Blog

Controlled Impedance in Printed Circuit Board Design

In the design of printed circuit boards (PCBs), controlling impedance is a crucial factor for ensuring optimal signal integrity, especially in high-frequency applications. Impedance mismatches can lead to signal reflections, data loss, and compromised performance, which makes it essential to consider various transmission line configurations and impedance types during the...

Elevating Printed Circuit Board Protection: PICA’s MYC50 Conformal Coating

PICA is excited to announce the transformation of our high-precision conformal coating capabilities. We have been integrating the MYC50 platform into our processes to meet the specific needs of our customers requiring advanced conformal coatings for printed circuit boards assembled at PICA. This system has significantly enhanced our...

Understanding Tooling in Flex Printed Circuit Manufacturing: Fixtures, Artwork, and Testing (Part 2)

In Part 1 of this series, we discussed the essential role of mechanical tooling in Flexible Printed Circuit (FPC) manufacturing. Now, in Part 2, we will explore the use of fixtures, artwork films, CNC machining, vision punching, screen printing, and electrical testing to ensure precision and quality at every stage...

Navigating SMT Assembly Methods for Flexible Circuits Part 2

Part 2: Comparing Panel Array vs. Singulated Carrier AssemblyIn the first part of this series, we explored the key considerations for choosing between panel array assembly and singulated flex circuit assembly on a carrier in Surface Mount Technology (SMT). Now, in Part 2, we will directly compare these two methods,...

Elevating Printed Circuit Board Protection: PICA’s MYC50 Conformal Coating

PICA is excited to announce the transformation of our high-precision conformal coating capabilities. We have been integrating the MYC50 platform into our processes to meet the specific needs of our customers requiring advanced conformal coatings for printed circuit boards assembled at PICA. This system has significantly enhanced our ability to...

Understanding Tooling in Flexible Printed Circuit Manufacturing: Mechanical Tooling (Part 1)

At PICA Manufacturing Solutions, producing high-quality Flexible Printed Circuits (FPCs) involves a variety of specialized tooling and processes. This blog post, split into two parts, focuses first on the essential mechanical tooling required for FPC manufacturing. Understanding these tools and their functions is crucial for achieving the precision, efficiency, and...

Optimizing Design for Flexible Circuits Part 2: Advanced Design Strategies for Flexible Circuits

In the continuation of our series on optimizing flexible circuit designs, we delve into additional critical aspects that ensure functionality and durability in challenging environments. PICA Manufacturing Solutions brings you expert insights into managing mechanical stresses and enhancing the robustness of your flexible circuits.Strain ReliefWhen integrating thick FR4 stiffeners, consider...

Optimizing Design for Flexible Circuits: Best Practices and Considerations

Flexible circuits are essential in today’s compact, lightweight devices—thanks to their ability to bend, twist, and conform to tight spaces. But designing them for reliability and performance takes more than just a flexible substrate. At PICA Manufacturing Solutions, we specialize in helping engineers navigate the unique challenges of flex design...

Navigating SMT Assembly Methods for Flexible Circuits

This blog is the first in a two-part series that delves into the critical factors you need to consider when deciding between panel arrays and singulated carriers for your project. In this first installment, we’ll explore the key considerations that can impact your choice and how they align with your...

High-Frequency Signal Insertion Loss

This blog is the introduction to a white paper called Introduction to High Frequency Signal Insertion Loss. Click the button below to request the full white paper. The white paper has additional sections on measures to improve dielectric loss, how conductor loss occurs, measures to improve conductor loss, and insertion...

Advanced Flexible Printed Circuit Solder Coating Process

Customer: A leading innovator in inkjet technology, our customer is renowned for their advanced and precise printheads. Serving various sectors within the industrial, commercial, and consumer printing industries, their commitment to continuous innovation and quality underscores their prominent role in the printing technology sector.Challenge: The customer required a Flexible...

Advanced Surface Finishes for Enhanced PCB Performance

This blog is an introduction to a white paper that contains additional information on surface finishes including: Immersion Silver or Tin,  OSP (Organic Solderability Preservatives), HASL (Hot Air Solder Leveling), Carbon Ink, and Combination Finishes (e.g., Hard Gold/OSP, Soft Gold/OSP, Gold Immersion/OSP). Click the button below to request the full...

Choosing the Right Stiffener: A Guide to Materials for Flexible Circuit Support

Stiffeners are essential for providing mechanical support to flexible circuits, particularly in areas where electronic components are mounted. By reinforcing specific sections of the flex circuit, stiffeners prevent excessive bending and maintain the circuit's structural integrity. This is crucial for ensuring reliable electrical connections and operational stability.Types of Stiffener...