Expertise

Hello, world! CONTACT AN ENGINEER Dynamic Flex Circuits for High-Cycle Bending Flexible Circuits Designed for Continuous Motion Dynamic flex printed circuits are engineered to bend repeatedly—thousands to millions of times—without cracking or drifting out of spec. PICA’s design-driven team optimizes copper grain direction, bend radii, layout, and material stacks to deliver stable, repeatable performance throughout… READ MORE

Hello, world! CONTACT AN ENGINEER Extra-Long Flex Printed Circuits (FPC) for High-Reach Applications Flexible Printed Circuits Engineered for Length, Precision & High-Performance When your design demands a flex circuit that spans meters in length instead of inches, standard FPC suppliers won’t cut it. PICA specializes in extra-long flexible printed circuits — up to 3,000 mm… READ MORE

Ultra-Thin Flexible Printed Circuits (FPC) for Lightweight, Compact Electronics Flexible Circuit Boards Engineered for Minimal Thickness, Maximum Performance Ultra-thin flexible printed circuits let you push into ultra-compact form factors where every gram and micron count. PICA delivers precision FPCs with ultra-thin materials and advanced manufacturing for wearables, medical devices, foldables and space-constrained applications. Why Choose… READ MORE

Roll-to-Roll (R2R) Process for Flexible Printed Circuits Continuous, High-Throughput Flex Circuit Manufacturing for High-Volume Applications The roll-to-roll (R2R) process enables flexible circuits to be manufactured in a continuous web format, delivering outstanding throughput, quality and cost-efficiency. PICA’s R2R technology supports long-length, high-volume production of flexible PCBs, wearables, sensor ribbons, and printed electronics with tight tolerances… READ MORE

Fineline & HDI Printed Circuits Ultra-Fine-Pitch, High-Density Circuits for Compact, High-Performance Electronics Fineline and HDI (High Density Interconnect) printed circuit boards are engineered to support miniaturization, high-speed signals, and dense component integration. PICA’s advanced PCB and flex manufacturing enables fine-line trace widths, laser micro-vias, ultra-thin dielectrics, and multi-build-up stack-ups that meet the demands of today’s… READ MORE

Blind & Buried Microvias for High-Density Interconnects Advanced Via Structures for Compact, High-Performance PCB Design Blind, buried, and laser-drilled microvia architectures enable ultra-dense HDI routing, allowing shorter signal paths, minimized vias stubs, cleaner impedance control, and higher I/O breakout under fine-pitch BGAs. At PICA, our HDI build-up processes combine laser drilling, copper filling, sequential lamination,… READ MORE

IC Substrate & Carrier Solutions High-Density Chip-Carrier Architectures for Advanced Packaging IC substrate carriers bridge the gap between bare die and printed-circuit board, delivering ultra-fine routing, high-reliability materials and precision micro-via architectures. At PICA, we provide IC-substrate carriers designed for compact packaging, thermal stress mitigation and high-frequency interconnects. Why Choose IC Substrate & Carrier Solutions?… READ MORE

EMI and Electromagnetic Interference Shielding Solutions Protecting Electronics from Noise, Interference and Compliance Risk Electromagnetic interference is a growing concern in today’s dense circuitry and high-speed devices. PICA provides comprehensive EMI shielding solutions that integrate directly into board architecture. Our approach combines shielding materials, stack-up engineering, via-fence strategies, grounding planes, conductive coatings, and modeling support… READ MORE

Heavy Copper Printed Circuits High Current, High-Reliability PCBs Built for Power & Performance Heavy-copper PCBs use significantly thicker copper layers to handle high currents, improve thermal dissipation, reduce impedance, and deliver enhanced mechanical toughness in demanding environments. PICA’s heavy-copper capability supports power-electronics, automotive, industrial, and defense applications that demand more than a standard PCB. Why… READ MORE

Impedance Control for High-Speed PCB & Flex Designs Maintain Signal Integrity from First Trace to Final Board In high-speed and high-frequency electronics, uncontrolled trace impedance can lead to signal reflections, data errors and compliance failures. PICA’s impedance control capabilities combine impedance modeling, stack-up design and manufacturing process control so you get accurate, repeatable impedance across… READ MORE

Click here or call us at 1.800.344.4685 to request our x-ray on-site inspection services or to speak with one of our technician specialists for more information about our capabilities and reoccurring customer pricing. Request Service By strategically investing in X-ray inspection technology, PICA has not only opened doors of opportunity for itself but also for a… READ MORE

Thermal Management Solutions for PCBs & Flex Circuits Keep Your Electronics Cool, Compact & Reliable Effective thermal management is no longer optional — it’s essential. At PICA, we offer engineered thermal solutions including metal-clad boards, copper inlays, thermal via arrays and embedded heat-spreading options to help your designs maintain safe operating temperatures, deliver consistent performance… READ MORE