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In Part 1, we explored the challenges of manufacturing ultra-thin flexible circuits with a focus on the conductive layers, highlighting innovations like adhesiveless copper solutions, precision imaging, and additive technologies. These advancements address the critical need for high-performance conductors in ultra-thin applications.In this continuation, we shift our focus to the dielectric...
One of our key customers approached PICA with the challenge of manufacturing ultra-thin flexible circuits. A critical component of this technology is the conductor, typically made from copper. Traditional methods, such as copper cladding with adhesive layers, are insufficient for the thinner profiles demanded by our customer. To meet this...
In the world of flexible electronics, the shift from traditional flexible copper-clad laminates (FCCLs) to adhesiveless materials represents a significant leap forward. Flexible copper-clad laminates, which consist of copper foil bonded to a substrate using adhesive layers, have long been the backbone of flexible circuits. However, their reliance on adhesives...
When developing and manufacturing flexible printed circuits (FPCs), adhering to industry standards ensures reliability, safety, and performance. Two pivotal standards in the FPC industry are UL 796 and IPC 6013. While both standards guide the design and production of printed circuit boards, their focuses and requirements differ significantly, impacting how...
Part #2: Functional Testing of Complete Circuit AssembliesIntroductionIn the second part of our series, we delve into the verification processes for circuitry once components are mounted. This phase is crucial for assessing the functional integration and overall performance of our PCBs and FPCs. Through a series of targeted tests, we...
Welcome to our two-part blog series on Electrical Verification Protocols at PICA Manufacturing Solutions. Ensuring the quality and reliability of our printed circuit boards (PCBs) and flexible printed circuits (FPCs) is paramount. This series delves into our rigorous verification processes, starting from the preliminary testing of unpopulated circuit boards,...
In the design of printed circuit boards (PCBs), controlling impedance is a crucial factor for ensuring optimal signal integrity, especially in high-frequency applications. Impedance mismatches can lead to signal reflections, data loss, and compromised performance, which makes it essential to consider various transmission line configurations and impedance types during the...
PICA is excited to announce the transformation of our high-precision conformal coating capabilities. We have been integrating the MYC50 platform into our processes to meet the specific needs of our customers requiring advanced conformal coatings for printed circuit boards assembled at PICA. This system has significantly enhanced our...
In Part 1 of this series, we discussed the essential role of mechanical tooling in Flexible Printed Circuit (FPC) manufacturing. Now, in Part 2, we will explore the use of fixtures, artwork films, CNC machining, vision punching, screen printing, and electrical testing to ensure precision and quality at every stage...
Design for Manufacturability (DFM) is a proactive process integral to the PICA Way, ensuring a product design aligns with each step of the manufacturing process from the outset. This methodology is crucial in avoiding revisions due to manufacturing issues. At PICA Manufacturing Solutions, our DFM process focuses on reducing development...
Part 2: Comparing Panel Array vs. Singulated Carrier AssemblyIn the first part of this series, we explored the key considerations for choosing between panel array assembly and singulated flex circuit assembly on a carrier in Surface Mount Technology (SMT). Now, in Part 2, we will directly compare these two methods,...
PICA is excited to announce the transformation of our high-precision conformal coating capabilities. We have been integrating the MYC50 platform into our processes to meet the specific needs of our customers requiring advanced conformal coatings for printed circuit boards assembled at PICA. This system has significantly enhanced our ability to...
At PICA Manufacturing Solutions, producing high-quality Flexible Printed Circuits (FPCs) involves a variety of specialized tooling and processes. This blog post, split into two parts, focuses first on the essential mechanical tooling required for FPC manufacturing. Understanding these tools and their functions is crucial for achieving the precision, efficiency, and...
In the continuation of our series on optimizing flexible circuit designs, we delve into additional critical aspects that ensure functionality and durability in challenging environments. PICA Manufacturing Solutions brings you expert insights into managing mechanical stresses and enhancing the robustness of your flexible circuits.Strain ReliefWhen integrating thick FR4 stiffeners, consider...
Flexible circuits' ability to bend, twist, and flex makes them ideal for modern devices where space and weight are at a premium. However, designing flexible circuits requires careful consideration to maximize their lifespan and functionality. At PICA Manufacturing Solutions, we deeply understand the unique challenges and opportunities that flexible circuits...
This blog is the first in a two-part series that delves into the critical factors you need to consider when deciding between panel arrays and singulated carriers for your project. In this first installment, we’ll explore the key considerations that can impact your choice and how they align with your...
At PICA Manufacturing Solutions, we occasionally receive printed circuit boards (PCBs) and/or components consigned by our customers for their projects. To ensure we can deliver the highest quality service and products, we recommend that customers follow specific guidelines when consigning materials to us. These guidelines are designed to enhance our...
When placing an order with PICA Manufacturing Solutions for bare Printed Circuit Boards (PCBs) or Flexible Printed Circuits (FPCs), having the correct documentation and files is crucial. This ensures smooth production, meets quality standards, and aligns with your specific requirements. This article outlines the mandatory and good-to-have documents and files...
When ordering component assembly for your Printed Circuit Boards (PCBs) and Flexible Printed Circuits (FPCs), it's important to provide the right documentation and data files to ensure accurate and efficient assembly. Below, we outline the mandatory files and information needed, as well as additional items that are good...
Soldering is a critical process that involves joining electronic components to printed circuit boards (PCBs) using a metal alloy, known as solder. This process not only provides mechanical strength but also ensures reliable electrical connections.The metal alloy used for soldering varies based on the required properties such as melting...
