When developing and manufacturing flexible printed circuits (FPCs), adhering to industry standards ensures reliability, safety, and performance. Two pivotal standards in the FPC industry are UL 796 and IPC 6013. While both standards guide the design and production of printed circuit boards, their focuses and requirements differ significantly, impacting how...
When placing an order with PICA Manufacturing Solutions for bare Printed Circuit Boards (PCBs) or Flexible Printed Circuits (FPCs), having the correct documentation and files is crucial. This ensures smooth production, meets quality standards, and aligns with your specific requirements. This article outlines the mandatory and good-to-have documents and files...
Soldering is a critical process that involves joining electronic components to printed circuit boards (PCBs) using a metal alloy, known as solder. This process not only provides mechanical strength but also ensures reliable electrical connections.The metal alloy used for soldering varies based on the required properties such as melting point,...
This blog is the introduction to a white paper called Introduction to High Frequency Signal Insertion Loss. Click the button below to request the full white paper. The white paper has additional sections on measures to improve dielectric loss, how conductor loss occurs, measures to improve conductor loss, and insertion...
This blog is an introduction to a white paper that contains additional information on surface finishes including: Immersion Silver or Tin, OSP (Organic Solderability Preservatives), HASL (Hot Air Solder Leveling), Carbon Ink, and Combination Finishes (e.g., Hard Gold/OSP, Soft Gold/OSP, Gold Immersion/OSP). Click the button below to request the full...
This blog is an introduction to a larger white paper that features 7 different via protection types. Download the full white paper to continue reading The Essential Guide to PCB Via Protection: Strategies and Standards. In the full white paper you'll learn about Filled Via Cap Plating, Coverlay Tented Via, and Copper...
The general scope of this article is to discuss methods for treating and characterizing the surface of Kapton, a polyimide material, to ensure effective interfacial bonding.The surface of the polyimide in Flexible Printed Circuits (FPCs) undergoes various processing steps during manufacturing, which can negatively impact its surface properties. To address...
Ball Grid Arrays (BGAs) are crucial components widely employed in the electronic manufacturing industry owing to their compact size. However, due to their high density, detecting defects through visual inspection alone can be challenging, while destructive testing poses the risk of compromising voiding defects. X-ray inspections offer a non-destructive testing solution...
Why Do Flex PCB Delaminate in High Temperature Exposure?Flex Printed Circuits (FPCs) face a common issue during soldering reflow: delamination. This problem, primarily caused by rapid temperature changes, can severely impact the circuit's integrity and functionality. The root cause is often moisture absorption, which can occur in various parts of...
Customer Overview: The customer in this case study is a leading company in the healthcare technology sector, known for its groundbreaking work in developing cutting-edge imaging technology. As an industry leader, they are constantly seeking to enhance the performance and reliability of their equipment to meet the rigorous demands of...
Anisotropic Conductive Film (ACF) represents a significant advancement in the realm of electronic packaging technology. Serving as a crucial interconnect material, ACF stands out for its unique combination of attributes. It acts as a transparent polymeric connector material, endowed with the triple characteristics of adhesion, conductivity, and insulation. This makes...
Flexible Printed Circuits (FPC) are revolutionizing the electronics industry with their unique combination of flexibility, reliability, and lightweight construction. At the heart of these circuits lies their base material, typically polyimide (PI) or polyester (PET) films. These materials are selected for their excellent properties, including high density, thinness, and the...
A 6-Layer ELIC (Every Layer Inter-connect) Rigid Flex Printed Circuit Board / Rigid Flex PCB is an advanced and highly specialized printed circuit board technology designed to meet the ever-increasing demand for smaller and more densely packed electronic devices. It plays a crucial role in enabling the integration of multiple...
