At PICA, we offer advanced design of Fineline Flex Printed Circuit Board (PCB) using state-of-the-art technology. Below are our capabilities in Technology – Laser Direct Imaging and LDI Advantages. For more information on Line Width & Spacing, and PICA LDI Process Capabilities, please fill out the form below to request the full PDF capabilities download or click the button to contact a PICA engineer.
Technology - Laser Direct Imaging
LDI systems “imprint” the printed circuit board (PCB) pattern directly on blank panels, without the use of a photo tool, thus bypassing the image-related stages associated with traditional contact printing, while providing an superior imaging method.
LDI Advantages
- Fine Line Spacing Capability
- Improve dimensional stability, and high positional accuracy of the circuit platform
- Improve Production Yield
- Short Production Cycle
Traditional Process
LDI Process
| Cu Thickness | Minimum Line & Spacing After CAD Compensation |
|---|---|
| 1/3oz | 1.5mil |
| 1/2oz | 2mil |
| 1oz | 2.5mil |
| 2oz | 5mil |
| Exposure Wavelength | Laser (355nm) |
| Usage | Inner/Outer |
| The method of contraposition | UV-marker & CCD |
| Throughput | 200 Hits/HR |
| Substrate Size | max: 609*812mm (24"x32") |
| Substrate Thickness | 0.025 - 5mm (0.001" - 0.2") |
| Minimum Line & Spacing | 38μm (1.5mil) @ 1/3oz. Cu* |
| Positioning Accuracy (FTG) | 12μm (0.45mil) |
| Side to Side Registration | 24μm (0.95mil) |
| Resolution | 6.5μm (0.25mil) |
