. But many reliability and assembly issues are driven...
Thermoplastic vs thermoset adhesives, adhesiveless constructions, and the process factors that drive delamination riskIn flex circuits, reliability is not determined by copper and substrate alone. A large share of real-world failures trace back to the bond line. Bond systems influence peel strength, bend durability, thermal survivability through...
PET vs PEN, LCP, PTFE/fluoropolymers, and specialty films like PEI/PEEK: when each wins, where each struggles, and what it means for manufacturingPolyimide is the baseline substrate for most flex circuits because it offers a strong mix of heat tolerance, mechanical durability, and manufacturability. But some flex designs have requirements...
MD&M West 2026 in Anaheim brought together medtech, automation, design/manufacturing, plastics, and packaging, so the biggest trend wasn’t one product. It was how fast devices are becoming smarter, smaller, and more integrated, with more pressure on reliability, speed-to-market, and manufacturability.
Tariffs have played a role in the U.S. economy since the nation’s founding. In the early days of the republic, tariffs were a primary source of government revenue and a way to protect domestic industries as they took shape. Over time, tariffs became a strategic policy tool, used to influence...
Las Vegas, January 2026 — CES 2026 once again confirmed that the pace of innovation in consumer tech, mobility, AI, and robotics isn’t slowing down. With over 4,000 exhibitors and thousands of breakthrough products on the show floor, this year’s CES put a spotlight on technologies that feel like...
Box build assembly—sometimes called systems integration—involves assembling a complete electronic product by combining a finished PCBA with wiring, connectors, mechanical components, enclosures, firmware loading, labeling, and final testing. While PCB assembly creates the electronic heart of a device, box build assembly transforms it into a fully integrated...
PCB design for medical electronics demands more than just electrical functionality. Devices must meet strict regulatory standards, operate reliably over long lifetimes or single-use cycles, withstand sterilization or biological exposure, and maintain performance under mechanical and environmental stress. Whether the application is a patch...
When evaluating a manufacturing company in Malaysia, most teams are focused on a few essentials: capability fit, reliable quality systems, a clean and well-controlled production environment, and the ability to scale from early prototypes to higher volumes without disruption. Malaysia’s growing electronics ecosystem offers strong advantages in cost, workforce readiness,...
As we step into 2026, we are celebrating the people who make PICA what it is from China, Malaysia, and Derry, New Hampshire, our teams are sharing New Year wishes in their own languages.Each message reflects the culture, traditions, and pride behind the work they do every day.Different locations. Different...
Protecting the copper circuitry on a flexible printed circuit (FPC) is essential to ensuring long-term reliability and performance. Two common protective approaches are Liquid Photoimageable (LPI) solder mask and Polyimide (PI) coverlay. While both serve to insulate and safeguard traces, they differ significantly in their material properties,...
