At PICA, we offer advanced design of Printed Circuit Boards (PCB) using state-of-the-art technology. Below are our capabilities in Technology, Materials, and Patterns & Holes. For more information on Surface Finishing, please fill out the form below to request the full PDF capabilities download or click the button to contact a PICA engineer.
Technology
- Conventional PCB Max. 40 Layers
- HDI Capability Max. 32 Layers
- ELIC Max. 12 Layers
- Sequential Lamination
- Heat Sink (Aluminum or Copper)
- Embedded Capacitance & Resistance
- Impedance Control (TDR Testing & Verification)
- Max. Board Thickness: 8mm (0.315in)
- Min. Board Thickness: 0.25mm (10mils)
- Min. Core Thickness: 0.05mm (2mils)
- Max. Copper Thickness: Inner Layer 12oz, Outer Layer 6oz
Materials
- ROHS Compliant, UL 94 V-0 Approved
- FR4 Min Tg130 .C, 150 .C, 170 .C & 180.C
- Halogen Free
- Metal Core (Aluminum/Copper)
- Polytetrafluoroethylene
- Dupont Coolam@: Formable, Thermal Substrate, UL Approved
- CEM-3, Ceramics, Teflon…
Patterns & Holes
- Space & Trace: 50μm (2mils)
- Micro Via: Laser 75μm (3mils) Drilling 150μm (6mils)
- Controlled Depth Drilling
- Panel & Pattern Plating
- Max. PTH Aspect Ratio: 16:1