PICA Assembly Capabilities

At PICA, we offer advanced assembly and manufacturing using state-of-the-art technology. Below are our capabilities in SMT Component Specifications, Solder Paste Dispensing Method and Specifications, Conformal Coating, and Quality Control. For more information on SMT Pick and Place Machine Specifications, and Reflow Furnace Specification, please fill out the form below to request the full PDF capabilities download or click the button to contact a PICA engineer.

SMT Component Specifications

Specifications Value (unit: mm)
Nominal Min
Positional Accuracy F1 0.1 0.05
Pitch of R/C F2 0.3
Space of IC to R/C F3 0.4
Space of chip to outline F4 0.8
Pitch of chip F5 0.2
Shift of chip F6 1/3 size of pad 0.1
Chip size F7 MAX 32*32 01005
Underfill flow size F8 0.8 - 1.2 0.5 - 0.6

Solder Paste Dispensing Method and Specifications

Solder Paste Dispensing Method Specifications Value
Selective Solder Paste Jetting Smallest solder dot & pad size Min dot diamter = 250μm Pad size (min) = 250μm
Jet printing frequency 1,080,000 dph (high speed option)
Single dot accuracy 40μm
Position resolution 0.2μm
Maximum board size 508 x 508mm (20" x 20")
Minimum board size 70 x 40mm (2.7" x 1.6")
Board thickness range 0.4 - 0.6mm (0.016" - 0.24")
Max board weight 5kg (11lbs)
Stencil Printer Stencil size (mm) 340*470 - 737*737
Print position accuracy ±25μm
Printing size (mm) 50*50 - 510*508.5
Stencil thickness (mm) 0.05 - 5mm
Warpage < Diagonal 1%
Minimum printing component size (mm) 01005 & 0.3mm PITCH (IC)
Applicable Product PCB, FPC, & R-Flex

Reflow Furnace Specifications

Specification Value
Number of Zones 8 heating zones
Heating Method Upper hot air + far infrared heating/lower far infrared heating method
Maximum Set Temperature Upper 320°C / Lower 450°C
Effective Board Width 35 - 558mm (1.378" x 22")
Transport Method (selection type) Pin chain transfer/ mesh transfer
Accuracy of Temperature Controller +/- 0.1°C
Transport Speed 0.3 - 1.88 m/min
Applicable Product PCB, FPC, & R-Flex

SMT Pick and Place Machine Specifications

Line Width & Spacing Cababilities
Specification Value
SMT Range (mm) 50*50 - 460*510
Minimum SMT component size (mm) 01005, 0.3mm PITCH (IC)
SMT accuracy ±0.035mm
Max board dimension 457.2 x 508mm (18" x 20")
Max board weight 4kg (8.8lbs)
Board thickness 0.4 - 6.0mm
Maxiumum SMT thickness (mm) < = 15mm
Maximum capacity 46000 chip/hour
Feeding package Tape & Reel, Tube, Tray
Component size 01005 ~ W55*L100mm
Applicable component package DPAK/SOP/SOJ.QFP/PLCC/BGA/Tantalum/SMT connector, etc
Applicable product PCB, FPC, & R-Flex

Conformal Coating

Conformal coating is a lightweight material applied to PCBs that acts as a protective layer. It protects circuit boards and components against various environmental factors, including heat, humidity, moisture, ultraviolet light, chemical contaminants, and abrasive materials. Conformal coatings also have thermal and electrical insulation properties to help manage the circuit’s operating characteristics. The key benefit of applying a conformal coating is that the protection will extend the circuit board’s life and reduce component failure rates due to environmental factors. This protection consequently improves the reliability of the device, reducing costs associated with replacing hardware that has prematurely failed.

PICA utilizes a high-performance conformal coating system that is simple to program and operate, the robust frame structure and advanced motion configuration systems ensure speed and precision for an endless variety of coating demands.

Quality Control

Automated Optical Inspection

Inspection Detectable Defect
Component Missing Components
Tombstoning
Billboarding
Polarity
Rotation
Shift
Wrong Marking (OCV)
Defective
Upside Down
Extra Component
Foreign Material
Lifted Component
Solder Excess Solder
Insufficient Solder
Bridging
Through-hole Pins
Lifted Lead
Golden Finger
Scratch/Contamination

X-Ray Machine

PICA is equipped with a high-quality X-ray machine that detect a wide range of manufacturing defects including BGA, QFN and IGBT attachment, PTH filling, interfacial voiding, component cracking and counterfeit devices.

Additional equipment & methods to ensure best quality

  • Environmental Chamber
  • In-Circuit Test
  • X-Section Lab
  • 3.5x-180x Trinocular Microscope
  • Functional Test

Other assembly manufacturing service

  • Cable and Wire Harness
  • Turnkey Electronic Box Builds
  • Membrane Switch
  • Potting/Encapsulation
  • 3D Printing

Fill out the form below to request the full PICA Assembly Capabilities sheet.