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Whether you're designing for a high-durability dynamic application or a compact static installation, every detail matters—from copper type and thickness to stackup design and layer placement. These design elements directly influence the PCB’s flexibility, durability, and long-term performance. For electrical and mechanical engineers alike, mastering these principles is key to...
At PICA, we know that the performance and reliability of printed circuit boards (PCBs) depend heavily on their cleanliness. That’s why our Kuala Lumpur facility is equipped with advanced ultrasonic cleaning technology, ensuring every PCB meets the highest quality standards.What Is Ultrasonic Cleaning?Ultrasonic cleaning uses high-frequency sound waves,...
Printed Circuit Boards (PCBs) form the backbone of modern electronic devices, providing the physical platform for mounting and interconnecting electronic components. Among the essential elements in PCB design are vias—small holes that allow electrical connections between different layers of the board. Vias play a role in ensuring efficient routing of...
Flux is a fundamental material in the electronics manufacturing process, particularly in the assembly of printed circuit boards (PCBs). It plays a crucial role in ensuring the reliability and functionality of electronic components by enabling high-quality solder joints. Its versatility and multifunctionality make it indispensable in the reflow...
PCB Carolina 2024 brought together industry leaders to explore advancements in PCB design and manufacturing. Joe DiPalermo, our Director of Engineering, delivered an insightful presentation on the latest techniques and considerations for designing and producing flexible and rigid-flex circuits.Joe DiPalermo, Director of Engineering at PICA, has been a cornerstone of...
Stencil design plays a critical role in ensuring the quality and reliability of printed circuit boards (PCBs). A well-designed stencil enables precise solder paste deposition, ensuring strong solder joints and high manufacturing yields. With over 30 years of experience and facilities in Derry, NH, and Kuala Lumpur, Malaysia, PICA has...
When developing and manufacturing flexible printed circuits (FPCs), adhering to industry standards ensures reliability, safety, and performance. Two pivotal standards in the FPC industry are UL 796 and IPC 6013. While both standards guide the design and production of printed circuit boards, their focuses and requirements differ significantly, impacting how...
Part #2: Functional Testing of Complete Circuit AssembliesIntroductionIn the second part of our series, we delve into the verification processes for circuitry once components are mounted. This phase is crucial for assessing the functional integration and overall performance of our PCBs and FPCs. Through a series of targeted tests, we...
Welcome to our two-part blog series on Electrical Verification Protocols at PICA Manufacturing Solutions. Ensuring the quality and reliability of our printed circuit boards (PCBs) and flexible printed circuits (FPCs) is paramount. This series delves into our rigorous verification processes, starting from the preliminary testing of unpopulated circuit boards,...
In the design of printed circuit boards (PCBs), controlling impedance is a crucial factor for ensuring optimal signal integrity, especially in high-frequency applications. Impedance mismatches can lead to signal reflections, data loss, and compromised performance, which makes it essential to consider various transmission line configurations and impedance types during the...
PICA is excited to announce the transformation of our high-precision conformal coating capabilities. We have been integrating the MYC50 platform into our processes to meet the specific needs of our customers requiring advanced conformal coatings for printed circuit boards assembled at PICA. This system has significantly enhanced our...
In Part 1 of this series, we discussed the essential role of mechanical tooling in Flexible Printed Circuit (FPC) manufacturing. Now, in Part 2, we will explore the use of fixtures, artwork films, CNC machining, vision punching, screen printing, and electrical testing to ensure precision and quality at every stage...
Design for Manufacturability (DFM) is a proactive process integral to the PICA Way, ensuring a product design aligns with each step of the manufacturing process from the outset. This methodology is crucial in avoiding revisions due to manufacturing issues. At PICA Manufacturing Solutions, our DFM process focuses on reducing development...
PICA is excited to announce the transformation of our high-precision conformal coating capabilities. We have been integrating the MYC50 platform into our processes to meet the specific needs of our customers requiring advanced conformal coatings for printed circuit boards assembled at PICA. This system has significantly enhanced our ability to...
At PICA Manufacturing Solutions, we occasionally receive printed circuit boards (PCBs) and/or components consigned by our customers for their projects. To ensure we can deliver the highest quality service and products, we recommend that customers follow specific guidelines when consigning materials to us. These guidelines are designed to enhance our...
When placing an order with PICA Manufacturing Solutions for bare Printed Circuit Boards (PCBs) or Flexible Printed Circuits (FPCs), having the correct documentation and files is crucial. This ensures smooth production, meets quality standards, and aligns with your specific requirements. This article outlines the mandatory and good-to-have documents and files...
Soldering is a critical process that involves joining electronic components to printed circuit boards (PCBs) using a metal alloy, known as solder. This process not only provides mechanical strength but also ensures reliable electrical connections.The metal alloy used for soldering varies based on the required properties such as melting...
This blog is the introduction to a white paper called Introduction to High Frequency Signal Insertion Loss. Click the button below to request the full white paper. The white paper has additional sections on measures to improve dielectric loss, how conductor loss occurs, measures to improve conductor loss, and insertion...
This blog is an introduction to a white paper that contains additional information on surface finishes including: Immersion Silver or Tin, OSP (Organic Solderability Preservatives), HASL (Hot Air Solder Leveling), Carbon Ink, and Combination Finishes (e.g., Hard Gold/OSP, Soft Gold/OSP, Gold Immersion/OSP). Click the button below to request the full...
PCBAs (Printed Circuit Board Assemblies) and FPCAs (Flexible Printed Circuit Assemblies) are both integral to the functioning of electronic devices, yet they cater to distinct needs due to their differing properties and construction. This blog provides a focused comparison to elucidate their unique applications and manufacturing...
