Ceramic PCB

See What You Can’t See: AOI & X‑Ray Inspection in PCB Assembly

In today’s electronics world, component densities are rising, geometries are shrinking, and reliability expectations are higher than ever. Failures at the board level can jeopardize product launches, erode customer trust, and lead to costly recalls. Simply put: what you don’t see can kill your design. That’s where inspection technologies like...

Compact Power, Cooler Systems: The Case for Ceramic PCBs in Modern Electronics

Modern electronics are expected to run hotter, switch faster, and survive harsher environments than ever. Standard FR-4 hits its limits quickly in these scenarios. Ceramic printed circuit boards (PCBs) step in with exceptional thermal conductivity, electrical insulation, and mechanical stability, enabling compact, long-life designs in power, RF/microwave,...

Advanced Surface Finishes for Enhanced PCB Performance

This blog is an introduction to a white paper that contains additional information on surface finishes including: Immersion Silver or Tin,  OSP (Organic Solderability Preservatives), HASL (Hot Air Solder Leveling), Carbon Ink, and Combination Finishes (e.g., Hard Gold/OSP, Soft Gold/OSP, Gold Immersion/OSP). Click the button below to request the full...