Printed Circuit Boards (PCBs) form the backbone of modern electronic devices, providing the physical platform for mounting and interconnecting electronic components. Among the essential elements in PCB design are vias—small holes that allow electrical connections between different layers of the board. Vias play a role in ensuring efficient routing...
Flux is a fundamental material in the electronics manufacturing process, particularly in the assembly of printed circuit boards (PCBs). It plays a crucial role in ensuring the reliability and functionality of electronic components by enabling high-quality solder joints. Its versatility and multifunctionality make it indispensable in the reflow...
PCB Carolina 2024 brought together industry leaders to explore advancements in PCB design and manufacturing. Joe DiPalermo, our Director of Engineering, delivered an insightful presentation on the latest techniques and considerations for designing and producing flexible and rigid-flex circuits.Joe DiPalermo, Director of Engineering at PICA, has been a cornerstone of...
Stencil design plays a critical role in ensuring the quality and reliability of printed circuit boards (PCBs). A well-designed stencil enables precise solder paste deposition, ensuring strong solder joints and high manufacturing yields. With over 30 years of experience and facilities in Derry, NH, and Kuala Lumpur, Malaysia, PICA...
Flexible Printed Circuits (FPCs) are essential components in modern electronics, enabling lightweight, compact, and high-performance designs. However, they come at a higher cost compared to traditional rigid PCBs. This is primarily due to the specialized materials and manufacturing processes required for flexibility and durability. Below, we break down...
Malaysia has emerged as a global hub for electronics manufacturing—thanks to its strategic location, skilled workforce, strong infrastructure, and supportive government policies. In 2019, PICA Manufacturing Solutions expanded into Malaysia, establishing a cutting-edge assembly facility to better serve our customers worldwide.Want to see why Malaysia is a smart choice for...
Flexible Printed Circuits (FPCs) are widely used due to their lightweight, flexible, and compact nature, making them ideal for applications requiring bending and folding. However, designing FPCs involves several critical considerations. Engineers should approach FPC design very differently from Printed Circuit Boards (PCBs). PICA Manufacturing Solutions has the...
As an important part of the electrical system, the performance of the wiring harness directly affects the reliability and safety of the equipment. In harsh environments, such as high temperature, low temperature, high humidity, high salt fog, and mechanical vibration, traditional wiring harness designs can deteriorate due to environmental...
In Part 1, we explored the challenges of manufacturing ultra-thin flexible circuits with a focus on the conductive layers, highlighting innovations like adhesiveless copper solutions, precision imaging, and additive technologies. These advancements address the critical need for high-performance conductors in ultra-thin applications.In this continuation, we shift our focus to the dielectric...
One of our key customers approached PICA with the challenge of manufacturing ultra-thin flexible circuits. A critical component of this technology is the conductor, typically made from copper. Traditional methods, such as copper cladding with adhesive layers, are insufficient for the thinner profiles demanded by our customer. To meet this...
In the world of flexible electronics, the shift from traditional flexible copper-clad laminates (FCCLs) to adhesiveless materials represents a significant leap forward. Flexible copper-clad laminates, which consist of copper foil bonded to a substrate using adhesive layers, have long been the backbone of flexible circuits. However, their reliance on...
When developing and manufacturing flexible printed circuits (FPCs), adhering to industry standards ensures reliability, safety, and performance. Two pivotal standards in the FPC industry are UL 796 and IPC 6013. While both standards guide the design and production of printed circuit boards, their focuses and requirements differ significantly, impacting...
Part #2: Functional Testing of Complete Circuit AssembliesIntroductionIn the second part of our series, we delve into the verification processes for circuitry once components are mounted. This phase is crucial for assessing the functional integration and overall performance of our PCBs and FPCs. Through a series of targeted tests, we...
Welcome to our two-part blog series on Electrical Verification Protocols at PICA Manufacturing Solutions. Ensuring the quality and reliability of our printed circuit boards (PCBs) and flexible printed circuits (FPCs) is paramount. This series delves into our rigorous verification processes, starting from the preliminary testing of unpopulated circuit boards,...
In the design of printed circuit boards (PCBs), controlling impedance is a crucial factor for ensuring optimal signal integrity, especially in high-frequency applications. Impedance mismatches can lead to signal reflections, data loss, and compromised performance, which makes it essential to consider various transmission line configurations and impedance types during...
PICA is excited to announce the transformation of our high-precision conformal coating capabilities. We have been integrating the MYC50 platform into our processes to meet the specific needs of our customers requiring advanced conformal coatings for printed circuit boards assembled at PICA. This system has significantly enhanced our...
In Part 1 of this series, we discussed the essential role of mechanical tooling in Flexible Printed Circuit (FPC) manufacturing. Now, in Part 2, we will explore the use of fixtures, artwork films, CNC machining, vision punching, screen printing, and electrical testing to ensure precision and quality at every stage...
Design for Manufacturability (DFM) is a proactive process integral to the PICA Way, ensuring a product design aligns with each step of the manufacturing process from the outset. This methodology is crucial in avoiding revisions due to manufacturing issues. At PICA Manufacturing Solutions, our DFM process focuses on reducing development...
Part 2: Comparing Panel Array vs. Singulated Carrier AssemblyIn the first part of this series, we explored the key considerations for choosing between panel array assembly and singulated flex circuit assembly on a carrier in Surface Mount Technology (SMT). Now, in Part 2, we will directly compare these two methods,...
PICA is excited to announce the transformation of our high-precision conformal coating capabilities. We have been integrating the MYC50 platform into our processes to meet the specific needs of our customers requiring advanced conformal coatings for printed circuit boards assembled at PICA. This system has significantly enhanced our ability to...
