At PICA, we deliver advanced Metal Core Printed Circuit Board solutions engineered for high-power and thermal-demanding applications. Below are our capabilities across Materials, Thermal Performance, Stack-Ups, and Manufacturing Processes. For detailed specifications on surface finishes, design guidelines, and tolerances, please request the full MCPCB Capabilities PDF using the form below or click the button to connect with a PICA engineer.
Technology
- Max. 4 Layers
- Single-sided Aluminum substrate size max. 500×1230 mm
- Single-sided copper substrate size max. 500 mm
- Thermoelectric separation of copper substrate size max. 300×350 mm
- Min. Board Thickness: 0.40 mm (0.0157 inch)
- Max. Board Thickness: 4.0 mm (0.157 inch)
- Copper thickness 1-20 oz
- Minimum solder mask dam 0.10 mm (.004 in) (1 oz copper)
- Minimum SMD pad size 0.40 mm
- Punching, Routing, V-cut
Materials
- RoHS Compliant, UL 94 V-0 Approved
- Thermal Conductivity 1.0 to 20W/m.k
- PICADJ, TCB-2AL, BOYU, HA80, VT-4B3, NRK, 3D Bending, etc. aluminum base
- Copper base
- White, green, black solder mask; high reflection white solder mask
Interconnect
- Copper IMS Plating Insulation Hole
- Copper IMS With Isolated Thermal Pad – Single Sided
- Copper IMS With Isolated Thermal Pad – Double Sided
- Aluminum IMS PTH Insulation Hole
