Case Studies That Prove Performance
Featured Case Studies
We at PICA Manufacturing Solutions support select research and academic programs when time and capacity allow because advancing science and medicine starts with reliable hardware. We partner with university teams and labs to help design and build flexible, rigid, and rigid-flex PCBs that meet demanding performance requirements, from high-density routing and signal integrity to durability in challenging environments. Whether you need early design guidance, material and stackup recommendations, or a complete build path from prototype to assembly, our engineer-backed team works alongside your researchers to turn complex concepts into manufacturable, dependable circuitry so your project can move forward with confidence.
Vivo Recording and Optogenetics
A UC San Diego research team needed a reliable interconnect to link a main electronics board to a sensor board in a tight mechanical envelope, while maintaining a slim profile, high-density routing in a narrow flex width, and continuous flexing during operation. PICA delivered a double-sided flexible printed circuit using rolled annealed copper on an adhesiveless base laminate with button plating, plus turnkey support including design, fabrication, and assembly of the two board connectors.
Cryogenic Electronics Research Case Study
Université de Sherbrooke led project evaluated fully adhesiveless flex circuits as an alternative to wiring harnesses in quantum computing cryostats operating below 4 Kelvin. The goal was to reduce thermal loading, improve stability during thermal cycling, and enable higher-density interconnects, while supporting high-speed differential signaling with 100 ohm controlled impedance routing. Initial evaluations showed feasibility, with cryogenic validation planned under representative conditions.
The blogs featured below expand on this page’s content, offering detailed insights into specific design, manufacturing, and application topics that provide added relevance and deeper context for engineers and decision-makers.
Alternatives to Copper in Flexible Circuits
Copper has been the backbone of flexible printed circuits (FPCs) for decades, and for good reasons. While...
Auxiliary Materials in Flex PCB Builds
Stiffener, EMI Shielding, Release liners, spacers, marking inks, thermally conductive adhesive films, and PSA selection guidance.When engineers...
Flex PCB Adhesives and Bonding Guide
Thermoplastic vs thermoset adhesives, adhesiveless constructions, and the process factors that drive delamination riskIn flex circuits, reliability...
Flex PCB Substrate Deep Dives Beyond Polyimide
PET vs PEN, LCP, PTFE/fluoropolymers, and specialty films like PEI/PEEK: when each wins, where each struggles, and what it means...
