Understanding PCB Via Holes: Through-Holes, Blind Vias, Buried Vias, & More

Understanding PCB Via Holes: Through-Holes, Blind Vias, Buried Vias, and More White Paper Download Request

Understanding PCB Via Holes: Through-Holes, Blind Vias, Buried Vias, & More

Gain a comprehensive understanding of PCB via holes with this expert guide from PICA Manufacturing Solutions, exploring key types like through-holes, blind vias, buried vias, microvias, and via-in-pad (VIP). Learn how these vital interconnects support signal routing, thermal management, and compact PCB layouts in high-performance electronics. Whether designing HDI boards, RF circuits, or fine-pitch BGA layouts, this white paper outlines the manufacturing techniques—such as laser drilling, electroplating, and via filling—that enable reliable multilayer connectivity. Discover best practices for via spacing, signal integrity, and thermal performance to ensure your PCB designs meet the demands of today’s high-speed, miniaturized electronics.

An infographic detailing various PCB via protection methods, including filled via cap plating, coverlay tented via, and copper-filled micro-via, demonstrating PICA Manufacturing Solutions' commitment to ensuring the reliability and longevity of multilayer PCBs. This image is featured in PICA Manufacturing Solutions' blog post on via protection, discussing the importance of blind and buried microvias for creating complex electrical connections in compact PCB designs. The post emphasizes the significance of via protection, strategies, and standards in printed circuit boards (PCBs).

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