PICA white paper
Guide to PCB & FPC Manufacturing
Processes
Subtractive, Semi-Additive & Additive Techniques
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PDFFabrication process guide
Choose the right fabrication path
Match the process to yourdesign requirements.
This guide compares how subtractive, semi-additive, and fully additive processes form copper features—and how each method affects density, signal integrity, mechanical reliability, material use, and cost.
- 01Compare fabrication methods
Understand subtractive etching, SAP and mSAP, inkjet printing, and electroless plating.
- 02Enable finer circuit features
See how semi-additive processes support advanced HDI, flex, and miniaturized electronics.
- 03Improve performance and efficiency
Balance impedance control, fine-pitch routing, mechanical reliability, copper waste, and cost.
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