X-Ray Inspection (On-Site Service)

By strategically investing in X-ray inspection technology, PICA has not only opened doors of opportunity for itself but also for a lot of its customers.

With our state-of-the-art 2D and 3D x-ray equipment, PICA offers real-time inspections for PCB components, assemblies, and other electronic devices. Our team of trained and certified process engineers ensures that every inspection is conducted with precision and attention to detail. Along with on-site inspections conducted at our facility, we also offer remote inspections through our real-time conferencing system. This allows our clients to actively participate in the inspection process, ask questions, and gain a better understanding of the results.

One of the key advantages of X-ray inspections is their ability to identify common defects that can significantly impact product performance.

For example, BGA voiding, where air bubbles are trapped between the ball and the pad, can lead to unreliable connections and compromised functionality. By identifying this defect early in the manufacturing timeline, PICA can take corrective measures, saving precious time, resources, and costs.

Similarly, solder ball wicking, where solder is drawn into the gap between the pad and the component, and misalignment of BGA packages can also be detected through X-ray inspections. These defects can cause short circuits or weak connections, leading to device failure. By catching these issues before they become major problems, manufacturers can ensure the overall quality and reliability of their electronic devices.

But X-ray inspections don’t stop there. They also help identify other critical defects such as solder shorts, joint voiding, and cracks in tracks, joints, and components. These defects can compromise the structural integrity of the device and affect its performance. By detecting these issues early on, manufacturers can rectify them and avoid costly recalls or customer dissatisfaction.