Optimized Flexible PCB Materials for High-Performance FPCs

Ultra-Thin Flexible Printed Circuits

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Ultra-Thin Flexible Printed Circuits (FPC) for Lightweight, Compact Electronics

Flexible Circuit Boards Engineered for Minimal Thickness, Maximum Performance

Ultra-thin flexible printed circuits let you push into ultra-compact form factors where every gram and micron count. PICA delivers precision FPCs with ultra-thin materials and advanced manufacturing for wearables, medical devices, foldables and space-constrained applications.

Why Choose Ultra-Thin Flexible Printed Circuits?

Minimal Thickness & Weight – Ultra-thin substrates allow board thicknesses down to ~0.20 mm or less, enabling slimmer, lighter assemblies.
Space-Constrained Packaging – Ideal for wearable tech, medical implants, foldable electronics and any application where height is restricted or comfort is key.
High Flexibility & Conformability – Ultra thin construction enables tight bend radii, fold‐to‐install, even wraparound designs.
Precision Manufacturing & Materials – Achieved through adhesive-less polyimide stacks, laser-direct imaging, and specialized handling for ultra-thin panels.
Optimized for Miniaturization – Supports fine-line routing, small pad designs, low mass interconnects for next-gen devices.

Ultra-Thin FPC Capabilities – Highlights

Ultra‐thin constructions: e.g., 3 µm copper on 25 µm polyimide; 18 µm copper on 12.5 µm polyimide; finished thickness as low as 0.20 mm ± 0.08 mm.
Adhesiveless / thermoplastic polyimide (TPI) material sets for improved durability and precision.
Laser Direct Imaging (LDI) and fine‐line etching for ultra-thin substrate processing and trace precision.
Specialized process controls for ultra-thin panel handling: thickness/flatness, scratch resistance, warpage mitigation.
Design guidance: low mass, low profile circuits for wearables, sensors, compact modules, with engineering collaboration for manufacturability and reliability.

Global Design & Manufacturing Support

PICA’s engineering team works closely with your design team—from concept to volume production—to define ultra-thin stack-ups, material selection, bend features, flatness tolerances and assembly readiness. Early collaboration ensures manufacturability, reliability and efficient production of ultra-thin flex circuits for your application.

Benefits of Ultra-Thin Flexible Circuits

Ultra-Low Profile & Lightweight
These circuits enable form-factors previously impossible—devices are thinner, lighter and more comfortable without sacrificing performance.

Enhanced Flexibility & Design Freedom
Ultra-thin construction supports tight bends, non-standard layouts and space-optimized routing, perfect for wearables, foldables and compact modules.

Miniaturization Without Compromise
By reducing the board thickness and weight, you free up space for more features or smaller enclosures—accelerating innovation in next-gen electronics.

Reduced Mass & Mechanical Stress
Less material means lower inertia during motion, less stress on solder joints and better overall durability in dynamic or wearable systems.

Streamlined Manufacturing & Supply Chain
With PICA’s mature processes for ultra-thin flex manufacturing, you benefit from production-ready reliability, yield assurance and scalability from prototype to volume.

Markets We Serve with Ultra-Thin Flexible Circuits

Wearables & Consumer Devices
Smart watches, fitness bands, AR/VR headsets and ultra-portable devices rely on ultra-thin flex circuits to meet form-factor and comfort demands.

Medical Devices
Implantable electronics, sensor patches, minimally-invasive devices and portable diagnostic modules require ultra-thin, reliable interconnects for patient comfort and performance.

Communications & Mobile Electronics
Foldable smartphones, ultra-thin modules, high-density antennas and wear-on-body devices require flexible, ultra-thin interconnects to meet size, weight and performance goals.

Industrial, Aerospace & Defense
In mission-critical, weight-sensitive applications (drones, satellites, space wearables), ultra-thin flex circuits allow lighter assemblies and higher integration density.

Sensor & IoT Modules
Miniature sensors, body-worn systems, barcode scanners, smart cards and interconnected modules benefit from ultra-thin circuits with minimal mass and footprint.

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