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In multilayer PCB fabrication, what connects copper layers together isn’t just glue—it’s carefully engineered dielectric materials that control signal integrity, insulation, and mechanical performance. Among these, prepreg plays a critical role, serving as both an adhesive and an electrical insulator between copper layers. Whether you’re working on high-speed digital signals, RF layouts,...
For engineers balancing performance, flexibility, and cost, Flat Flexible Cables (FFC) remain one of the most efficient interconnect solutions in electronics today. Their simple structure, adaptability, and low manufacturing cost make them ideal for countless applications—from consumer electronics to industrial controls, smart home, industrial equipment, vehicles, electric...
In PCB manufacturing, solder mask isn’t just about making a board look green—it’s a functional layer that protects copper traces, prevents solder bridging, and improves overall assembly yield. But not all solder masks are created equal. From rigid PCBs to flexible circuits and high-density designs, the type of solder mask used—and...
Printed Circuit Board (PCB) manufacturing involves precise processes, not just in design and component assembly but also in how the final boards are separated from their manufacturing panels. At PICA Manufacturing Solutions, we use various depaneling techniques to ensure efficiency, accuracy, and cost-effectiveness. The three primary methods—V-scoring, routing, and die...
Conductive Inks and Their Role in Flexible and Printed ElectronicsAs electronics continue to evolve beyond rigid, boxy enclosures, the materials and processes used to build them are changing too. Conductive inks are a key enabler of this shift, offering engineers the ability to print circuitry directly onto thin, flexible, and...
Selecting the right base material for a PCB is never a simple choice. The properties of the substrate affect everything—from thermal stability to dielectric performance, mechanical strength, and manufacturing compatibility. Four standard materials dominate PCB fabrication: FR-2, FR-4, CEM-1, and CEM-3. While all of them provide insulation and structural integrity,...
FPC (Flexible Printed Circuit) manufacturing has evolved significantly, with both panel-based and roll-to-roll (RTR) processing methods widely used. Each method has its own advantages, limitations, and specific applications, particularly when manufacturing extra-long flex circuits. Below is a comparison highlighting capabilities specifically relevant to producing extra-long FPCs depending on application needs,...
Whether you're designing for a high-durability dynamic application or a compact static installation, every detail matters—from copper type and thickness to stackup design and layer placement. These design elements directly influence the PCB’s flexibility, durability, and long-term performance. For electrical and mechanical engineers alike, mastering these principles is key to...
At PICA, we know that the performance and reliability of printed circuit boards (PCBs) depend heavily on their cleanliness. That’s why our Kuala Lumpur facility is equipped with advanced ultrasonic cleaning technology, ensuring every PCB meets the highest quality standards.What Is Ultrasonic Cleaning?Ultrasonic cleaning uses high-frequency sound waves,...
Printed Circuit Boards (PCBs) form the backbone of modern electronic devices, providing the physical platform for mounting and interconnecting electronic components. Among the essential elements in PCB design are vias—small holes that allow electrical connections between different layers of the board. Vias play a role in ensuring efficient routing of...
Flux is a fundamental material in the electronics manufacturing process, particularly in the assembly of printed circuit boards (PCBs). It plays a crucial role in ensuring the reliability and functionality of electronic components by enabling high-quality solder joints. Its versatility and multifunctionality make it indispensable in the reflow...
PCB Carolina 2024 brought together industry leaders to explore advancements in PCB design and manufacturing. Joe DiPalermo, our Director of Engineering, delivered an insightful presentation on the latest techniques and considerations for designing and producing flexible and rigid-flex circuits.Joe DiPalermo, Director of Engineering at PICA, has been a cornerstone of...
Flexible Printed Circuits (FPCs) are essential components in modern electronics, enabling lightweight, compact, and high-performance designs. However, they come at a higher cost compared to traditional rigid PCBs. This is primarily due to the specialized materials and manufacturing processes required for flexibility and durability. Below, we break down...
Malaysia has long been recognized as a premier destination for electronic manufacturing, earning its place as a critical player in the global supply chain. In 2019, PICA Manufacturing Solutions selected Malaysia to establish an electronic assembly facility, further solidifying the country’s reputation as an attractive investment destination. Combining strategic location,...
Flexible Printed Circuits (FPCs) are widely used due to their lightweight, flexible, and compact nature, making them ideal for applications requiring bending and folding. However, designing FPCs involves several critical considerations. Engineers should approach FPC design very differently from Printed Circuit Boards (PCBs). PICA Manufacturing Solutions has the...
As an important part of the electrical system, the performance of the wiring harness directly affects the reliability and safety of the equipment. In harsh environments, such as high temperature, low temperature, high humidity, high salt fog, and mechanical vibration, traditional wiring harness designs can deteriorate due to environmental factors,...
In Part 1, we explored the challenges of manufacturing ultra-thin flexible circuits with a focus on the conductive layers, highlighting innovations like adhesiveless copper solutions, precision imaging, and additive technologies. These advancements address the critical need for high-performance conductors in ultra-thin applications.In this continuation, we shift our focus to the dielectric...
One of our key customers approached PICA with the challenge of manufacturing ultra-thin flexible circuits. A critical component of this technology is the conductor, typically made from copper. Traditional methods, such as copper cladding with adhesive layers, are insufficient for the thinner profiles demanded by our customer. To meet this...
In the world of flexible electronics, the shift from traditional flexible copper-clad laminates (FCCLs) to adhesiveless materials represents a significant leap forward. Flexible copper-clad laminates, which consist of copper foil bonded to a substrate using adhesive layers, have long been the backbone of flexible circuits. However, their reliance on adhesives...
When developing and manufacturing flexible printed circuits (FPCs), adhering to industry standards ensures reliability, safety, and performance. Two pivotal standards in the FPC industry are UL 796 and IPC 6013. While both standards guide the design and production of printed circuit boards, their focuses and requirements differ significantly, impacting how...
