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This blog is the first in a two-part series that delves into the critical factors you need to consider when deciding between panel arrays and singulated carriers for your project. In this first installment, we’ll explore the key considerations that can impact your choice and how they align with your...
At PICA Manufacturing Solutions, we occasionally receive printed circuit boards (PCBs) and/or components consigned by our customers for their projects. To ensure we can deliver the highest quality service and products, we recommend that customers follow specific guidelines when consigning materials to us. These guidelines are designed to enhance our...
When placing an order with PICA Manufacturing Solutions for bare Printed Circuit Boards (PCBs) or Flexible Printed Circuits (FPCs), having the correct documentation and files is crucial. This ensures smooth production, meets quality standards, and aligns with your specific requirements. This article outlines the mandatory and good-to-have documents and files...
When ordering component assembly for your Printed Circuit Boards (PCBs) and Flexible Printed Circuits (FPCs), it's important to provide the right documentation and data files to ensure accurate and efficient assembly. Below, we outline the mandatory files and information needed, as well as additional items that are good...
Soldering is a critical process that involves joining electronic components to printed circuit boards (PCBs) using a metal alloy, known as solder. This process not only provides mechanical strength but also ensures reliable electrical connections.The metal alloy used for soldering varies based on the required properties such as melting...
This blog is the introduction to a white paper called Introduction to High Frequency Signal Insertion Loss. Click the button below to request the full white paper. The white paper has additional sections on measures to improve dielectric loss, how conductor loss occurs, measures to improve conductor loss, and insertion...
Customer: A leading innovator in inkjet technology, our customer is renowned for their advanced and precise printheads. Serving various sectors within the industrial, commercial, and consumer printing industries, their commitment to continuous innovation and quality underscores their prominent role in the printing technology sector.Challenge: The customer required a Flexible...
In today's digital age, many companies rely solely on online transactions, often without giving you the chance to speak to a human. At PICA, we are committed to a personalized, human-to-human approach. No automated phone menus or AI robots asking endless questions before you reach a human being. Instead, when...
This blog is an introduction to a white paper that contains additional information on surface finishes including: Immersion Silver or Tin, OSP (Organic Solderability Preservatives), HASL (Hot Air Solder Leveling), Carbon Ink, and Combination Finishes (e.g., Hard Gold/OSP, Soft Gold/OSP, Gold Immersion/OSP). Click the button below to request the full...
The production of flexible circuits (FPCs) relies heavily on various types of adhesives to ensure durability, flexibility, and functionality. In this post, we will delve into the different adhesives used, highlighting their unique properties and applications.
Stiffeners are essential for providing mechanical support to flexible circuits, particularly in areas where electronic components are mounted. By reinforcing specific sections of the flex circuit, stiffeners prevent excessive bending and maintain the circuit's structural integrity. This is crucial for ensuring reliable electrical connections and operational stability.Types of Stiffener MaterialsStiffeners...
PCBAs (Printed Circuit Board Assemblies) and FPCAs (Flexible Printed Circuit Assemblies) are both integral to the functioning of electronic devices, yet they cater to distinct needs due to their differing properties and construction. This blog provides a focused comparison to elucidate their unique applications and manufacturing...
At PICA Manufacturing Solutions (PMS), we specialize in creating Flexible Printed Circuits (FPCs) that enable innovative designs by conforming to limited spaces and unique shapes. The choice of dielectric material, which serves as the insulation layer in these circuits, is crucial not only for their electrical performance but also...
When it comes to choosing the right conductor material for flexible printed circuits (FPC), the primary consideration revolves around how the material performs under specific application conditions. This is especially critical in dynamic applications where the circuit is subject to repeated bending or flexing. Such applications necessitate conductors that are...
This blog is an introduction to a larger white paper that features 7 different via protection types. Download the full white paper to continue reading The Essential Guide to PCB Via Protection: Strategies and Standards. In the full white paper you'll learn about Filled Via Cap Plating, Coverlay Tented Via, and Copper...
The general scope of this article is to discuss methods for treating and characterizing the surface of Kapton, a polyimide material, to ensure effective interfacial bonding.The surface of the polyimide in Flexible Printed Circuits (FPCs) undergoes various processing steps during manufacturing, which can negatively impact its surface properties. To address...
The production of Printed Circuit Boards (PCBs) and Flexible Printed Circuits (FPCs) encompasses chemical, mechanical, and printing processes that often result in the accumulation of unwanted residues on their surfaces. The presence of even minuscule contaminants can significantly affect the functionality, performance, and reliability of the final products. Recognizing the...
Ball Grid Arrays (BGAs) are crucial components widely employed in the electronic manufacturing industry owing to their compact size. However, due to their high density, detecting defects through visual inspection alone can be challenging, while destructive testing poses the risk of compromising voiding defects.X-ray inspections offer a non-destructive testing solution...
Why Do Flex PCB Delaminate in High Temperature Exposure?Flex Printed Circuits (FPCs) face a common issue during soldering reflow: delamination. This problem, primarily caused by rapid temperature changes, can severely impact the circuit's integrity and functionality. The root cause is often moisture absorption, which can occur in various parts...
The Customer: A renowned multinational company, well known for its pioneering work in imaging and photography. They have developed a cutting-edge inkjet printing system that is highly regarded for its precision, reliability, and versatility in various applications including graphic arts, electronics, and material deposition. The Challenge: To address the need for...
