Ultra-Thin Flexible Printed Circuits

PICA Manufacturing Solutions delivers ultra-thin Flexible Printed Circuit Boards (FPCBs) for industries where space and weight are critical, including wearable technology, medical devices, telecommunications, and aerospace.

Key Capabilities

We manufacture ultra-thin FPCBs with:

• 3 µm copper on 25 µm polyimide
• 18 µm copper on 12.5 µm polyimide
• Thickness as low as 0.20 mm ± 0.08 mm

Advanced Manufacturing Solutions

To achieve reliable, high-performance circuits, PICA uses adhesiveless materials featuring thermoplastic polyimide (TPI). This approach enhances durability, thermal resistance, and dimensional precision, ensuring circuits perform in demanding environments.

For precise circuit patterns, we utilize Laser Direct Imaging (LDI), which delivers the fine-line accuracy needed for modern designs. During copper etching, specialized systems protect ultra-thin panels from scratches and damage, maintaining quality throughout production.

PICA also explores additive technologies, such as inkjet-printed conductive inks, to create ultra-thin circuits without traditional etching. This method reduces material waste, improves efficiency, and supports continuous production.

Why PICA?

With advanced materials, precision processes, and innovative technologies, PICA delivers ultra-thin flexible circuits that meet the highest standards for quality, reliability, and performance.