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For engineers balancing performance, flexibility, and cost, Flat Flexible Cables (FFC) remain one of the most efficient interconnect solutions in electronics today. Their simple structure, adaptability, and low manufacturing cost make them ideal for countless applications—from consumer electronics to industrial controls, smart home, industrial equipment, vehicles, electric...
In PCB manufacturing, solder mask isn’t just about making a board look green—it’s a functional layer that protects copper traces, prevents solder bridging, and improves overall assembly yield. But not all solder masks are created equal. From rigid PCBs to flexible circuits and high-density designs, the type of solder mask used—and...
Printed Circuit Board (PCB) manufacturing involves precise processes, not just in design and component assembly but also in how the final boards are separated from their manufacturing panels. At PICA Manufacturing Solutions, we use various depaneling techniques to ensure efficiency, accuracy, and cost-effectiveness. The three primary methods—V-scoring, routing, and die...
Conductive Inks and Their Role in Flexible and Printed ElectronicsAs electronics continue to evolve beyond rigid, boxy enclosures, the materials and processes used to build them are changing too. Conductive inks are a key enabler of this shift, offering engineers the ability to print circuitry directly onto thin, flexible, and...
Selecting the right base material for a PCB is never a simple choice. The properties of the substrate affect everything—from thermal stability to dielectric performance, mechanical strength, and manufacturing compatibility. Four standard materials dominate PCB fabrication: FR-2, FR-4, CEM-1, and CEM-3. While all of them provide insulation and structural integrity,...
FPC (Flexible Printed Circuit) manufacturing has evolved significantly, with both panel-based and roll-to-roll (RTR) processing methods widely used. Each method has its own advantages, limitations, and specific applications, particularly when manufacturing extra-long flex circuits. Below is a comparison highlighting capabilities specifically relevant to producing extra-long FPCs depending on application needs,...
Whether you're designing for a high-durability dynamic application or a compact static installation, every detail matters—from copper type and thickness to stackup design and layer placement. These design elements directly influence the PCB’s flexibility, durability, and long-term performance. For electrical and mechanical engineers alike, mastering these principles is key to...
At PICA, we know that the performance and reliability of printed circuit boards (PCBs) depend heavily on their cleanliness. That’s why our Kuala Lumpur facility is equipped with advanced ultrasonic cleaning technology, ensuring every PCB meets the highest quality standards.What Is Ultrasonic Cleaning?Ultrasonic cleaning uses high-frequency sound waves,...
Printed Circuit Boards (PCBs) form the backbone of modern electronic devices, providing the physical platform for mounting and interconnecting electronic components. Among the essential elements in PCB design are vias—small holes that allow electrical connections between different layers of the board. Vias play a role in ensuring efficient routing of...
Flux is a fundamental material in the electronics manufacturing process, particularly in the assembly of printed circuit boards (PCBs). It plays a crucial role in ensuring the reliability and functionality of electronic components by enabling high-quality solder joints. Its versatility and multifunctionality make it indispensable in the reflow...
PCB Carolina 2024 brought together industry leaders to explore advancements in PCB design and manufacturing. Joe DiPalermo, our Director of Engineering, delivered an insightful presentation on the latest techniques and considerations for designing and producing flexible and rigid-flex circuits.Joe DiPalermo, Director of Engineering at PICA, has been a cornerstone of...
When developing and manufacturing flexible printed circuits (FPCs), adhering to industry standards ensures reliability, safety, and performance. Two pivotal standards in the FPC industry are UL 796 and IPC 6013. While both standards guide the design and production of printed circuit boards, their focuses and requirements differ significantly, impacting how...
When placing an order with PICA Manufacturing Solutions for bare Printed Circuit Boards (PCBs) or Flexible Printed Circuits (FPCs), having the correct documentation and files is crucial. This ensures smooth production, meets quality standards, and aligns with your specific requirements. This article outlines the mandatory and good-to-have documents and files...
Soldering is a critical process that involves joining electronic components to printed circuit boards (PCBs) using a metal alloy, known as solder. This process not only provides mechanical strength but also ensures reliable electrical connections.The metal alloy used for soldering varies based on the required properties such as melting...
This blog is the introduction to a white paper called Introduction to High Frequency Signal Insertion Loss. Click the button below to request the full white paper. The white paper has additional sections on measures to improve dielectric loss, how conductor loss occurs, measures to improve conductor loss, and insertion...
This blog is an introduction to a white paper that contains additional information on surface finishes including: Immersion Silver or Tin, OSP (Organic Solderability Preservatives), HASL (Hot Air Solder Leveling), Carbon Ink, and Combination Finishes (e.g., Hard Gold/OSP, Soft Gold/OSP, Gold Immersion/OSP). Click the button below to request the full...
This blog is an introduction to a larger white paper that features 7 different via protection types. Download the full white paper to continue reading The Essential Guide to PCB Via Protection: Strategies and Standards. In the full white paper you'll learn about Filled Via Cap Plating, Coverlay Tented Via, and Copper...
The general scope of this article is to discuss methods for treating and characterizing the surface of Kapton, a polyimide material, to ensure effective interfacial bonding.The surface of the polyimide in Flexible Printed Circuits (FPCs) undergoes various processing steps during manufacturing, which can negatively impact its surface properties. To address...
Ball Grid Arrays (BGAs) are crucial components widely employed in the electronic manufacturing industry owing to their compact size. However, due to their high density, detecting defects through visual inspection alone can be challenging, while destructive testing poses the risk of compromising voiding defects.X-ray inspections offer a non-destructive testing solution...
Why Do Flex PCB Delaminate in High Temperature Exposure?Flex Printed Circuits (FPCs) face a common issue during soldering reflow: delamination. This problem, primarily caused by rapid temperature changes, can severely impact the circuit's integrity and functionality. The root cause is often moisture absorption, which can occur in various parts...
