Rigid Flex Circuits

Rigid-Flex circuit boards consist of rigid and flexible substrate laminated together into a single circuit. Plated through holes provide the electrical connection between the different layers. printed circuit boards are very complex; they require high levels of skills and knowledge in flexible and rigid materials selections and related manufacturing processes.

It is also an expensive technology and PICA’s engineers are trained to help the customers improving their designs and construction of printed circuit boards to make it more cost effective and reliable.

Rigid Flex Circuits Benefits

 
  • Improved Connection Reliability
  • Lower Part Count (Eliminate connectors, jumpers, & stiffeners, fewer PCBs)
  • Flexible Design Options
  • High Density (SMT permissible on both sides)
 Package Size and Weight Reduction

Special Features & Performances

  • Minimal geometry changes reduce impedance discontinuities
  • Light-weight, ultra-reliable packaging technology
  • Three-dimensional substrate
  • Surface mountable on one or both sides of the circuit
  • Combines the benefits of a PCB and FPC into one circuit

Rigid Flex Special Processes

  • Thin adhesive & adhesiveless substrates down to 12µm Cu & PI
  • Adhesive-based cover layer & LPI soldermask options
  • LDI print process for both circuit & solder-mask exposure
  • Impedance modelling, characterization, and control
  • Custom shielding films
  • Button plating and air-gap constructions for dynamic or tight static bending
  • HDI construction w/ stacked & copper filled microvias in rigid sections (Up to 16 layers)