Polymer Thick Film (Printed Electronics): Thin, Flexible, and Designed for the Human BodyPolymer Thick Film (PTF) technology, commonly referred to as printed electronics, is becoming the foundation for a new generation of wearable medical devices. Instead of relying on rigid copper circuitry, PTF systems...
Modern drones demand electronic systems that are lightweight, compact, and highly reliable. Traditional rigid PCBs often struggle to meet these requirements due to their bulk and limitations in fitting tight or curved spaces. Flexible circuits solve this challenge by offering thin, bendable interconnects that reduce weight...
When space is tight, or when PCBs need to mate with enclosures, panels, or external interfaces, edge-mounted boards can offer a clean, compact solution. From USB daughtercards to LED bars and RF modules, mounting a board by its edge—rather than using standoffs or full-surface contact—can simplify mechanical design and reduce...
Electronics are shrinking, getting lighter, and expected to perform flawlessly in demanding environments. From medical wearables to industrial sensors and consumer devices, the push for smaller and smarter products is fueling new approaches in manufacturing. One breakthrough is roll-to-roll (RTR)...
Modern electronics pack more power into tighter spaces than ever. That heat has to go somewhere. Metal Core Printed Circuit Boards (MCPCBs) solve the problem at its source by building a heat-spreading layer directly into the board. PICA Manufacturing Solutions designs and manufactures aluminum- and...
From the palm of your hand, smartphones have revolutionized how we connect, work, and navigate the world. But behind the sleek glass and metal casing lies a key technology that makes their compact, high-performance design possible: flexible printed circuits (FPCs).At PICA Manufacturing Solutions, we specialize in engineering...
Modern products rarely fit neatly into a single interconnect category. Tight packaging, moving joints, long cable runs, heat-dense modules, and fast digital links often coexist in the same device. That’s where Hybrid PCB Assemblies shine. By combining rigid, flexible, flat flexible...
Modern electronics are expected to run hotter, switch faster, and survive harsher environments than ever. Standard FR-4 hits its limits quickly in these scenarios. Ceramic printed circuit boards (PCBs) step in with exceptional thermal conductivity, electrical insulation, and mechanical stability, enabling compact, long-life designs in power, RF/microwave,...
In the expanding world of medical devices, and wearables, the demand for biocompatible substrates in flex and rigid PCBs has never been greater. As electronic systems move closer to and even into the human body, designers and manufacturers must ensure that every...
As electronic devices become faster and more compact, susceptibility to electromagnetic interference (EMI) increases. Effective EMI control is not only about material selection—it requires a comprehensive strategy involving grounding, enclosure-level shielding, and cable shielding. In this post, we’ll explore best practices for each of...
Designing a flexible PCB is not just about taking the layout practices from rigid boards and applying them to a bendable surface. Trace routing, the way copper pathways are arranged, has a direct impact on electrical performance, mechanical reliability, and long-term manufacturability....
As electronic devices become more compact and powerful, managing heat effectively is critical to ensuring performance, reliability, and long product lifespans. Excessive heat can cause component failures, signal degradation, and even safety hazards. Whether working with rigid PCBs, flexible circuits,...
As electronics evolve to become thinner, lighter, and more complex, Flex Printed Circuit Boards (FPCBs) have emerged as a key solution. But building these flexible circuits into reliable assemblies requires precision and deep expertise. In this post, we walk through the Flex Printed Circuit Board Assembly (FPCBA)...
As electronic devices shrink and signal speeds increase, one design requirement becomes mission-critical: controlled impedance. This is especially true in flexible circuits—where mechanical and electrical performance must coexist in tight, dynamic spaces.At PICA Manufacturing Solutions, we help engineers design and build flexible and
Flexible circuits are built to bend—but only when designed and tested to handle real-world mechanical demands. Whether your product is a wearable device, medical catheter, or automotive sensor, the reliability of a flex circuit under repeated bending, twisting, or flexing is critical to its...
As electronic devices evolve to become smaller, smarter, and more power-efficient, engineers are under increasing pressure to maximize performance within minimal space. One innovative solution gaining traction is the use of embedded passive components—resistors, capacitors, and inductors that are built directly into the layers of a flexible printed circuit...
As devices shrink and performance demands grow, engineers are turning to High-Density Interconnect (HDI) technology to pack more function into less space. Whether you're working on a compact sensor, a multi-layer RF module, or a dense wearable board, HDI and fine-line etching open up new possibilities—if you...
