Printed Circuit Boards (PCB) Capabilities

At PICA, we offer advanced design of Printed Circuit Boards (PCB) using state-of-the-art technology. Below are our capabilities in Technology, Materials, and Patterns & Holes. For more information on Surface Finishing, please fill out the form below to request the full PDF capabilities download or click the button to contact a PICA engineer.


  • Conventional PCB Max. 40 Layers
  • HDI Capability Max. 32 Layers
  • ELIC Max. 12 Layers
  • Sequential Lamination
  • Heat Sink (Aluminum or Copper)
  • Embedded Capacitance & Resistance
  • Impedance Control (TDR Testing & Verification)
  • Max. Board Thickness: 8mm (0.315in)
  • Min. Board Thickness: 0.25mm (10mils)
  • Min. Core Thickness: 0.05mm (2mils)
  • Max. Copper Thickness: Inner Layer 12oz, Outer Layer 6oz


  • ROHS Compliant, UL 94 V-0 Approved
  • FR4 Min Tg130 .C, 150 .C, 170 .C & 180.C
  • Halogen Free
  • Metal Core (Aluminum/Copper)
  • Polytetrafluoroethylene
  • Dupont Coolam@: Formable, Thermal Substrate, UL Approved
  • CEM-3, Ceramics, Teflon…

Patterns & Holes

  • Space & Trace: 50μm (2mils)
  • Micro Via: Laser 75μm (3mils) Drilling 150μm (6mils)
  • Controlled Depth Drilling
  • Panel & Pattern Plating
  • Max. PTH Aspect Ratio: 16:1

Fill out the form below to request the full PICA Printed Circuit Board (PCB) capabilities sheet.