This blog is an introduction to a white paper that contains additional information on surface finishes including: Immersion Silver or Tin, OSP (Organic Solderability Preservatives), HASL (Hot Air Solder Leveling), Carbon Ink, and Combination Finishes (e.g., Hard Gold/OSP, Soft Gold/OSP, Gold Immersion/OSP). Click the button below to request the full...
The production of flexible circuits (FPCs) relies heavily on various types of adhesives to ensure durability, flexibility, and functionality. In this post, we will delve into the different adhesives used, highlighting their unique properties and applications.
Stiffeners are essential for providing mechanical support to flexible circuits, particularly in areas where electronic components are mounted. By reinforcing specific sections of the flex circuit, stiffeners prevent excessive bending and maintain the circuit's structural integrity. This is crucial for ensuring reliable electrical connections and operational stability.Types of Stiffener MaterialsStiffeners...
PCBAs (Printed Circuit Board Assemblies) and FPCAs (Flexible Printed Circuit Assemblies) are both integral to the functioning of electronic devices, yet they cater to distinct needs due to their differing properties and construction. This blog provides a focused comparison to elucidate their unique applications and manufacturing nuances, enhancing your understanding...
At PICA Manufacturing Solutions (PMS), we specialize in creating Flexible Printed Circuits (FPCs) that enable innovative designs by conforming to limited spaces and unique shapes. The choice of dielectric material, which serves as the insulation layer in these circuits, is crucial not only for their electrical performance but also for...
When it comes to choosing the right conductor material for flexible printed circuits (FPC), the primary consideration revolves around how the material performs under specific application conditions. This is especially critical in dynamic applications where the circuit is subject to repeated bending or flexing. Such applications necessitate conductors that are...
This blog is an introduction to a larger white paper that features 7 different via protection types. Download the full white paper to continue reading The Essential Guide to PCB Via Protection: Strategies and Standards. In the full white paper you'll learn about Filled Via Cap Plating, Coverlay Tented Via, and Copper...
The general scope of this article is to discuss methods for treating and characterizing the surface of Kapton, a polyimide material, to ensure effective interfacial bonding.The surface of the polyimide in Flexible Printed Circuits (FPCs) undergoes various processing steps during manufacturing, which can negatively impact its surface properties. To address...
The production of Printed Circuit Boards (PCBs) and Flexible Printed Circuits (FPCs) encompasses chemical, mechanical, and printing processes that often result in the accumulation of unwanted residues on their surfaces. The presence of even minuscule contaminants can significantly affect the functionality, performance, and reliability of the final products. Recognizing the...
Ball Grid Arrays (BGAs) are crucial components widely employed in the electronic manufacturing industry owing to their compact size. However, due to their high density, detecting defects through visual inspection alone can be challenging, while destructive testing poses the risk of compromising voiding defects. X-ray inspections offer a non-destructive testing solution...
Why Do Flex PCB Delaminate in High Temperature Exposure?Flex Printed Circuits (FPCs) face a common issue during soldering reflow: delamination. This problem, primarily caused by rapid temperature changes, can severely impact the circuit's integrity and functionality. The root cause is often moisture absorption, which can occur in various parts of...
The Customer: A renowned multinational company, well known for its pioneering work in imaging and photography. They have developed a cutting-edge inkjet printing system that is highly regarded for its precision, reliability, and versatility in various applications including graphic arts, electronics, and material deposition. The Challenge: To address the need for...
Customer Overview: The customer in this case study is a leading company in the healthcare technology sector, known for its groundbreaking work in developing cutting-edge imaging technology. As an industry leader, they are constantly seeking to enhance the performance and reliability of their equipment to meet the rigorous demands of...
Anisotropic Conductive Film (ACF) represents a significant advancement in the realm of electronic packaging technology. Serving as a crucial interconnect material, ACF stands out for its unique combination of attributes. It acts as a transparent polymeric connector material, endowed with the triple characteristics of adhesion, conductivity, and insulation. This makes...
Flexible Printed Circuits (FPC) are revolutionizing the electronics industry with their unique combination of flexibility, reliability, and lightweight construction. At the heart of these circuits lies their base material, typically polyimide (PI) or polyester (PET) films. These materials are selected for their excellent properties, including high density, thinness, and the...
Ceramic substrate PCBs (Printed Circuit Boards) represent a significant advancement in circuit board technology, especially when compared to traditional FR4 boards commonly used in electronics. These ceramic-based boards are gaining popularity due to their superior heat management, stability, and reliability. Ceramic Printed Circuit Boards are increasingly employed in high-demand sectors...
The Customer: A manufacturer in the motorcycle industry sought to enhance the design of their motorcycle steering wheels. They required a solution that was not only effective but also cost-efficient. The Challenge: The primary challenge was to develop a steering wheel component that could integrate electronic and mechanical elements effectively. Traditional...
In the fast-paced realm of the PCB (Printed Circuit Board) industry, achieving optimal signal integrity is crucial for the success of high-speed digital communications. As technology advances at a breakneck pace, the demand for faster and more efficient data transmission grows exponentially. This is where differential impedance, a vital factor...
At PICA, we pride ourselves on being at the forefront of new technological advancements, including embedded passives. Through this blog post, we aim to shed light on the broad realm of embedded passives and showcase how PICA and their manufacturing partners leverages this transformative technology to empower our customers in...
In the realm of flexible printed circuit assembly (FPCA) and printed circuit board assembly (PCBA), X-ray inspection plays a crucial role in ensuring product quality and meeting stringent requirements. This is particularly vital when incorporating surface mount components such as ball grid array (BGA), land grid array (LPA), chip scale...
