At PICA, we engineer Ceramic Printed Circuit Boards for high-power, high-temperature, and high-reliability applications. Our capabilities cover material selection, thermal performance, electrical properties, and precise manufacturing processes. Below are our capabilities in Technology, Materials, and Interconnect. For full specifications—including Surface Finishes, Thermal Options, and Patterns & Holes—please request the PDF download or contact a PICA engineer.
Technology
- High thermal conductivity substrates: AlN (170–230 W/m·K), Si₃N₄ (70–130 W/m·K), Al₂O₃(24 W/m·K), ZTA (25 W/m·K)
- Direct Copper Bonded (DCB) and Active Metal Brazed (AMB) substrates
- Multilayer ceramic with LTCC & Nitride powders
- High dielectric strength ≥20 kV/mm
- Excellent mechanical stability (up to 700 MPa bending strength)
- Thermal shock resistance: -55 °C to 150 °C cycles
- Laser cutting, etching, plating, brazing, and solder mask options
Materials
- Aluminum Nitride (AlN)
- Silicon Nitride (Si₃N₄)
- Alumina (Al₂O₃)
- Zirconia Toughened Alumina (ZTA)
- LTCC & Nitride powders (dielectric constant 4–40, Q factor up to 50,000)
- Copper layers: 0.127–0.4 mm (DCB) / up to 1.2 mm (AMB)
- Surface treatments: Ni, Ni+Au, Ag plating
