Printed Circuit Board

Elevating Printed Circuit Board Protection: PICA’s MYC50 Conformal Coating

PICA is excited to announce the transformation of our high-precision conformal coating capabilities. We have been integrating the MYC50 platform into our processes to meet the specific needs of our customers requiring advanced conformal coatings for printed circuit boards assembled at PICA. This system has significantly enhanced our ability to...

Guidelines for Consigning Components & PCBs to PICA

At PICA Manufacturing Solutions, we occasionally receive printed circuit boards (PCBs) and/or components consigned by our customers for their projects. To ensure we can deliver the highest quality service and products, we recommend that customers follow specific guidelines when consigning materials to us. These guidelines are designed to enhance our...

Essential Documentation for Manufacturing Bare PCBs and FPCs

When placing an order with PICA Manufacturing Solutions for bare Printed Circuit Boards (PCBs) or Flexible Printed Circuits (FPCs), having the correct documentation and files is crucial. This ensures smooth production, meets quality standards, and aligns with your specific requirements. This article outlines the mandatory and good-to-have documents and files...

High-Frequency Signal Insertion Loss

This blog is the introduction to a white paper called Introduction to High Frequency Signal Insertion Loss. Click the button below to request the full white paper. The white paper has additional sections on measures to improve dielectric loss, how conductor loss occurs, measures to improve conductor loss, and insertion...

Advanced Surface Finishes for Enhanced PCB Performance

This blog is an introduction to a white paper that contains additional information on surface finishes including: Immersion Silver or Tin,  OSP (Organic Solderability Preservatives), HASL (Hot Air Solder Leveling), Carbon Ink, and Combination Finishes (e.g., Hard Gold/OSP, Soft Gold/OSP, Gold Immersion/OSP). Click the button below to request the full...

Ensuring the Integrity of Printed Circuit Boards (PCB): The Vital Role of Surface Cleanliness.

The production of Printed Circuit Boards (PCBs) and Flexible Printed Circuits (FPCs) encompasses chemical, mechanical, and printing processes that often result in the accumulation of unwanted residues on their surfaces. The presence of even minuscule contaminants can significantly affect the functionality, performance, and reliability of the final products. Recognizing the...

4 factors that can cause voiding in Ball Grid Arrays (BGA)

Ball Grid Arrays (BGAs) are crucial components widely employed in the electronic manufacturing industry owing to their compact size. However, due to their high density, detecting defects through visual inspection alone can be challenging, while destructive testing poses the risk of compromising voiding defects.X-ray inspections offer a non-destructive testing solution...