Rigid Flex PCB

Understanding Copper Limits & Bend Radius in Flex PCBs

Whether you're designing for a high-durability dynamic application or a compact static installation, every detail matters—from copper type and thickness to stackup design and layer placement. These design elements directly influence the PCB’s flexibility, durability, and long-term performance. For electrical and mechanical engineers alike, mastering these principles is key to...

Precision Cleaning with PICA: Ultrasonic PCB Cleaning at Our Kuala Lumpur Facility

At PICA, we know that the performance and reliability of printed circuit boards (PCBs) depend heavily on their cleanliness. That’s why our Kuala Lumpur facility is equipped with advanced ultrasonic cleaning technology, ensuring every PCB meets the highest quality standards.What Is Ultrasonic Cleaning?Ultrasonic cleaning uses high-frequency sound waves,...

Understanding PCB Via Holes: Through-Holes, Blind Vias, Buried Vias, & More

Printed Circuit Boards (PCBs) form the backbone of modern electronic devices, providing the physical platform for mounting and interconnecting electronic components. Among the essential elements in PCB design are vias—small holes that allow electrical connections between different layers of the board. Vias play a role in ensuring efficient routing of...

Understanding the Multi-Purpose Role of Flux in PCB Assembly

Flux is a fundamental material in the electronics manufacturing process, particularly in the assembly of printed circuit boards (PCBs). It plays a crucial role in ensuring the reliability and functionality of electronic components by enabling high-quality solder joints. Its versatility and multifunctionality make it indispensable in the reflow...

Driving Innovation in PCB Manufacturing: Insights from PCB Carolina 2024

PCB Carolina 2024 brought together industry leaders to explore advancements in PCB design and manufacturing. Joe DiPalermo, our Director of Engineering, delivered an insightful presentation on the latest techniques and considerations for designing and producing flexible and rigid-flex circuits.Joe DiPalermo, Director of Engineering at PICA, has been a cornerstone of...

Compliance: Ensuring Safety and Performance in Flexible Printed Circuit Manufacturing

When developing and manufacturing flexible printed circuits (FPCs), adhering to industry standards ensures reliability, safety, and performance. Two pivotal standards in the FPC industry are UL 796 and IPC 6013. While both standards guide the design and production of printed circuit boards, their focuses and requirements differ significantly, impacting how...

Essential Documentation for Manufacturing Bare PCBs and FPCs

When placing an order with PICA Manufacturing Solutions for bare Printed Circuit Boards (PCBs) or Flexible Printed Circuits (FPCs), having the correct documentation and files is crucial. This ensures smooth production, meets quality standards, and aligns with your specific requirements. This article outlines the mandatory and good-to-have documents and files...

High-Frequency Signal Insertion Loss

This blog is the introduction to a white paper called Introduction to High Frequency Signal Insertion Loss. Click the button below to request the full white paper. The white paper has additional sections on measures to improve dielectric loss, how conductor loss occurs, measures to improve conductor loss, and insertion...

Advanced Surface Finishes for Enhanced PCB Performance

This blog is an introduction to a white paper that contains additional information on surface finishes including: Immersion Silver or Tin,  OSP (Organic Solderability Preservatives), HASL (Hot Air Solder Leveling), Carbon Ink, and Combination Finishes (e.g., Hard Gold/OSP, Soft Gold/OSP, Gold Immersion/OSP). Click the button below to request the full...

Enhancing Polyimide Surface Properties for Superior Bonding in Flexible Printed Circuits

The general scope of this article is to discuss methods for treating and characterizing the surface of Kapton, a polyimide material, to ensure effective interfacial bonding.The surface of the polyimide in Flexible Printed Circuits (FPCs) undergoes various processing steps during manufacturing, which can negatively impact its surface properties. To address...

4 factors that can cause voiding in Ball Grid Arrays (BGA)

Ball Grid Arrays (BGAs) are crucial components widely employed in the electronic manufacturing industry owing to their compact size. However, due to their high density, detecting defects through visual inspection alone can be challenging, while destructive testing poses the risk of compromising voiding defects. X-ray inspections offer a non-destructive testing solution...

Preventing the Delamination of Your Flex Circuitry in the Soldering Reflow Process

Why Do Flex PCB Delaminate in High Temperature Exposure?Flex Printed Circuits (FPCs) face a common issue during soldering reflow: delamination. This problem, primarily caused by rapid temperature changes, can severely impact the circuit's integrity and functionality. The root cause is often moisture absorption, which can occur in various parts...

Case Study: Innovating Medical Healthcare Technology with Rigid Flex PCB Design

Customer Overview: The customer in this case study is a leading company in the healthcare technology sector, known for its groundbreaking work in developing cutting-edge imaging technology. As an industry leader, they are constantly seeking to enhance the performance and reliability of their equipment to meet the rigorous demands of...

The Invisible Link: Understanding Anisotropic Conductive Adhesives

Anisotropic Conductive Film (ACF) represents a significant advancement in the realm of electronic packaging technology. Serving as a crucial interconnect material, ACF stands out for its unique combination of attributes. It acts as a transparent polymeric connector material, endowed with the triple characteristics of adhesion, conductivity, and insulation. This makes...

Flexible Printed Circuits: PICA’s Expertise in Material Selection

Flexible Printed Circuits (FPC) are revolutionizing the electronics industry with their unique combination of flexibility, reliability, and lightweight construction. At the heart of these circuits lies their base material, typically polyimide (PI) or polyester (PET) films. These materials are selected for their excellent properties, including high density, thinness, and...