PICA Manufacturing Solutions Ceramic PCB Capabilities Download

PICA Manufacturing Solutions delivers precision-engineered Ceramic Printed Circuit Boards designed for superior heat dissipation, electrical insulation, and mechanical reliability. Using advanced materials such as Aluminum Nitride (AlN), Silicon Nitride (Si₃N₄), Alumina (Al₂O₃), and Zirconia Toughened Alumina (ZTA), our boards achieve thermal conductivities up to 230 W/m·K with dielectric strengths above 20 kV/mm. We offer both Direct Copper Bonded (DCB) and Active Metal Brazed (AMB) technologies, supporting copper thicknesses up to 1.2 mm and fine design rules down to 0.2 mm. Multiple surface finishes—Ni, Ni+Au, or Ag—are available for optimal solderability and corrosion resistance. Combined with high bending strength, tight dimensional tolerances, and exceptional thermal shock endurance, PICA’s ceramic PCBs are ideal for demanding applications such as EV inverters, SiC and GaN power modules, RF systems, LEDs, and renewable energy equipment. With global manufacturing capabilities and rigorous quality control, PICA ensures every ceramic circuit is built for performance, precision, and reliability.