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Soldering is a critical process that involves joining electronic components to printed circuit boards (PCBs) using a metal alloy, known as solder. This process not only provides mechanical strength but also ensures reliable electrical connections.The metal alloy used for soldering varies based on the required properties such as melting...
This blog is the introduction to a white paper called Introduction to High Frequency Signal Insertion Loss. Click the button below to request the full white paper. The white paper has additional sections on measures to improve dielectric loss, how conductor loss occurs, measures to improve conductor loss, and insertion...
This blog is an introduction to a white paper that contains additional information on surface finishes including: Immersion Silver or Tin, OSP (Organic Solderability Preservatives), HASL (Hot Air Solder Leveling), Carbon Ink, and Combination Finishes (e.g., Hard Gold/OSP, Soft Gold/OSP, Gold Immersion/OSP). Click the button below to request the full...
PCBAs (Printed Circuit Board Assemblies) and FPCAs (Flexible Printed Circuit Assemblies) are both integral to the functioning of electronic devices, yet they cater to distinct needs due to their differing properties and construction. This blog provides a focused comparison to elucidate their unique applications and manufacturing...
This blog is an introduction to a larger white paper that features 7 different via protection types. Download the full white paper to continue reading The Essential Guide to PCB Via Protection: Strategies and Standards. In the full white paper you'll learn about Filled Via Cap Plating, Coverlay Tented Via, and Copper...
The production of Printed Circuit Boards (PCBs) and Flexible Printed Circuits (FPCs) encompasses chemical, mechanical, and printing processes that often result in the accumulation of unwanted residues on their surfaces. The presence of even minuscule contaminants can significantly affect the functionality, performance, and reliability of the final products. Recognizing the...
Ball Grid Arrays (BGAs) are crucial components widely employed in the electronic manufacturing industry owing to their compact size. However, due to their high density, detecting defects through visual inspection alone can be challenging, while destructive testing poses the risk of compromising voiding defects.X-ray inspections offer a non-destructive testing solution...
Ceramic substrate PCBs (Printed Circuit Boards) represent a significant advancement in circuit board technology, especially when compared to traditional FR4 boards commonly used in electronics. These ceramic-based boards are gaining popularity due to their superior heat management, stability, and reliability. Ceramic Printed Circuit Boards are increasingly employed in...
