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The production of Printed Circuit Boards (PCBs) and Flexible Printed Circuits (FPCs) encompasses chemical, mechanical, and printing processes that often result in the accumulation of unwanted residues on their surfaces. The presence of even minuscule contaminants can significantly affect the functionality, performance, and reliability of the final products. Recognizing the...
Ball Grid Arrays (BGAs) are crucial components widely employed in the electronic manufacturing industry owing to their compact size. However, due to their high density, detecting defects through visual inspection alone can be challenging, while destructive testing poses the risk of compromising voiding defects.X-ray inspections offer a non-destructive testing solution...
Why Do Flex PCB Delaminate in High Temperature Exposure?Flex Printed Circuits (FPCs) face a common issue during soldering reflow: delamination. This problem, primarily caused by rapid temperature changes, can severely impact the circuit's integrity and functionality. The root cause is often moisture absorption, which can occur in various parts...
The Customer: A renowned multinational company, well known for its pioneering work in imaging and photography. They have developed a cutting-edge inkjet printing system that is highly regarded for its precision, reliability, and versatility in various applications including graphic arts, electronics, and material deposition. The Challenge: To address the need for...
Customer Overview: The customer in this case study is a leading company in the healthcare technology sector, known for its groundbreaking work in developing cutting-edge imaging technology. As an industry leader, they are constantly seeking to enhance the performance and reliability of their equipment to meet the rigorous demands of...
Anisotropic Conductive Film (ACF) represents a significant advancement in the realm of electronic packaging technology. Serving as a crucial interconnect material, ACF stands out for its unique combination of attributes. It acts as a transparent polymeric connector material, endowed with the triple characteristics of adhesion, conductivity, and insulation. This makes...
Flexible Printed Circuits (FPC) are revolutionizing the electronics industry with their unique combination of flexibility, reliability, and lightweight construction. At the heart of these circuits lies their base material, typically polyimide (PI) or polyester (PET) films. These materials are selected for their excellent properties, including high density, thinness, and...
Ceramic substrate PCBs (Printed Circuit Boards) represent a significant advancement in circuit board technology, especially when compared to traditional FR4 boards commonly used in electronics. These ceramic-based boards are gaining popularity due to their superior heat management, stability, and reliability. Ceramic Printed Circuit Boards are increasingly employed in...
The Customer: A manufacturer in the motorcycle industry sought to enhance the design of their motorcycle steering wheels. They required a solution that was not only effective but also cost-efficient. The Challenge: The primary challenge was to develop a steering wheel component that could integrate electronic and mechanical elements effectively. Traditional...
In the fast-paced realm of the PCB (Printed Circuit Board) industry, achieving optimal signal integrity is crucial for the success of high-speed digital communications. As technology advances at a breakneck pace, the demand for faster and more efficient data transmission grows exponentially. This is where differential impedance, a vital...
At PICA, we pride ourselves on being at the forefront of new technological advancements, including embedded passives. Through this blog post, we aim to shed light on the broad realm of embedded passives and showcase how PICA and their manufacturing partners leverages this transformative technology to empower our customers in...
In the realm of flexible printed circuit assembly (FPCA) and printed circuit board assembly (PCBA), X-ray inspection plays a crucial role in ensuring product quality and meeting stringent requirements. This is particularly vital when incorporating surface mount components such as ball grid array (BGA), land grid array...
At PICA, we have recently undergone a transformative journey to redefine our brand identity and market positioning. This blog post aims to unveil the process, showcase the outcomes, and share the valuable insights we've gained about ourselves along the way. Brand Evolution: A Testament to Modernity and Commitment: Embarking on a journey...
A 6-Layer ELIC (Every Layer Inter-connect) Rigid Flex Printed Circuit Board / Rigid Flex PCB is an advanced and highly specialized printed circuit board technology designed to meet the ever-increasing demand for smaller and more densely packed electronic devices. It plays a crucial role in enabling the integration...
We are thrilled to announce that our team at PICA has successfully completed a 5-day training program on the OMRON Automatic Optical Inspection (AOI) equipment model VT-S1080. Thanks to OMRON, this training has equipped our workforce with the essential expertise required to program, operate, and maintain this advanced technology. By...
The most obvious benefit to a Flexible Printed Circuit (FPC) is the ability to bend and flex in order to allow for three dimensional packaging. However, the flexibility of an Flexible Printed Circuit is not always inherent in the design. When looking at a Flex circuit in a 2-D...
In the mid-1990s, the landscape of electronic manufacturing in the United States was thriving. The rapid growth of telecommunication infrastructure and the increasing demand for portable electronics and automotive applications created a fertile ground for companies to expand their capacity and experience low unemployment rates. Research and Development (R&D) departments...
Despite an abundance of literature about oven reflow soldering, PICA has found that setting up a reflow profile remains a challenge to many. The following post is intended to provide process engineers with hands-on recommendations. Reflow processes are generally defined by their heat application methods. Common examples include convection, infra-red (IR),...
I was recently visiting a client to discuss a new flex circuit application. They were trying to fit 10 pounds of electronics into an existing 5 pound package by utilizing flex circuit technology without making any changes to the current overall industrial design package. Everything had to fit into the...
While mass soldering processes dominate soldering applications, hand soldering remains critical in electronics manufacturing. Existing processes (e.g. convection oven reflow, vapor phase, wave flow, selective wave flow, etc.) are very efficient and offer high volume capacity but may not always be suitable. One of these special situations is when the...
