A Leader in Advanced
Medical Imaging Technology.
A leading healthcare technology company needed an innovative solution to improve the performance and reliability of its medical imaging equipment.
The project required a highly technical approach capable of supporting the rigorous demands of medical diagnostics.
Complex Construction.
Extreme Flexibility.
The rigid-flex substrate needed to maintain electrical performance while repeatedly bending around different diameters.
The design required a 14-layer rigid-flex construction with impedance-controlled traces and durability of up to two million bend cycles.
Engineering for
Millions of Bends.
PICA developed a rigid-flex solution that reduced flex-region thickness while maintaining the required signal integrity and mechanical performance.
Rigid-Flex Integration
PCB-to-flex interconnects were eliminated.
Shielding Film
Shielding film replaced traditional shielding in the flex region.
Neutral-Axis Copper
Copper was strategically relocated to the neutral axis.
Flex Optimization
Flex thickness was reduced while maintaining signal integrity.
The final rigid-flex assembly met and exceeded the customer’s electrical and mechanical bending requirements.
