When developing and manufacturing flexible printed circuits (FPCs), adhering to industry standards ensures reliability, safety, and performance. Two pivotal standards in the FPC industry are UL 796 and IPC 6013. While both standards guide the design and production of printed circuit boards, their focuses and requirements differ significantly, impacting how...
Part #2: Functional Testing of Complete Circuit AssembliesIntroductionIn the second part of our series, we delve into the verification processes for circuitry once components are mounted. This phase is crucial for assessing the functional integration and overall performance of our PCBs and FPCs. Through a series of targeted tests, we...
In the design of printed circuit boards (PCBs), controlling impedance is a crucial factor for ensuring optimal signal integrity, especially in high-frequency applications. Impedance mismatches can lead to signal reflections, data loss, and compromised performance, which makes it essential to consider various transmission line configurations and impedance types during the...
PICA is excited to announce the transformation of our high-precision conformal coating capabilities. We have been integrating the MYC50 platform into our processes to meet the specific needs of our customers requiring advanced conformal coatings for printed circuit boards assembled at PICA. This system has significantly enhanced our ability to...
In Part 1 of this series, we discussed the essential role of mechanical tooling in Flexible Printed Circuit (FPC) manufacturing. Now, in Part 2, we will explore the use of fixtures, artwork films, CNC machining, vision punching, screen printing, and electrical testing to ensure precision and quality at every stage of production. Fixtures...
Design for Manufacturability (DFM) is a proactive process integral to the PICA Way, ensuring a product design aligns with each step of the manufacturing process from the outset. This methodology is crucial in avoiding revisions due to manufacturing issues. At PICA Manufacturing Solutions, our DFM process focuses on reducing development...
This blog is the first in a two-part series that delves into the critical factors you need to consider when deciding between panel arrays and singulated carriers for your project. In this first installment, we’ll explore the key considerations that can impact your choice and how they align with your...
At PICA Manufacturing Solutions, we occasionally receive printed circuit boards (PCBs) and/or components consigned by our customers for their projects. To ensure we can deliver the highest quality service and products, we recommend that customers follow specific guidelines when consigning materials to us. These guidelines are designed to enhance our...
When placing an order with PICA Manufacturing Solutions for bare Printed Circuit Boards (PCBs) or Flexible Printed Circuits (FPCs), having the correct documentation and files is crucial. This ensures smooth production, meets quality standards, and aligns with your specific requirements. This article outlines the mandatory and good-to-have documents and files...
When ordering component assembly for your Printed Circuit Boards (PCBs) and Flexible Printed Circuits (FPCs), it's important to provide the right documentation and data files to ensure accurate and efficient assembly. Below, we outline the mandatory files and information needed, as well as additional items that are good to have...
Soldering is a critical process that involves joining electronic components to printed circuit boards (PCBs) using a metal alloy, known as solder. This process not only provides mechanical strength but also ensures reliable electrical connections.The metal alloy used for soldering varies based on the required properties such as melting point,...
This blog is the introduction to a white paper called Introduction to High Frequency Signal Insertion Loss. Click the button below to request the full white paper. The white paper has additional sections on measures to improve dielectric loss, how conductor loss occurs, measures to improve conductor loss, and insertion...
In today's digital age, many companies rely solely on online transactions, often without giving you the chance to speak to a human. At PICA, we are committed to a personalized, human-to-human approach. No automated phone menus or AI robots asking endless questions before you reach a human being. Instead, when...
This blog is an introduction to a white paper that contains additional information on surface finishes including: Immersion Silver or Tin, OSP (Organic Solderability Preservatives), HASL (Hot Air Solder Leveling), Carbon Ink, and Combination Finishes (e.g., Hard Gold/OSP, Soft Gold/OSP, Gold Immersion/OSP). Click the button below to request the full...
PCBAs (Printed Circuit Board Assemblies) and FPCAs (Flexible Printed Circuit Assemblies) are both integral to the functioning of electronic devices, yet they cater to distinct needs due to their differing properties and construction. This blog provides a focused comparison to elucidate their unique applications and manufacturing nuances, enhancing your understanding...
Ball Grid Arrays (BGAs) are crucial components widely employed in the electronic manufacturing industry owing to their compact size. However, due to their high density, detecting defects through visual inspection alone can be challenging, while destructive testing poses the risk of compromising voiding defects. X-ray inspections offer a non-destructive testing solution...
While mass soldering processes dominate soldering applications, hand soldering remains critical in electronics manufacturing. Existing processes (e.g. convection oven reflow, vapor phase, wave flow, selective wave flow, etc.) are very efficient and offer high volume capacity but may not always be suitable. One of these special situations is when the...
