At PICA, we offer advanced design of Rigid Flex Printed Circuit Board using state-of-the-art technology. Below are our capabilities in Technology, Materials, and Pattern & Holes. For more information on Surface Finishing, please fill out the form below to request the full PDF capabilities download or click the button to contact a PICA engineer.
Technology
- Rigid Sections Up to 40 layers, 0.25 – 8mm (Application Dependent)
- Flex Layers Up to 32 Layers, 0.05 – 0.35mm (Application Dependent)
- Cut-Back/Selective Coverlayer or Soldermask
- Air Gap Constructions (Flexibility)
- Epoxy Fillet Strain Relief
- Impedance Control (TDR Testing & Verification)
- High Frequency Signals
- Resistance Control
- High Power
Materials
- FR4 Min Tg130 .C, 150 .C, 170 .C & 180 .C, Td>335 .C
- Low-Flow Adhesive & No-Flow FR4 Prepreg
- Halogen Free, ROHS & REACH Compliant
- UL 94 V-0 Approved
- Flex Layers: PI – Adhesive: Epoxy Acrylic – Adhesiveless
- Copper: Electrodeposited (ED), Rolled Annealed (RA)
- Shielding: EMI fi lm, Silver (Ag) Ink, Copper Plane
Patterns & Holes
- Space & Trace: 50μm (2 mils)
- Copper Thickness Inner: 1/2 – 2oz Outer: 1/3 – 4oz
- 0.15mm (.006”) Drilled Through-Holes
- HDI Capability
- Blind Vias and Buried Vias, 0.076mm (3.0mils) Laser Vias
- Via In Pad, Filled Vias, Stacked Vias
- Resin or Copper Paste Plug Hole dia. ratio: 15:1
- Pattern & Button Plate
- 4+N+4 Max. Stack
