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Bilingual Technical Glossary

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Bilingual Technical Glossary

As PICA Manufacturing Solutions has grown into a global partner for flex and rigid PCB fabrication and assembly, we’ve seen how easily technical terms can get lost in translation. The same phrase can mean something slightly different across languages, industries, and regions—creating confusion during design reviews, quoting, sourcing, and production. To make technical conversations clearer, we created this bilingual technical glossary for flex and rigid PCB terminology. It’s a shared reference that helps engineers, purchasers, and project teams align on definitions, reduce miscommunication, and move faster from concept to build. Whether you’re collaborating across borders or simply double-checking the right wording, this glossary is here to support more accurate, confident communication.

English

Technology

Single sided

Double sided

Multilayer

Dual access

Double bare

Unsupported fingers design

Dynamic

Flex to Install

Air gap construction

Impedance control

High frequency control

Resistance control

Etched foil heater flex

Sculpture flex

Hybrids Flex

Materials

Polyimide

Polyester

Polyetherimide

Polytetrafluoroethylene

Polyethylene Naphthalate

Halogen free

UL 94 V-0 approved

ROHS

REACH

Adhesive

Epoxy

Acrylic

Adhesiveless

Stiffeners

FR4

Metal

Ceramic

Copper

Electrodeposited

Rolled Annealed

Constantan

Shielding

EMI film

Silver ink

Copper plane

Flexible solder mask

Coverlay film

Liquid solder mask

Patterns & Holes

Space & Trace

Micro Via

Blind and Buried Vias

PTH Aspect Ratio

Panel & Pattern Plating

Selective Plating

Button Plating

HDI capability

Surface Finishing

Electroplated Nickel

Hard Gold

Soft Gold

Hot Air Solder Leveling

Lead Free

Tin Plating

Immersion Tin

Immersion Ag

Organic Solderable Preservative

Electroless Nickel

Electroless Palladium

Immersion Gold

ENEPIG

ENIG

Interconnect

SMT Assembly

Through Hole Connector

Selective soldering

Insulation Displacement Contact

Crimping

Anisotropic Conductive Film

Anisotropic Conductive Adhesive

Hot Bar Soldering

Heat Stake

Solder Welding

Brazing

Ultrasonic Welding

Wire Bonding

Chip attached

French

Technologie

Simple face

Double face

Multicouche

Accès double face

Double face denude

Doigts metallises non supportés

Dynamique

flexion unique

Conception a couches non collées dans la zone de flexion

Contrôle d’impédance

Contrôle haute fréquence

Contrôle de résistance

Conception de circuits chauffants graves

Circuits souples sculptes

Circuit hybride

Matériaux

Polyimide

Polyester

Polyétherimide

Polytétrafluoroéthylène

Naphtalate de polyéthylène

Sans halogène

Approuvé UL 94 V-0

ROHS

REACH

Adhésif

Époxy

Acrylique

Sans adhésif

Renforts

FR4

Métal

Céramique

Cuivre

Électrodéposé

Recuit laminé

Constantan

Blindage

Film EMI

Encre argent

Couche de cuivre

Vernis epargne souple

Film Coverlay

Vernis epargne

Motifs et trous

largeur de piste et espacement

Micro-via

Vias borgnes et enterrés

Rapport d’aspect PTH

metallisation en panneau ou selectif

metallisation sélectif

Button plating (no good translation)

Capacité HDI

Finition de surface

Nickel électroplaqué

Or dur

Or doux

Nivelage de soudure à air chaud

Sans plomb

metallisation étain

Étain par immersion

Argent par immersion

Conservateur de soudabilité organique

Nickel non electrolytique

Palladium non electrolytique

Or par immersion

ENEPIG

ENIG

Interconnexion

Assemblage de composant de surface

Connecteur traversant

Soudure sélective

Insulation Displacement Contact (no good translation)

Sertissage

Film conducteur anisotrope

Adhésif conducteur anisotrope

soudure par barre chaude

Rivet thermique

Soudure

Brasage

Soudure ultrasonique

connection par fil

Montage de puce

German

Coming Soon