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Soldering is a critical process that involves joining electronic components to printed circuit boards (PCBs) using a metal alloy, known as solder. This process not only provides mechanical strength but also ensures reliable electrical connections.The metal alloy used for soldering varies based on the required properties such as melting...
Customer: A leading innovator in inkjet technology, our customer is renowned for their advanced and precise printheads. Serving various sectors within the industrial, commercial, and consumer printing industries, their commitment to continuous innovation and quality underscores their prominent role in the printing technology sector.Challenge: The customer required a Flexible...
This blog is an introduction to a white paper that contains additional information on surface finishes including: Immersion Silver or Tin, OSP (Organic Solderability Preservatives), HASL (Hot Air Solder Leveling), Carbon Ink, and Combination Finishes (e.g., Hard Gold/OSP, Soft Gold/OSP, Gold Immersion/OSP). Click the button below to request the full...
The production of flexible circuits (FPCs) relies heavily on various types of adhesives to ensure durability, flexibility, and functionality. In this post, we will delve into the different adhesives used, highlighting their unique properties and applications.
Stiffeners are essential for providing mechanical support to flexible circuits, particularly in areas where electronic components are mounted. By reinforcing specific sections of the flex circuit, stiffeners prevent excessive bending and maintain the circuit's structural integrity. This is crucial for ensuring reliable electrical connections and operational stability.Types of Stiffener MaterialsStiffeners...
PCBAs (Printed Circuit Board Assemblies) and FPCAs (Flexible Printed Circuit Assemblies) are both integral to the functioning of electronic devices, yet they cater to distinct needs due to their differing properties and construction. This blog provides a focused comparison to elucidate their unique applications and manufacturing...
At PICA Manufacturing Solutions (PMS), we specialize in creating Flexible Printed Circuits (FPCs) that enable innovative designs by conforming to limited spaces and unique shapes. The choice of dielectric material, which serves as the insulation layer in these circuits, is crucial not only for their electrical performance but also...
When it comes to choosing the right conductor material for flexible printed circuits (FPC), the primary consideration revolves around how the material performs under specific application conditions. This is especially critical in dynamic applications where the circuit is subject to repeated bending or flexing. Such applications necessitate conductors that are...
This blog is an introduction to a larger white paper that features 7 different via protection types. Download the full white paper to continue reading The Essential Guide to PCB Via Protection: Strategies and Standards. In the full white paper you'll learn about Filled Via Cap Plating, Coverlay Tented Via, and Copper...
The general scope of this article is to discuss methods for treating and characterizing the surface of Kapton, a polyimide material, to ensure effective interfacial bonding.The surface of the polyimide in Flexible Printed Circuits (FPCs) undergoes various processing steps during manufacturing, which can negatively impact its surface properties. To address...
The production of Printed Circuit Boards (PCBs) and Flexible Printed Circuits (FPCs) encompasses chemical, mechanical, and printing processes that often result in the accumulation of unwanted residues on their surfaces. The presence of even minuscule contaminants can significantly affect the functionality, performance, and reliability of the final products. Recognizing the...
Ball Grid Arrays (BGAs) are crucial components widely employed in the electronic manufacturing industry owing to their compact size. However, due to their high density, detecting defects through visual inspection alone can be challenging, while destructive testing poses the risk of compromising voiding defects. X-ray inspections offer a non-destructive testing solution...
Why Do Flex PCB Delaminate in High Temperature Exposure?Flex Printed Circuits (FPCs) face a common issue during soldering reflow: delamination. This problem, primarily caused by rapid temperature changes, can severely impact the circuit's integrity and functionality. The root cause is often moisture absorption, which can occur in various parts...
Anisotropic Conductive Film (ACF) represents a significant advancement in the realm of electronic packaging technology. Serving as a crucial interconnect material, ACF stands out for its unique combination of attributes. It acts as a transparent polymeric connector material, endowed with the triple characteristics of adhesion, conductivity, and insulation. This makes...
Flexible Printed Circuits (FPC) are revolutionizing the electronics industry with their unique combination of flexibility, reliability, and lightweight construction. At the heart of these circuits lies their base material, typically polyimide (PI) or polyester (PET) films. These materials are selected for their excellent properties, including high density, thinness, and...
In the fast-paced realm of the PCB (Printed Circuit Board) industry, achieving optimal signal integrity is crucial for the success of high-speed digital communications. As technology advances at a breakneck pace, the demand for faster and more efficient data transmission grows exponentially. This is where differential impedance, a vital...
At PICA, we pride ourselves on being at the forefront of new technological advancements, including embedded passives. Through this blog post, we aim to shed light on the broad realm of embedded passives and showcase how PICA and their manufacturing partners leverages this transformative technology to empower our customers in...
In the realm of flexible printed circuit assembly (FPCA) and printed circuit board assembly (PCBA), X-ray inspection plays a crucial role in ensuring product quality and meeting stringent requirements. This is particularly vital when incorporating surface mount components such as ball grid array (BGA), land grid array...
The most obvious benefit to a Flexible Printed Circuit (FPC) is the ability to bend and flex in order to allow for three dimensional packaging. However, the flexibility of an Flexible Printed Circuit is not always inherent in the design. When looking at a Flex circuit in a 2-D...
So you need a flex circuit but your application demands a black substrate to keep the light out? There was a time when you simply could not get what you wanted. Times have changed. The need for colors other than the typical amber for flex PCBs has grown over...
