{"id":18890,"date":"2023-09-06T18:29:24","date_gmt":"2023-09-06T18:29:24","guid":{"rendered":"https:\/\/picamfg.com\/supports-et-substrats-pour-circuits-integres\/"},"modified":"2026-03-24T19:07:52","modified_gmt":"2026-03-24T19:07:52","slug":"supports-et-substrats-pour-circuits-integres","status":"publish","type":"page","link":"https:\/\/picamfg.com\/fr\/supports-et-substrats-pour-circuits-integres\/","title":{"rendered":"Supports et substrats pour circuits int\u00e9gr\u00e9s"},"content":{"rendered":"\t\t<div data-elementor-type=\"wp-post\" data-elementor-id=\"18890\" class=\"elementor elementor-18890 elementor-7160\" data-elementor-post-type=\"page\">\n\t\t\t\t<section class=\"elementor-element elementor-element-8599005 e-flex e-con-boxed e-con e-parent\" data-id=\"8599005\" data-element_type=\"container\">\r\n\t\t\t\t\t<div class=\"e-con-inner\">\r\n\t\t\t\t<div class=\"elementor-element elementor-element-a9b7f9b elementor-widget elementor-widget-template\" data-id=\"a9b7f9b\" data-element_type=\"widget\" data-widget_type=\"template.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"elementor-template\">\n\t\t\t\t\t<div data-elementor-type=\"container\" data-elementor-id=\"8878\" class=\"elementor elementor-8878\" data-elementor-post-type=\"elementor_library\">\n\t\t\t\t<div class=\"elementor-element elementor-element-228207e2 e-flex e-con-boxed e-con e-parent\" data-id=\"228207e2\" data-element_type=\"container\">\r\n\t\t\t\t\t<div class=\"e-con-inner\">\r\n\t\t<div class=\"elementor-element elementor-element-42013cc4 e-con-full e-flex e-con e-child\" data-id=\"42013cc4\" data-element_type=\"container\">\r\n\t\t\t\t<div class=\"elementor-element elementor-element-22f8b261 elementor-view-default elementor-widget elementor-widget-icon\" data-id=\"22f8b261\" data-element_type=\"widget\" data-widget_type=\"icon.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"elementor-icon-wrapper\">\n\t\t\t<a class=\"elementor-icon\" href=\"\/expertise\">\n\t\t\t<i aria-hidden=\"true\" class=\"  porto-icon-grid\"><\/i>\t\t\t<\/a>\n\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-1a4bf239 e-con-full e-flex e-con e-child\" data-id=\"1a4bf239\" data-element_type=\"container\">\r\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-2381f0c1 e-con-full e-flex e-con e-child\" data-id=\"2381f0c1\" data-element_type=\"container\">\r\n\t\t\t\t<div class=\"elementor-element elementor-element-3ebe530a elementor-widget__width-auto elementor-widget elementor-widget-post-navigation\" data-id=\"3ebe530a\" data-element_type=\"widget\" data-widget_type=\"post-navigation.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"elementor-post-navigation\">\n\t\t\t<div class=\"elementor-post-navigation__prev elementor-post-navigation__link\">\n\t\t\t\t<a href=\"https:\/\/picamfg.com\/fr\/blindage-emi\/\" rel=\"prev\"><span class=\"post-navigation__arrow-wrapper post-navigation__arrow-prev\"><i class=\"fa fa-chevron-left\" aria-hidden=\"true\"><\/i><span class=\"elementor-screen-only\">Prev<\/span><\/span><span class=\"elementor-post-navigation__link__prev\"><\/span><\/a>\t\t\t<\/div>\n\t\t\t\t\t\t<div class=\"elementor-post-navigation__next elementor-post-navigation__link\">\n\t\t\t\t<a href=\"https:\/\/picamfg.com\/fr\/microvias-borgnes-et-enterrees\/\" rel=\"next\"><span class=\"elementor-post-navigation__link__next\"><\/span><span class=\"post-navigation__arrow-wrapper post-navigation__arrow-next\"><i class=\"fa fa-chevron-right\" aria-hidden=\"true\"><\/i><span class=\"elementor-screen-only\">Next<\/span><\/span><\/a>\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-490af80 elementor-widget elementor-widget-image-carousel\" data-id=\"490af80\" data-element_type=\"widget\" data-settings=\"{&quot;navigation&quot;:&quot;none&quot;,&quot;autoplay&quot;:&quot;no&quot;,&quot;infinite&quot;:&quot;no&quot;,&quot;image_spacing_custom&quot;:{&quot;unit&quot;:&quot;px&quot;,&quot;size&quot;:4,&quot;sizes&quot;:[]},&quot;speed&quot;:500,&quot;image_spacing_custom_tablet&quot;:{&quot;unit&quot;:&quot;px&quot;,&quot;size&quot;:&quot;&quot;,&quot;sizes&quot;:[]},&quot;image_spacing_custom_mobile&quot;:{&quot;unit&quot;:&quot;px&quot;,&quot;size&quot;:&quot;&quot;,&quot;sizes&quot;:[]}}\" data-widget_type=\"image-carousel.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"elementor-image-carousel-wrapper swiper\" role=\"region\" aria-roledescription=\"carousel\" aria-label=\"Image Carousel\" dir=\"ltr\">\n\t\t\t<div class=\"elementor-image-carousel swiper-wrapper\" aria-live=\"polite\">\n\t\t\t\t\t\t\t\t<div class=\"swiper-slide\" role=\"group\" aria-roledescription=\"slide\" aria-label=\"1 sur 3\"><a data-elementor-open-lightbox=\"yes\" data-elementor-lightbox-slideshow=\"490af80\" data-elementor-lightbox-title=\"PICA Manufacturing Solutions - Integrated Circuit Substrate Carrier\" data-e-action-hash=\"#elementor-action%3Aaction%3Dlightbox%26settings%3DeyJpZCI6MTg4OTEsInVybCI6Imh0dHBzOlwvXC9waWNhbWZnLmNvbVwvd3AtY29udGVudFwvdXBsb2Fkc1wvMjAyM1wvMDlcL0lDLVN1YnN0cmF0ZTEuanBnIiwic2xpZGVzaG93IjoiNDkwYWY4MCJ9\" href=\"https:\/\/picamfg.com\/wp-content\/uploads\/2023\/09\/IC-Substrate1.jpg\"><figure class=\"swiper-slide-inner\"><img decoding=\"async\" class=\"swiper-slide-image\" src=\"https:\/\/picamfg.com\/wp-content\/uploads\/2023\/09\/IC-Substrate1-1024x768.jpg\" alt=\"PICA Manufacturing Solutions integrated circuit substrate carrier, showcasing high-precision substrates with low CTE, high Tg, and advanced vias for optimized performance in electronic applications.\" \/><\/figure><\/a><\/div><div class=\"swiper-slide\" role=\"group\" aria-roledescription=\"slide\" aria-label=\"2 sur 3\"><a data-elementor-open-lightbox=\"yes\" data-elementor-lightbox-slideshow=\"490af80\" data-elementor-lightbox-title=\"PICA Manufacturing Solutions - Integrated Circuit Substrate Carrier Design\" data-e-action-hash=\"#elementor-action%3Aaction%3Dlightbox%26settings%3DeyJpZCI6MTg4OTIsInVybCI6Imh0dHBzOlwvXC9waWNhbWZnLmNvbVwvd3AtY29udGVudFwvdXBsb2Fkc1wvMjAyM1wvMDlcL0lDLVN1YnN0cmF0ZTIuanBnIiwic2xpZGVzaG93IjoiNDkwYWY4MCJ9\" href=\"https:\/\/picamfg.com\/wp-content\/uploads\/2023\/09\/IC-Substrate2.jpg\"><figure class=\"swiper-slide-inner\"><img decoding=\"async\" class=\"swiper-slide-image\" src=\"https:\/\/picamfg.com\/wp-content\/uploads\/2023\/09\/IC-Substrate2-1024x768.jpg\" alt=\"PICA Manufacturing Solutions integrated circuit substrate carrier, highlighting advanced materials and precision design with high Tg, low CTE, and optimized vias for enhanced electronic performance.\" \/><\/figure><\/a><\/div><div class=\"swiper-slide\" role=\"group\" aria-roledescription=\"slide\" aria-label=\"3 sur 3\"><a data-elementor-open-lightbox=\"yes\" data-elementor-lightbox-slideshow=\"490af80\" data-elementor-lightbox-title=\"PICA Manufacturing Solutions - Integrated Circuit Substrate Carrier Design\" data-e-action-hash=\"#elementor-action%3Aaction%3Dlightbox%26settings%3DeyJpZCI6MTg4OTMsInVybCI6Imh0dHBzOlwvXC9waWNhbWZnLmNvbVwvd3AtY29udGVudFwvdXBsb2Fkc1wvMjAyM1wvMDlcL0lDLVN1YnN0cmF0ZTMuanBnIiwic2xpZGVzaG93IjoiNDkwYWY4MCJ9\" href=\"https:\/\/picamfg.com\/wp-content\/uploads\/2023\/09\/IC-Substrate3.jpg\"><figure class=\"swiper-slide-inner\"><img decoding=\"async\" class=\"swiper-slide-image\" src=\"https:\/\/picamfg.com\/wp-content\/uploads\/2023\/09\/IC-Substrate3-1024x768.jpg\" alt=\"PICA Manufacturing Solutions integrated circuit substrate carrier, demonstrating advanced substrate designs with high Tg, low CTE, and precision vias for optimal electronic performance and reliability\" \/><\/figure><\/a><\/div>\t\t\t<\/div>\n\t\t\t\t\t\t\t\n\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-d475311 elementor-widget elementor-widget-template\" data-id=\"d475311\" data-element_type=\"widget\" data-widget_type=\"template.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"elementor-template\">\n\t\t\t\t\t<div data-elementor-type=\"section\" data-elementor-id=\"9684\" class=\"elementor elementor-9684\" data-elementor-post-type=\"elementor_library\">\n\t\t\t<div class=\"elementor-element elementor-element-f5ecefe e-flex e-con-boxed e-con e-parent\" data-id=\"f5ecefe\" data-element_type=\"container\">\r\n\t\t\t\t\t<div class=\"e-con-inner\">\r\n\t\t\t\t<div class=\"elementor-element elementor-element-e54765c elementor-widget elementor-widget-html\" data-id=\"e54765c\" data-element_type=\"widget\" data-widget_type=\"html.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<a href=\"https:\/\/picamfg.com\/contact\/\" class=\"contact-button\">\n  <span>CONTACT AN ENGINEER<\/span>\n  <img decoding=\"async\" src=\"https:\/\/picamfg.com\/wp-content\/uploads\/2025\/05\/Contact-Engineer-Button-scaled.png\" alt=\"Customer service\">\n<\/a>\n\n<style>\n  .contact-button {\n    background-color: #1d3a85;\n    color: white;\n    border: none;\n    padding: 10px 23px;\n    font-size: 16px;\n    border-radius: 15px;\n    cursor: pointer;\n    transition: background-color 0.3s ease;\n    box-shadow: 3px 3px 9px rgba(0, 0, 0, 0.7);\n    display: flex;\n    align-items: center;\n    justify-content: space-between;\n    width: 325px;\n    text-decoration: none;\n  }\n\n  .contact-button:hover {\n    background-color: #0056b3;\n  }\n\n  .contact-button img {\n    width: 70px;\n    height: auto;\n    display: block;\n  }\n<\/style>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-4b1a698 e-con-full e-flex e-con e-child\" data-id=\"4b1a698\" data-element_type=\"container\">\r\n\t\t\t\t<div class=\"elementor-element elementor-element-13d94dd elementor-widget elementor-widget-heading\" data-id=\"13d94dd\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">Solutions de substrats et supports pour Circuits Int\u00e9gr\u00e9s (CI)<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-c684a92 elementor-widget elementor-widget-heading\" data-id=\"c684a92\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h4 class=\"elementor-heading-title elementor-size-default\">Architectures haute densit\u00e9 de porteurs de puces pour packaging avanc\u00e9<\/h4>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-e1aef5d elementor-widget elementor-widget-text-editor\" data-id=\"e1aef5d\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>Les supports de substrats pour circuits int\u00e9gr\u00e9s assurent la transition entre la puce nue et le circuit imprim\u00e9, en proposant un routage ultra-fin, des mat\u00e9riaux ultra-fiables et des structures de micro-vias de pr\u00e9cision. <br \/>Chez PICA, nous proposons des porteurs de substrats pour circuits int\u00e9gr\u00e9s optimis\u00e9s pour le packaging compact, la gestion des contraintes thermiques et les interconnexions haute fr\u00e9quence.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/section>\n\t\t<div class=\"elementor-element elementor-element-78d02a4 e-flex e-con-boxed e-con e-parent\" data-id=\"78d02a4\" data-element_type=\"container\">\r\n\t\t\t\t\t<div class=\"e-con-inner\">\r\n\t\t\t\t<div class=\"elementor-element elementor-element-fba610a elementor-widget elementor-widget-heading\" data-id=\"fba610a\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h4 class=\"elementor-heading-title elementor-size-default\">Pourquoi choisir les solutions de substrats et porteurs pour CI ?<\/h4>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-412cb7a elementor-widget elementor-widget-text-editor\" data-id=\"412cb7a\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p><strong>\u2022 Conducteurs ultra-fins \u2013<\/strong> Lignes\/espacements standards \u00e0 30\/30 \u00b5m ; r\u00e9alisations R&amp;D atteignant 20\/20 \u00b5m.<\/p><p><strong>\u2022 Micro-vias de pr\u00e9cision \u2013<\/strong> Diam\u00e8tres de vias jusqu&rsquo;\u00e0 50 \u00b5m gr\u00e2ce aux proc\u00e9d\u00e9s de d\u00e9finition laser.<\/p><p><strong>\u2022 Stabilit\u00e9 thermique et dimensionnelle \u2013<\/strong> Mat\u00e9riaux offrant une Tg de 250-300 \u00b0C et un CTE X\/Y de 2-5 ppm\/\u00b0C.<\/p><p><strong>\u2022 Applications packaging avanc\u00e9 \u2013<\/strong> Parfait pour modules flip-chip, SiP, CSP, SLP et int\u00e9grations haute densit\u00e9.<\/p><p><strong>\u2022 Accompagnement DFM et mat\u00e9riaux en amont \u2013<\/strong> PICA collabore avec les concepteurs en amont pour d\u00e9finir les empilements, le choix des mat\u00e9riaux et des architectures micro-vias, du prototypage \u00e0 la production en s\u00e9rie.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-6b287d1 e-flex e-con-boxed e-con e-parent\" data-id=\"6b287d1\" data-element_type=\"container\">\r\n\t\t\t\t\t<div class=\"e-con-inner\">\r\n\t\t\t\t<div class=\"elementor-element elementor-element-64a72b0 elementor-widget elementor-widget-heading\" data-id=\"64a72b0\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h4 class=\"elementor-heading-title elementor-size-default\">Capacit\u00e9s substrats et porteurs pour circuits int\u00e9gr\u00e9s \u2013 Nos points forts <\/h4>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-eeba4f2 elementor-widget elementor-widget-text-editor\" data-id=\"eeba4f2\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p><strong>\u2022<\/strong> Prise en charge des lignes et espacements de 30\/30 \u00b5m en production standard, et jusqu&rsquo;\u00e0 20\/20 \u00b5m en recherche et d\u00e9veloppement.<\/p><p><strong>\u2022<\/strong> Diam\u00e8tres de vias d\u00e9finis au laser pouvant descendre jusqu&rsquo;\u00e0 50 \u00b5m.<\/p><p><strong>\u2022<\/strong> Mat\u00e9riaux haute performance : syst\u00e8mes de r\u00e9sine BT, substrats c\u00e9ramiques, stratifi\u00e9s \u00e0 Tg \u00e9lev\u00e9e.<\/p><p><strong>\u2022<\/strong> Substrats \u00e0 faible coefficient de dilatation thermique (&lt; 5 ppm\/\u00b0C) et contr\u00f4le dimensionnel rigoureux pour des assemblages ultra-fiables.<\/p><p><strong>\u2022<\/strong> Expertise sp\u00e9cialis\u00e9e pour flip-chip, syst\u00e8mes int\u00e9gr\u00e9s sur puce (SiP) et formats de packaging avanc\u00e9s incluant les PCB de type substrat (SLP).<\/p><p><strong>\u2022<\/strong> Collaboration technique compl\u00e8te de la d\u00e9finition des empilements \u00e0 la fabrication et aux tests pour les plateformes de puces haute densit\u00e9.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-58a30ea e-flex e-con-boxed e-con e-parent\" data-id=\"58a30ea\" data-element_type=\"container\">\r\n\t\t\t\t\t<div class=\"e-con-inner\">\r\n\t\t\t\t<div class=\"elementor-element elementor-element-1f70452 elementor-widget elementor-widget-heading\" data-id=\"1f70452\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h4 class=\"elementor-heading-title elementor-size-default\">Accompagnement international en conception et production<\/h4>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-e8b7942 elementor-widget elementor-widget-text-editor\" data-id=\"e8b7942\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>PICA assure un soutien complet sur l&rsquo;ensemble du cycle de vie \u2014 de l&rsquo;ing\u00e9nierie aux \u00c9tats-Unis jusqu&rsquo;\u00e0 la fabrication avanc\u00e9e, avec une expertise approfondie en architectures de micro-vias, choix de mat\u00e9riaux de substrats et layouts haute densit\u00e9. Notre intervention d\u00e8s la phase initiale du projet permet d&rsquo;harmoniser les choix de mat\u00e9riaux, d&rsquo;\u00e9tablir des empilements haute performance et de garantir des porteurs de substrats fabricables \u00e0 rendements \u00e9lev\u00e9s pour les applications de packaging sophistiqu\u00e9es.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-a4a6d44 e-flex e-con-boxed e-con e-parent\" data-id=\"a4a6d44\" data-element_type=\"container\">\r\n\t\t\t\t\t<div class=\"e-con-inner\">\r\n\t\t<div class=\"elementor-element elementor-element-736091d e-con-full e-flex e-con e-child\" data-id=\"736091d\" data-element_type=\"container\">\r\n\t\t\t\t<div class=\"elementor-element elementor-element-8325d4e elementor-widget elementor-widget-heading\" data-id=\"8325d4e\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h6 class=\"elementor-heading-title elementor-size-default\">Avantages des solutions de substrats et porteurs pour CI<\/h6>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-1d5fb3b elementor-widget elementor-widget-text-editor\" data-id=\"1d5fb3b\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p><strong>Miniaturisation et densit\u00e9 maximales<\/strong> <br \/>Les substrats porteurs pour CI permettent le routage de tr\u00e8s nombreuses entr\u00e9es\/sorties dans un espace r\u00e9duit, des packages compacts, un empilements de puces et des modules multi-puces.<\/p><p><strong>Hautes fr\u00e9quences et int\u00e9grit\u00e9 de signal<\/strong> <br \/>Conducteurs ultra-fins et mat\u00e9riaux haute performance r\u00e9pondant aux exigences rigoureuses de distribution signaux\/alimentation pour applications RF, calcul intensif et haute vitesse.<\/p><p><strong>Fiabilit\u00e9 thermique et dimensionnelle garantie<\/strong> <br \/>Les stratifi\u00e9s \u00e0 Tg \u00e9lev\u00e9e et les substrats \u00e0 faible CTE pr\u00e9servent les int\u00e9grit\u00e9s structurelle et \u00e9lectrique lors des cycles thermiques et des contraintes d&rsquo;assemblage s\u00e9v\u00e8res.<\/p><p><strong>Int\u00e9gration polyvalente<\/strong> <br \/>Des formats PCB classiques aux PCB de type substrat (SLP), modules flip-chip et SiP : les solutions porteurs assurent une transition optimale entre puce et carte gr\u00e2ce \u00e0 des architectures d&rsquo;interconnexion sur mesure.<\/p><p><strong>Production haut rendement<\/strong> <br \/>Production \u00e0 haut rendement \u2013 La d\u00e9finition pr\u00e9coce des r\u00e8gles de conception et des mat\u00e9riaux avec PICA limite les risques, optimise les rendements et garantit des volumes de production pour le packaging avanc\u00e9.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-f0764c4 e-con-full e-flex e-con e-child\" data-id=\"f0764c4\" data-element_type=\"container\">\r\n\t\t\t\t<div class=\"elementor-element elementor-element-17fdcfd elementor-widget elementor-widget-heading\" data-id=\"17fdcfd\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h6 class=\"elementor-heading-title elementor-size-default\">Les secteurs d'application pour nos substrats et porteurs CI<\/h6>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-240a749 elementor-widget elementor-widget-text-editor\" data-id=\"240a749\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p><strong>Calcul haute performance et plateformes serveurs<\/strong> <br \/>Les packages \u00e0 forte densit\u00e9 d&rsquo;entr\u00e9es\/sorties, les modules multi-puces et les porteurs de puces denses b\u00e9n\u00e9ficien pleinement parti de la miniaturisation et de la densit\u00e9 de routage offerte par les substrats porteurs.<\/p><p><strong>\u00c9lectronique mobile et grand public<\/strong> <br \/>Les smartphones premium, les appareils pliables, les objets connect\u00e9s et les dispositifs IoT requi\u00e8rent des porteurs ultra-compacts et haute densit\u00e9 pour int\u00e9grer des fonctionnalit\u00e9s avanc\u00e9es dans des formats innovants.<\/p><p><strong>Syst\u00e8mes automobiles et ADAS<\/strong> <br \/>Les syst\u00e8mes avanc\u00e9s d&rsquo;aide \u00e0 la conduite (ADAS), les concentrateurs de capteurs et les modules de calcul s&rsquo;appuient sur un packaging fiable alliant robustesse thermique et int\u00e9grit\u00e9 du signal \u00e9lev\u00e9e.<\/p><p><strong>R\u00e9seaux et t\u00e9l\u00e9communications<\/strong> <br \/>Les modules 5G\/6G, les transceivers optiques et les cartes r\u00e9seau haute vitesse n\u00e9cessitent des substrats d&rsquo;interconnexion denses avec imp\u00e9dance contr\u00f4l\u00e9e et performances thermiques optimis\u00e9es.<\/p><p><strong>A\u00e9rospatiale, d\u00e9fense et syst\u00e8mes critiques<\/strong> <br \/>Lorsque fiabilit\u00e9, miniaturisation et performances sont imp\u00e9ratives, les substrats porteurs constituent l&rsquo;infrastructure d&rsquo;interconnexion des modules robustes et haute densit\u00e9.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<section class=\"elementor-element elementor-element-19ca9f8 e-flex e-con-boxed e-con e-parent\" data-id=\"19ca9f8\" data-element_type=\"container\">\r\n\t\t\t\t\t<div class=\"e-con-inner\">\r\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/section>\n\t\t\t\t<\/div>\n\t\t","protected":false},"excerpt":{"rendered":"<p>Solutions de substrats et supports pour Circuits Int\u00e9gr\u00e9s (CI) Architectures haute densit\u00e9 de porteurs de puces pour packaging avanc\u00e9 Les supports de substrats pour circuits int\u00e9gr\u00e9s assurent la transition entre la puce nue et le circuit imprim\u00e9, en proposant un routage ultra-fin, des mat\u00e9riaux ultra-fiables et des structures de micro-vias de pr\u00e9cision. Chez PICA, nous&#8230;&nbsp;<a class=\"moretag\" href=\"https:\/\/picamfg.com\/fr\/supports-et-substrats-pour-circuits-integres\/\">READ MORE<\/a><\/p>\n","protected":false},"author":13,"featured_media":18891,"parent":0,"menu_order":122,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_acf_changed":false,"content-type":"","footnotes":""},"tags":[83],"class_list":["post-18890","page","type-page","status-publish","has-post-thumbnail","hentry","tag-expertise"],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.1.1 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>IC Substrate Carriers | Advanced Packaging &amp; HDI Design<\/title>\n<meta name=\"description\" content=\"PICA supports IC substrate carriers with fine-line routing, HDI design, and materials for advanced chip packaging and signal integri\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/picamfg.com\/fr\/supports-et-substrats-pour-circuits-integres\/\" \/>\n<meta property=\"og:locale\" content=\"fr_FR\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"IC Substrate Carriers | Advanced Packaging &amp; HDI Design\" \/>\n<meta property=\"og:description\" content=\"PICA supports IC substrate carriers with fine-line routing, HDI design, and materials for advanced chip packaging and signal integri\" \/>\n<meta property=\"og:url\" content=\"https:\/\/picamfg.com\/fr\/supports-et-substrats-pour-circuits-integres\/\" \/>\n<meta property=\"og:site_name\" content=\"PICA Manufacturing Solutions\" \/>\n<meta property=\"article:publisher\" content=\"https:\/\/www.facebook.com\/Picamfg\" \/>\n<meta property=\"article:modified_time\" content=\"2026-03-24T19:07:52+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/picamfg.com\/wp-content\/uploads\/2023\/09\/IC-Substrate1.jpg\" \/>\n\t<meta property=\"og:image:width\" content=\"2000\" \/>\n\t<meta property=\"og:image:height\" content=\"1500\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/jpeg\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Dur\u00e9e de lecture estim\u00e9e\" \/>\n\t<meta name=\"twitter:data1\" content=\"5 minutes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\/\/schema.org\",\"@graph\":[{\"@type\":\"WebPage\",\"@id\":\"https:\/\/picamfg.com\/fr\/supports-et-substrats-pour-circuits-integres\/\",\"url\":\"https:\/\/picamfg.com\/fr\/supports-et-substrats-pour-circuits-integres\/\",\"name\":\"IC Substrate Carriers | Advanced Packaging & HDI Design\",\"isPartOf\":{\"@id\":\"https:\/\/picamfg.com\/fr\/#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\/\/picamfg.com\/fr\/supports-et-substrats-pour-circuits-integres\/#primaryimage\"},\"image\":{\"@id\":\"https:\/\/picamfg.com\/fr\/supports-et-substrats-pour-circuits-integres\/#primaryimage\"},\"thumbnailUrl\":\"https:\/\/picamfg.com\/wp-content\/uploads\/2023\/09\/IC-Substrate1.jpg\",\"datePublished\":\"2023-09-06T18:29:24+00:00\",\"dateModified\":\"2026-03-24T19:07:52+00:00\",\"description\":\"PICA supports IC substrate carriers with fine-line routing, HDI design, and materials for advanced chip packaging and signal integri\",\"breadcrumb\":{\"@id\":\"https:\/\/picamfg.com\/fr\/supports-et-substrats-pour-circuits-integres\/#breadcrumb\"},\"inLanguage\":\"fr-FR\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\/\/picamfg.com\/fr\/supports-et-substrats-pour-circuits-integres\/\"]}]},{\"@type\":\"ImageObject\",\"inLanguage\":\"fr-FR\",\"@id\":\"https:\/\/picamfg.com\/fr\/supports-et-substrats-pour-circuits-integres\/#primaryimage\",\"url\":\"https:\/\/picamfg.com\/wp-content\/uploads\/2023\/09\/IC-Substrate1.jpg\",\"contentUrl\":\"https:\/\/picamfg.com\/wp-content\/uploads\/2023\/09\/IC-Substrate1.jpg\",\"width\":2000,\"height\":1500,\"caption\":\"PICA Manufacturing Solutions integrated circuit substrate carrier, showcasing high-precision substrates with low CTE, high Tg, and advanced vias for optimized performance in electronic applications.\"},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\/\/picamfg.com\/fr\/supports-et-substrats-pour-circuits-integres\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\/\/picamfg.com\/fr\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"Supports et substrats pour circuits int\u00e9gr\u00e9s\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\/\/picamfg.com\/fr\/#website\",\"url\":\"https:\/\/picamfg.com\/fr\/\",\"name\":\"PICA Manufacturing Solutions\",\"description\":\"Pick a Partner - Not Parts\",\"publisher\":{\"@id\":\"https:\/\/picamfg.com\/fr\/#organization\"},\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\/\/picamfg.com\/fr\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"fr-FR\"},{\"@type\":\"Organization\",\"@id\":\"https:\/\/picamfg.com\/fr\/#organization\",\"name\":\"PICA Manufacturing Solutions\",\"url\":\"https:\/\/picamfg.com\/fr\/\",\"logo\":{\"@type\":\"ImageObject\",\"inLanguage\":\"fr-FR\",\"@id\":\"https:\/\/picamfg.com\/fr\/#\/schema\/logo\/image\/\",\"url\":\"https:\/\/picamfg.com\/wp-content\/uploads\/2023\/07\/pica-manufacturing-solutions.png\",\"contentUrl\":\"https:\/\/picamfg.com\/wp-content\/uploads\/2023\/07\/pica-manufacturing-solutions.png\",\"width\":381,\"height\":154,\"caption\":\"PICA Manufacturing Solutions\"},\"image\":{\"@id\":\"https:\/\/picamfg.com\/fr\/#\/schema\/logo\/image\/\"},\"sameAs\":[\"https:\/\/www.facebook.com\/Picamfg\",\"https:\/\/www.linkedin.com\/company\/pica-manufacturing-solutions\/\"]}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"IC Substrate Carriers | Advanced Packaging & HDI Design","description":"PICA supports IC substrate carriers with fine-line routing, HDI design, and materials for advanced chip packaging and signal integri","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/picamfg.com\/fr\/supports-et-substrats-pour-circuits-integres\/","og_locale":"fr_FR","og_type":"article","og_title":"IC Substrate Carriers | Advanced Packaging & HDI Design","og_description":"PICA supports IC substrate carriers with fine-line routing, HDI design, and materials for advanced chip packaging and signal integri","og_url":"https:\/\/picamfg.com\/fr\/supports-et-substrats-pour-circuits-integres\/","og_site_name":"PICA Manufacturing Solutions","article_publisher":"https:\/\/www.facebook.com\/Picamfg","article_modified_time":"2026-03-24T19:07:52+00:00","og_image":[{"width":2000,"height":1500,"url":"https:\/\/picamfg.com\/wp-content\/uploads\/2023\/09\/IC-Substrate1.jpg","type":"image\/jpeg"}],"twitter_card":"summary_large_image","twitter_misc":{"Dur\u00e9e de lecture estim\u00e9e":"5 minutes"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"WebPage","@id":"https:\/\/picamfg.com\/fr\/supports-et-substrats-pour-circuits-integres\/","url":"https:\/\/picamfg.com\/fr\/supports-et-substrats-pour-circuits-integres\/","name":"IC Substrate Carriers | Advanced Packaging & HDI Design","isPartOf":{"@id":"https:\/\/picamfg.com\/fr\/#website"},"primaryImageOfPage":{"@id":"https:\/\/picamfg.com\/fr\/supports-et-substrats-pour-circuits-integres\/#primaryimage"},"image":{"@id":"https:\/\/picamfg.com\/fr\/supports-et-substrats-pour-circuits-integres\/#primaryimage"},"thumbnailUrl":"https:\/\/picamfg.com\/wp-content\/uploads\/2023\/09\/IC-Substrate1.jpg","datePublished":"2023-09-06T18:29:24+00:00","dateModified":"2026-03-24T19:07:52+00:00","description":"PICA supports IC substrate carriers with fine-line routing, HDI design, and materials for advanced chip packaging and signal integri","breadcrumb":{"@id":"https:\/\/picamfg.com\/fr\/supports-et-substrats-pour-circuits-integres\/#breadcrumb"},"inLanguage":"fr-FR","potentialAction":[{"@type":"ReadAction","target":["https:\/\/picamfg.com\/fr\/supports-et-substrats-pour-circuits-integres\/"]}]},{"@type":"ImageObject","inLanguage":"fr-FR","@id":"https:\/\/picamfg.com\/fr\/supports-et-substrats-pour-circuits-integres\/#primaryimage","url":"https:\/\/picamfg.com\/wp-content\/uploads\/2023\/09\/IC-Substrate1.jpg","contentUrl":"https:\/\/picamfg.com\/wp-content\/uploads\/2023\/09\/IC-Substrate1.jpg","width":2000,"height":1500,"caption":"PICA Manufacturing Solutions integrated circuit substrate carrier, showcasing high-precision substrates with low CTE, high Tg, and advanced vias for optimized performance in electronic applications."},{"@type":"BreadcrumbList","@id":"https:\/\/picamfg.com\/fr\/supports-et-substrats-pour-circuits-integres\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/picamfg.com\/fr\/"},{"@type":"ListItem","position":2,"name":"Supports et substrats pour circuits int\u00e9gr\u00e9s"}]},{"@type":"WebSite","@id":"https:\/\/picamfg.com\/fr\/#website","url":"https:\/\/picamfg.com\/fr\/","name":"PICA Manufacturing Solutions","description":"Pick a Partner - Not Parts","publisher":{"@id":"https:\/\/picamfg.com\/fr\/#organization"},"potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/picamfg.com\/fr\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"fr-FR"},{"@type":"Organization","@id":"https:\/\/picamfg.com\/fr\/#organization","name":"PICA Manufacturing Solutions","url":"https:\/\/picamfg.com\/fr\/","logo":{"@type":"ImageObject","inLanguage":"fr-FR","@id":"https:\/\/picamfg.com\/fr\/#\/schema\/logo\/image\/","url":"https:\/\/picamfg.com\/wp-content\/uploads\/2023\/07\/pica-manufacturing-solutions.png","contentUrl":"https:\/\/picamfg.com\/wp-content\/uploads\/2023\/07\/pica-manufacturing-solutions.png","width":381,"height":154,"caption":"PICA Manufacturing Solutions"},"image":{"@id":"https:\/\/picamfg.com\/fr\/#\/schema\/logo\/image\/"},"sameAs":["https:\/\/www.facebook.com\/Picamfg","https:\/\/www.linkedin.com\/company\/pica-manufacturing-solutions\/"]}]}},"_links":{"self":[{"href":"https:\/\/picamfg.com\/fr\/wp-json\/wp\/v2\/pages\/18890","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/picamfg.com\/fr\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/picamfg.com\/fr\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/picamfg.com\/fr\/wp-json\/wp\/v2\/users\/13"}],"replies":[{"embeddable":true,"href":"https:\/\/picamfg.com\/fr\/wp-json\/wp\/v2\/comments?post=18890"}],"version-history":[{"count":15,"href":"https:\/\/picamfg.com\/fr\/wp-json\/wp\/v2\/pages\/18890\/revisions"}],"predecessor-version":[{"id":20896,"href":"https:\/\/picamfg.com\/fr\/wp-json\/wp\/v2\/pages\/18890\/revisions\/20896"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/picamfg.com\/fr\/wp-json\/wp\/v2\/media\/18891"}],"wp:attachment":[{"href":"https:\/\/picamfg.com\/fr\/wp-json\/wp\/v2\/media?parent=18890"}],"wp:term":[{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/picamfg.com\/fr\/wp-json\/wp\/v2\/tags?post=18890"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}