The general scope of this article is to discuss methods for treating and characterizing the surface of Kapton, a polyimide material, to ensure effective interfacial bonding.The surface of the polyimide in Flexible Printed Circuits (FPCs) undergoes various processing steps during manufacturing, which can negatively impact its surface properties. To address...
The production of Printed Circuit Boards (PCBs) and Flexible Printed Circuits (FPCs) encompasses chemical, mechanical, and printing processes that often result in the accumulation of unwanted residues on their surfaces. The presence of even minuscule contaminants can significantly affect the functionality, performance, and reliability of the final products. Recognizing the...
Ball Grid Arrays (BGAs) are crucial components widely employed in the electronic manufacturing industry owing to their compact size. However, due to their high density, detecting defects through visual inspection alone can be challenging, while destructive testing poses the risk of compromising voiding defects. X-ray inspections offer a non-destructive testing solution...
Why Do Flex PCB Delaminate in High Temperature Exposure?Flex Printed Circuits (FPCs) face a common issue during soldering reflow: delamination. This problem, primarily caused by rapid temperature changes, can severely impact the circuit's integrity and functionality. The root cause is often moisture absorption, which can occur in various parts of...
Anisotropic Conductive Film (ACF) represents a significant advancement in the realm of electronic packaging technology. Serving as a crucial interconnect material, ACF stands out for its unique combination of attributes. It acts as a transparent polymeric connector material, endowed with the triple characteristics of adhesion, conductivity, and insulation. This makes...
Flexible Printed Circuits (FPC) are revolutionizing the electronics industry with their unique combination of flexibility, reliability, and lightweight construction. At the heart of these circuits lies their base material, typically polyimide (PI) or polyester (PET) films. These materials are selected for their excellent properties, including high density, thinness, and the...
In the fast-paced realm of the PCB (Printed Circuit Board) industry, achieving optimal signal integrity is crucial for the success of high-speed digital communications. As technology advances at a breakneck pace, the demand for faster and more efficient data transmission grows exponentially. This is where differential impedance, a vital factor...
At PICA, we pride ourselves on being at the forefront of new technological advancements, including embedded passives. Through this blog post, we aim to shed light on the broad realm of embedded passives and showcase how PICA and their manufacturing partners leverages this transformative technology to empower our customers in...
In the realm of flexible printed circuit assembly (FPCA) and printed circuit board assembly (PCBA), X-ray inspection plays a crucial role in ensuring product quality and meeting stringent requirements. This is particularly vital when incorporating surface mount components such as ball grid array (BGA), land grid array (LPA), chip scale...
The most obvious benefit to a Flexible Printed Circuit (FPC) is the ability to bend and flex in order to allow for three dimensional packaging. However, the flexibility of an Flexible Printed Circuit is not always inherent in the design. When looking at a Flex circuit in a 2-D fashion,...
So you need a flex circuit but your application demands a black substrate to keep the light out? There was a time when you simply could not get what you wanted. Times have changed. The need for colors other than the typical amber for flex PCBs has grown over the...
