At PICA, we pride ourselves on being at the forefront of new technological advancements, including embedded passives. Through this blog post, we aim to shed light on the broad realm of embedded passives and showcase how PICA and their manufacturing partners leverages this transformative technology to empower our customers in...
In the realm of flexible printed circuit assembly (FPCA) and printed circuit board assembly (PCBA), X-ray inspection plays a crucial role in ensuring product quality and meeting stringent requirements. This is particularly vital when incorporating surface mount components such as ball grid array (BGA), land grid array (LPA), chip scale...
At PICA, we have recently undergone a transformative journey to redefine our brand identity and market positioning. This blog post aims to unveil the process, showcase the outcomes, and share the valuable insights we've gained about ourselves along the way. Brand Evolution: A Testament to Modernity and Commitment: Embarking on a journey...
A 6-Layer ELIC (Every Layer Inter-connect) Rigid Flex Printed Circuit Board / Rigid Flex PCB is an advanced and highly specialized printed circuit board technology designed to meet the ever-increasing demand for smaller and more densely packed electronic devices. It plays a crucial role in enabling the integration of multiple...
We are thrilled to announce that our team at PICA has successfully completed a 5-day training program on the OMRON Automatic Optical Inspection (AOI) equipment model VT-S1080. Thanks to OMRON, this training has equipped our workforce with the essential expertise required to program, operate, and maintain this advanced technology. By acquiring...
The most obvious benefit to a Flexible Printed Circuit (FPC) is the ability to bend and flex in order to allow for three dimensional packaging. However, the flexibility of an Flexible Printed Circuit is not always inherent in the design. When looking at a Flex circuit in a 2-D fashion,...
In the mid-1990s, the landscape of electronic manufacturing in the United States was thriving. The rapid growth of telecommunication infrastructure and the increasing demand for portable electronics and automotive applications created a fertile ground for companies to expand their capacity and experience low unemployment rates. Research and Development (R&D) departments...
Despite an abundance of literature about oven reflow soldering, PICA has found that setting up a reflow profile remains a challenge to many. The following post is intended to provide process engineers with hands-on recommendations. Reflow processes are generally defined by their heat application methods. Common examples include convection, infra-red (IR),...
I was recently visiting a client to discuss a new flex circuit application. They were trying to fit 10 pounds of electronics into an existing 5 pound package by utilizing flex circuit technology without making any changes to the current overall industrial design package. Everything had to fit into the...
While mass soldering processes dominate soldering applications, hand soldering remains critical in electronics manufacturing. Existing processes (e.g. convection oven reflow, vapor phase, wave flow, selective wave flow, etc.) are very efficient and offer high volume capacity but may not always be suitable. One of these special situations is when the...
So you need a flex circuit but your application demands a black substrate to keep the light out? There was a time when you simply could not get what you wanted. Times have changed. The need for colors other than the typical amber for flex PCBs has grown over the...
Ever increasing signal speeds and high noise environments make EMI/RFI shielding an essential requirement for FFC’s (Flat Flexible Cables). PICA can offer various shielding options. The least expensive option is a foil laminated to the outside of the cable. This can be applied to one or both sides. The foil...
