Copper has been the backbone of flexible printed circuits (FPCs) for decades, and for good reasons. While new materials and additive technologies are expanding the design toolbox, copper remains the benchmark conductor for traditional flexible circuits made using subtractive processes.Before exploring alternatives, it’s important to understand why...
Stiffener, EMI Shielding, Release liners, spacers, marking inks, thermally conductive adhesive films, and PSA selection guidance.When engineers talk about flex PCB materials, the focus is usually on the core stack-up: substrate film, copper, adhesives, and coverlay. But many reliability and assembly issues are driven...
Thermoplastic vs thermoset adhesives, adhesiveless constructions, and the process factors that drive delamination riskIn flex circuits, reliability is not determined by copper and substrate alone. A large share of real-world failures trace back to the bond line. Bond systems influence peel strength, bend durability, thermal survivability through...
PET vs PEN, LCP, PTFE/fluoropolymers, and specialty films like PEI/PEEK: when each wins, where each struggles, and what it means for manufacturingPolyimide is the baseline substrate for most flex circuits because it offers a strong mix of heat tolerance, mechanical durability, and manufacturability. But some flex designs have requirements...
MD&M West 2026 in Anaheim brought together medtech, automation, design/manufacturing, plastics, and packaging, so the biggest trend wasn’t one product. It was how fast devices are becoming smarter, smaller, and more integrated, with more pressure on reliability, speed-to-market, and manufacturability.
Tariffs have played a role in the U.S. economy since the nation’s founding. In the early days of the republic, tariffs were a primary source of government revenue and a way to protect domestic industries as they took shape. Over time, tariffs became a strategic policy tool, used to influence...
Las Vegas, January 2026 — CES 2026 once again confirmed that the pace of innovation in consumer tech, mobility, AI, and robotics isn’t slowing down. With over 4,000 exhibitors and thousands of breakthrough products on the show floor, this year’s CES put a spotlight on technologies that feel like...
Box build assembly—sometimes called systems integration—involves assembling a complete electronic product by combining a finished PCBA with wiring, connectors, mechanical components, enclosures, firmware loading, labeling, and final testing. While PCB assembly creates the electronic heart of a device, box build assembly transforms it into a fully integrated...
When evaluating a manufacturing company in Malaysia, most teams are focused on a few essentials: capability fit, reliable quality systems, a clean and well-controlled production environment, and the ability to scale from early prototypes to higher volumes without disruption. Malaysia’s growing electronics ecosystem offers strong advantages in cost, workforce readiness,...
Protecting the copper circuitry on a flexible printed circuit (FPC) is essential to ensuring long-term reliability and performance. Two common protective approaches are Liquid Photoimageable (LPI) solder mask and Polyimide (PI) coverlay. While both serve to insulate and safeguard traces, they differ significantly in their material properties,...
In product development, timing is everything. But too often, the flexible circuit comes late in the conversation, added after mechanical constraints are set, the enclosure is locked, and the clock is already ticking. That’s where problems start.At PICA Manufacturing Solutions, we’ve seen time and again how early...
When it comes to sports safety, precision and reliability are non-negotiable. Impact monitoring mouthguards, like those used to measure head acceleration in contact sports, demand electronics that are compact, durable, and capable of withstanding extreme conditions. This is exactly where rigid-flex PCB technology shines.Rigid-flex combines the stability...
Modern drones demand electronic systems that are lightweight, compact, and highly reliable. Traditional rigid PCBs often struggle to meet these requirements due to their bulk and limitations in fitting tight or curved spaces. Flexible circuits solve this challenge by offering thin, bendable interconnects that reduce weight...
Electronics are shrinking, getting lighter, and expected to perform flawlessly in demanding environments. From medical wearables to industrial sensors and consumer devices, the push for smaller and smarter products is fueling new approaches in manufacturing. One breakthrough is roll-to-roll (RTR)...
From the palm of your hand, smartphones have revolutionized how we connect, work, and navigate the world. But behind the sleek glass and metal casing lies a key technology that makes their compact, high-performance design possible: flexible printed circuits (FPCs).At PICA Manufacturing Solutions, we specialize in engineering...
Modern products rarely fit neatly into a single interconnect category. Tight packaging, moving joints, long cable runs, heat-dense modules, and fast digital links often coexist in the same device. That’s where Hybrid PCB Assemblies shine. By combining rigid, flexible, flat flexible...
In the expanding world of medical devices, and wearables, the demand for biocompatible substrates in flex and rigid PCBs has never been greater. As electronic systems move closer to and even into the human body, designers and manufacturers must ensure that every...
As electronic devices become faster and more compact, susceptibility to electromagnetic interference (EMI) increases. Effective EMI control is not only about material selection—it requires a comprehensive strategy involving grounding, enclosure-level shielding, and cable shielding. In this post, we’ll explore best practices for each of...
Designing a flexible PCB is not just about taking the layout practices from rigid boards and applying them to a bendable surface. Trace routing, the way copper pathways are arranged, has a direct impact on electrical performance, mechanical reliability, and long-term manufacturability....
