Download Guide to PCB & FPC Manufacturing Processes White Paper.
As PCBs and flex circuits evolve to support smaller devices, denser routing, and higher performance, engineers are turning to more advanced copper patterning processes. Whether you’re designing a high-density rigid board, a compact wearable with flex arms, or a hybrid rigid-flex assembly, the way you build copper features matters, especially as line/ space requirements drop below 75 μm.
This guide compares three major methods of forming copper features on PCBs and flex circuits:
• Subtractive Etching (traditional)
• Semi-Additive Process (SAP / mSAP)
• Fully Additive Process (e.g. inkjet or electroless)
We’ll explore how each method works, where it’s best used, and what designers need to consider when building modern rigid, flex, or rigid-flex designs.
