Flexible Circuit Boards Capabilities

At PICA, we offer advanced design of Flexible Circuit Boards using state-of-the-art technology. Below are our capabilities in Technology, Materials, and Interconnect. For more information on Surface Finishing and Patterns & Holes, please fill out the form below to request the full PDF capabilities download or click the button to contact a PICA engineer.


  • Single Sided, Double Sided, Multiplayer Max 8L
  • Dual Access | Double Bare | Unsupported Fingers Design
  • Dynamic & Flex Install Applications
  • Air Gap Construction
  • Impedance Control (TDR – Testing Verification)
  • High Frequency Control
  • Resistance Control
  • Etched Foil Heater Flex & Design
  • Sculpture Flex
  • Hybrid Flex


  • Polyimide (PI), Polyester (PET), Polyetherimide (PEI), Polytetrafl uoroethylene (PTFE), Polyethylene Naphthalate (PEN)
  • Halogen free, UL 94 V-0 approved, ROHS, REACH
  • Adhesive: Epoxy, Acrylic – Adhesiveless
  • Stiffeners: FR4, PI, Metal, Ceramic (AI302)
  • Copper: Electrodeposited (ED), Rolled Annealed (RA) – Constantan
  • Shielding: EMI fi lm, Silver (AG) ink, Copper plane
  • Flexible solder mask, Coverlay film, Liquid solder mask (LPI)


  • SMT Assembly
  • Through Hole Connector, selective soldering
  • IDC: Insulation Displacement Contact (Crimping)
  • Anisotropic Conductive Film (ACF), Anisotropic Conductive Adhesive
  • Hot Bar Soldering
  • Heat Stake
  • Solder Welding (Brazing)
  • Ultrasonic Welding
  • Wire Bonding
  • Chip/Die Attached

Fill out the form below to request the full PICA Flexible Circuit Board capabilities sheet.