As electronic systems become faster, smaller, and more complex, maintaining signal integrity across printed circuit boards is increasingly important. One of the key design considerations for high-performance electronics is controlled impedance. While not every circuit requires it, impedance control becomes essential when signals must...
The future of intelligent electronics is becoming smaller, faster, smarter, and more connected — and few events showcase that transformation better than Sensors Converge 2026.Held at the Santa Clara Convention Center, Sensors Converge brings together engineers, innovators, semiconductor leaders, embedded system developers, AI companies, automotive technology firms,...
Dynamic flex PCBs are where flexible circuit design stops being “just about fitting in tight spaces” and starts being about surviving motion—hundreds of thousands or even millions of bend cycles without cracking, drifting out of spec, or failing at the worst possible time.If you design wearables, medical...
SATELLITE 2026 brought the global satellite, space, defense, and communications industries to Washington, D.C. from March 23-26, 2026. The show highlighted where the market is moving next: multi-orbit connectivity, tactical communications, phased-array systems, direct-to-device services, and more compact, rugged electronics platforms.For PICA Manufacturing Solutions,...
As electronic assemblies become more compact and mechanically complex, manufacturers must ensure that electrical connections remain secure under vibration, handling, and long-term operational stress. One technique used to strengthen these connections is hole riveting.Hole riveting is a mechanical fastening method that uses small metal rivets inserted through pre-drilled or punched...
Electronics manufacturing is heading into 2026 under pressure from several directions at once. Rising metals costs, laminate and prepreg repricing, labor shifts in key manufacturing regions, foreign exchange movement, and tighter capacity tied to AI and data-center demand are all contributing to higher PCB,
At PICA Manufacturing Solutions, we believe the future of electronics is not built component by component, it is engineered as a fully integrated system.As products become smaller, more functional, and more design-driven, the traditional model of separating electrical, mechanical, and assembly processes across multiple suppliers is no longer efficient. It...
Electromagnetic interference (EMI) and radio frequency interference (RFI) can disrupt signal quality, create data errors, and reduce overall circuit reliability. As electronics become smaller, faster, and more densely packaged, shielding has become an increasingly important part of flex PCB design. This is especially true in products that...
Flexible circuits are often chosen for their ability to route signals through tight spaces while tolerating bending and movement. However, the connection points of a flex circuit can experience significant mechanical and electrical stress, especially in high-power or high-reliability applications.One solution used in advanced flex circuit assemblies...
A practical step-by-step method for choosing materials that hold up in bending, assembly, and real environmentsFlex material selection is a tradeoff exercise. The right stack-up is the one that meets the mechanical mission first, then satisfies electrical, thermal, environmental, and compliance constraints without creating cost or lead-time...
Copper has been the backbone of flexible printed circuits (FPCs) for decades, and for good reasons. While new materials and additive technologies are expanding the design toolbox, copper remains the benchmark conductor for traditional flexible circuits made using subtractive processes.Before exploring alternatives, it’s important to understand why...
Stiffener, EMI Shielding, Release liners, spacers, marking inks, thermally conductive adhesive films, and PSA selection guidance.When engineers talk about flex PCB materials, the focus is usually on the core stack-up: substrate film, copper, adhesives, and coverlay. But many reliability and assembly issues are driven...
Thermoplastic vs thermoset adhesives, adhesiveless constructions, and the process factors that drive delamination riskIn flex circuits, reliability is not determined by copper and substrate alone. A large share of real-world failures trace back to the bond line. Bond systems influence peel strength, bend durability, thermal survivability through...
PET vs PEN, LCP, PTFE/fluoropolymers, and specialty films like PEI/PEEK: when each wins, where each struggles, and what it means for manufacturingPolyimide is the baseline substrate for most flex circuits because it offers a strong mix of heat tolerance, mechanical durability, and manufacturability. But some flex designs have requirements...
MD&M West 2026 in Anaheim brought together medtech, automation, design/manufacturing, plastics, and packaging, so the biggest trend wasn’t one product. It was how fast devices are becoming smarter, smaller, and more integrated, with more pressure on reliability, speed-to-market, and manufacturability.
Tariffs have played a role in the U.S. economy since the nation’s founding. In the early days of the republic, tariffs were a primary source of government revenue and a way to protect domestic industries as they took shape. Over time, tariffs became a strategic policy tool, used to influence...
Las Vegas, January 2026 — CES 2026 once again confirmed that the pace of innovation in consumer tech, mobility, AI, and robotics isn’t slowing down. With over 4,000 exhibitors and thousands of breakthrough products on the show floor, this year’s CES put a spotlight on technologies that feel like...
Box build assembly—sometimes called systems integration—involves assembling a complete electronic product by combining a finished PCBA with wiring, connectors, mechanical components, enclosures, firmware loading, labeling, and final testing. While PCB assembly creates the electronic heart of a device, box build assembly transforms it into a fully integrated...
