Understanding PCB Via Holes: Through-Holes, Blind Vias, Buried Vias, and More White Paper Download Request
Gain a comprehensive understanding of PCB via holes with this expert guide from PICA Manufacturing Solutions, exploring key types like through-holes, blind vias, buried vias, microvias, and via-in-pad (VIP). Learn how these vital interconnects support signal routing, thermal management, and compact PCB layouts in high-performance electronics. Whether designing HDI boards, RF circuits, or fine-pitch BGA layouts, this white paper outlines the manufacturing techniques—such as laser drilling, electroplating, and via filling—that enable reliable multilayer connectivity. Discover best practices for via spacing, signal integrity, and thermal performance to ensure your PCB designs meet the demands of today’s high-speed, miniaturized electronics.
