Integrate Circuit Substrate Carrier

PICA Manufacturing Solutions produces IC substrate carriers with standard line/space geometries of 30/30 µm, and supports R&D-level designs down to 20/20 µm with via diameters as small as 50 µm. Our laser-defined via processing is highly configurable, allowing laser sizing to be defined as needed to meet the specific electrical and mechanical requirements of your substrate.

We actively collaborate with customers during the material selection phase, recommending suitable high-performance materials with very high glass transition temperatures (Tg)—typically in the 250 °C to 300 °C range—and exceptionally low X/Y-axis coefficients of thermal expansion (CTE), as low as 2–5 ppm/°C. This ensures thermal stability, dimensional control, and improved long-term reliability, particularly in thermally demanding applications.

By acting as technical consultants and advisors, our team is deeply involved in defining design rules and ensuring design for manufacturability (DFM) from the earliest stages of development. We support a wide range of high-performance laminate materials, including BT resin systems and advanced ceramic substrates, enabling us to handle extremely compact and high-density package dimensions.

When you work with PICA, you gain access to a team of experts in dimension specification, microvia architecture, material optimization, and substrate stack-up planning. We have manufactured hundreds of thousands of IC substrate carriers with tightly controlled characteristics tailored for high-frequency, high-thermal, and high-reliability applications. Through careful alignment of high Tg, low CTE, and robust design rule definition, we help enhance the electrical performance, structural integrity, and thermal reliability of your most critical components and systems.