PICA white paper
Understanding PCB Via Holes
Through-Holes, Blind Vias, Buried Vias, Microvias, and More
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PDFVia design and fabrication guide
Connect every layer reliably
Choose the right via forevery PCB connection.
This engineering guide explains how through-holes, blind vias, buried vias, microvias, and via-in-pad structures support routing density, thermal management, and dependable multilayer connectivity.
- 01Compare essential via types
Understand where through-holes, blind vias, buried vias, microvias, and via-in-pad are used.
- 02Plan the fabrication process
Learn how laser drilling, electroplating, and via filling enable reliable multilayer connections.
- 03Optimize electrical and thermal performance
Apply spacing, signal-integrity, and thermal guidance for HDI, RF, and fine-pitch BGA layouts.
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