At PICA, we offer advanced design of Flexible Circuit Boards using state-of-the-art technology. Below are our capabilities in Technology, Materials, and Interconnect. For more information on Surface Finishing and Patterns & Holes, please fill out the form below to request the full PDF capabilities download or click the button to contact a PICA engineer.
Technology
- Single Sided, Double Sided, Multiplayer Max 8L
- Dual Access | Double Bare | Unsupported Fingers Design
- Dynamic & Flex Install Applications
- Air Gap Construction
- Impedance Control (TDR – Testing Verification)
- High Frequency Control
- Resistance Control
- Etched Foil Heater Flex & Design
- Sculpture Flex
- Hybrid Flex
Materials
- Polyimide (PI), Polyester (PET), Polyetherimide (PEI), Polytetrafl uoroethylene (PTFE), Polyethylene Naphthalate (PEN)
- Halogen free, UL 94 V-0 approved, ROHS, REACH
- Adhesive: Epoxy, Acrylic – Adhesiveless
- Stiffeners: FR4, PI, Metal, Ceramic (AI302)
- Copper: Electrodeposited (ED), Rolled Annealed (RA) – Constantan
- Shielding: EMI fi lm, Silver (AG) ink, Copper plane
- Flexible solder mask, Coverlay film, Liquid solder mask (LPI)
Interconnect
- SMT Assembly
- Through Hole Connector, selective soldering
- IDC: Insulation Displacement Contact (Crimping)
- Anisotropic Conductive Film (ACF), Anisotropic Conductive Adhesive
- Hot Bar Soldering
- Heat Stake
- Solder Welding (Brazing)
- Ultrasonic Welding
- Wire Bonding
- Chip/Die Attached
