{"id":18880,"date":"2023-09-06T19:07:32","date_gmt":"2023-09-06T19:07:32","guid":{"rendered":"https:\/\/picamfg.com\/microvias-borgnes-et-enterrees\/"},"modified":"2026-03-24T18:54:16","modified_gmt":"2026-03-24T18:54:16","slug":"microvias-borgnes-et-enterrees","status":"publish","type":"page","link":"https:\/\/picamfg.com\/fr\/microvias-borgnes-et-enterrees\/","title":{"rendered":"Microvias borgnes et enterr\u00e9es"},"content":{"rendered":"\t\t<div data-elementor-type=\"wp-post\" data-elementor-id=\"18880\" class=\"elementor elementor-18880 elementor-7212\" data-elementor-post-type=\"page\">\n\t\t\t\t<section class=\"elementor-element elementor-element-8599005 e-flex e-con-boxed e-con e-parent\" data-id=\"8599005\" data-element_type=\"container\">\r\n\t\t\t\t\t<div class=\"e-con-inner\">\r\n\t\t\t\t<div class=\"elementor-element elementor-element-760954f elementor-widget elementor-widget-template\" data-id=\"760954f\" data-element_type=\"widget\" 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class=\"elementor-element elementor-element-f97e524 e-con-full e-flex e-con e-child\" data-id=\"f97e524\" data-element_type=\"container\">\r\n\t\t\t\t<div class=\"elementor-element elementor-element-2c1c4fb elementor-widget elementor-widget-heading\" data-id=\"2c1c4fb\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">Microvias borgnes et enterr\u00e9s pour interconnexions haute densit\u00e9<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-aa9dffe elementor-widget elementor-widget-heading\" data-id=\"aa9dffe\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h4 class=\"elementor-heading-title elementor-size-default\">Architectures de vias avanc\u00e9es pour circuits imprim\u00e9s compacts et performants<\/h4>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-e1aef5d elementor-widget elementor-widget-text-editor\" data-id=\"e1aef5d\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>Les structures de microvias borgnes, enterr\u00e9s et perc\u00e9s au laser permettent un routage HDI ultra-dense, avec des chemins de signal raccourcis, desc r\u00e9sidus de vias limit\u00e9s, un contr\u00f4le d&rsquo;imp\u00e9dance optimal et une extraction d&rsquo;entr\u00e9es\/sorties accrue sous BGA \u00e0 pas r\u00e9duit. <br \/>Chez PICA, nos processus Build-up HDI associent per\u00e7age laser, m\u00e9tallisation cuivre, lamination s\u00e9quentielle et protection de vias selon la norme IPC-4761 pour livrer des circuits miniaturis\u00e9s et fiables destin\u00e9s aux applications haute fr\u00e9quence, RF et aux environnements s\u00e9v\u00e8res.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/section>\n\t\t<div class=\"elementor-element elementor-element-b2db8b1 e-flex e-con-boxed e-con e-parent\" data-id=\"b2db8b1\" data-element_type=\"container\">\r\n\t\t\t\t\t<div class=\"e-con-inner\">\r\n\t\t\t\t<div class=\"elementor-element elementor-element-7de3f97 elementor-widget elementor-widget-heading\" data-id=\"7de3f97\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h4 class=\"elementor-heading-title elementor-size-default\">Pourquoi choisir les microvias aveugles et enterr\u00e9s ?<\/h4>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-672f9be elementor-widget elementor-widget-text-editor\" data-id=\"672f9be\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p><strong>\u2022 Densit\u00e9 de routage accrue \u2013<\/strong> Multiplication des canaux de pistes et des extractions d&rsquo;entr\u00e9es\/sorties gr\u00e2ce aux microvias empil\u00e9s\/d\u00e9cal\u00e9s<\/p><p><strong>\u2022 Extraction BGA optimale \u2013<\/strong> Compatible avec les via-in-pad, les BGA \u00e0 pas r\u00e9duit, les bo\u00eetiers ondes millim\u00e9triques et le placement HDI sophistiqu\u00e9<\/p><p><strong>\u2022 Int\u00e9grit\u00e9 du signal renforc\u00e9e \u2013<\/strong> Les interconnexions raccourcies limitent les parasites ; les microvias m\u00e9tallis\u00e9s cuivre suppriment les vides et les r\u00e9sidus<\/p><p><strong>\u2022 Gains d&rsquo;espace et \u00e9conomies \u2013<\/strong> Les structures Build-up haute densit\u00e9 r\u00e9duisent le nombre de couches pour obtenir des cartes plus fines, plus l\u00e9g\u00e8res et plus rentables<\/p><p><strong>\u2022 Ma\u00eetrise technologique \u2013<\/strong> N\u00e9cessite des contr\u00f4les de processus pointus : ablation laser, m\u00e9tallisation des vias, lamination multi-noyaux et conformit\u00e9 IPC-4761<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-96070c8 e-flex e-con-boxed e-con e-parent\" data-id=\"96070c8\" data-element_type=\"container\">\r\n\t\t\t\t\t<div class=\"e-con-inner\">\r\n\t\t\t\t<div class=\"elementor-element elementor-element-25fc480 elementor-widget elementor-widget-heading\" data-id=\"25fc480\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h4 class=\"elementor-heading-title elementor-size-default\">Capacit\u00e9s microvias aveugles et enterr\u00e9s \u2013 Nos points forts <\/h4>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-f3e8884 elementor-widget elementor-widget-text-editor\" data-id=\"f3e8884\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p><strong>\u2022<\/strong> Microvias perc\u00e9s au laser atteignant 0,15 mm ou moins pour interconnexions Build-up inter-couches<\/p><p><strong>\u2022<\/strong> Vias aveugles connectant couches superficielles \u00e0 couches internes cibl\u00e9es sans travers\u00e9e compl\u00e8te<\/p><p><strong>\u2022<\/strong> Vias enterr\u00e9s positionn\u00e9s int\u00e9gralement dans des couches internes pour routage HDI sophistiqu\u00e9<\/p><p><strong>\u2022<\/strong> Microvias m\u00e9tallis\u00e9s cuivre empil\u00e9s ou d\u00e9cal\u00e9s formant structures BGA via-in-pad ultra-fiables<\/p><p><strong>\u2022<\/strong> Lamination s\u00e9quentielle et empilements multi-noyaux autorisant densit\u00e9 HDI maximale<\/p><p><strong>\u2022<\/strong> Via-in-pad avec remplissage \u00e9poxy et m\u00e9tallisation capuchon cuivre selon IPC 4761 Type 7<\/p><p><strong>\u2022<\/strong> Ratios g\u00e9om\u00e9triques ma\u00eetris\u00e9s pour assurer une qualit\u00e9 de m\u00e9tallisation optimale<\/p><p><strong>\u2022<\/strong> Validations de la fiabilit\u00e9 avec radiographie, cyclages thermiques, analyses coupes, contr\u00f4les \u00e9lectriques 4 points<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-da2d36f e-flex e-con-boxed e-con e-parent\" data-id=\"da2d36f\" data-element_type=\"container\">\r\n\t\t\t\t\t<div class=\"e-con-inner\">\r\n\t\t\t\t<div class=\"elementor-element elementor-element-633208e elementor-widget elementor-widget-heading\" data-id=\"633208e\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h4 class=\"elementor-heading-title elementor-size-default\">Accompagnement international en conception et production<\/h4>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-3869e55 elementor-widget elementor-widget-text-editor\" data-id=\"3869e55\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>Nous collaborons en amont avec vos \u00e9quipes de conception pour \u00e9tablir les structures HDI, s\u00e9lectionner les protections de vias adapt\u00e9es et optimiser le routage sous les composants BGA. En harmonisant d\u00e8s le d\u00e9part les exigences IPC, les tol\u00e9rances et la fabricabilit\u00e9, nous r\u00e9duisons les risques tant au stade du prototypage qu&rsquo;en production de s\u00e9rie.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-945fbba e-flex e-con-boxed e-con e-parent\" data-id=\"945fbba\" data-element_type=\"container\">\r\n\t\t\t\t\t<div class=\"e-con-inner\">\r\n\t\t<div class=\"elementor-element elementor-element-1ac811d e-con-full e-flex e-con e-child\" data-id=\"1ac811d\" data-element_type=\"container\">\r\n\t\t\t\t<div class=\"elementor-element elementor-element-fb08e26 elementor-widget elementor-widget-heading\" data-id=\"fb08e26\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h6 class=\"elementor-heading-title elementor-size-default\">Avantages des microvias borgnes  et enterr\u00e9s<\/h6>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-013ca82 elementor-widget elementor-widget-text-editor\" data-id=\"013ca82\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p><strong>Interconnexions ultra-denses rendues possibles<\/strong> <br \/>Les microvias autorisent des diam\u00e8tres inf\u00e9rieurs \u00e0 150 microns et r\u00e9duisent le nombre total de couches gr\u00e2ce \u00e0 la suppression du per\u00e7age traversant. Une surface de routage accrue dans un volume r\u00e9duit pour une empreinte de PCB minimis\u00e9e.<\/p><p><strong>Extraction BGA optimale<\/strong><br \/>Le via-in-pad m\u00e9tallis\u00e9 cuivre permet une extraction BGA compacte en \u00e9liminant les routages en \u00e9ventail \u00e9tendus. Parfait pour l&rsquo;informatique compacte, les appareils portables, les modules RF, les packages SOC et l&rsquo;\u00e9lectronique miniature.<\/p><p><strong>Chemins de signal et int\u00e9grit\u00e9 RF am\u00e9lior\u00e9s<\/strong> <br \/>Les microvias remplis de cuivre suppriment les cavit\u00e9s et limitent la r\u00e9sistance et l&rsquo;inductance parasites. Un atout crucial pour les SERDES haute vitesse, les \u00e9quipements 5G ondes millim\u00e9triques et les performances des communications RF.<\/p><p><strong>Formats r\u00e9duits et couches limit\u00e9es<\/strong> <br \/>Les strat\u00e9gies de vias enterr\u00e9s et aveugles diminuent le nombre total de couches tout en pr\u00e9servant la densit\u00e9 du circuit. Des dispositifs plus fins, des co\u00fbts abaiss\u00e9s et des fonctionnalit\u00e9s enrichies.<\/p><p><strong>Production en s\u00e9rie fiable<\/strong> <br \/>Le per\u00e7age laser ma\u00eetris\u00e9, le remplissage r\u00e9sine ou cuivre, les cycles de lamination et les protections certifi\u00e9es IPC garantissent une r\u00e9p\u00e9tabilit\u00e9 HDI constante, des prototypes jusqu&rsquo;aux grandes s\u00e9ries.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-dcb79aa e-con-full e-flex e-con e-child\" data-id=\"dcb79aa\" data-element_type=\"container\">\r\n\t\t\t\t<div class=\"elementor-element elementor-element-70f0e81 elementor-widget elementor-widget-heading\" data-id=\"70f0e81\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h6 class=\"elementor-heading-title elementor-size-default\">Les secteurs d'application pour nos microvias aveugles et enterr\u00e9s<\/h6>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-1aece28 elementor-widget elementor-widget-text-editor\" data-id=\"1aece28\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p><strong>\u00c9lectronique mobile et grand public<br \/><\/strong>Designs HDI miniaturis\u00e9s pour terminaux pliables, syst\u00e8mes sur puce, modules RF compacts et sous-ensembles cam\u00e9ras.<\/p><p><strong>Appareils m\u00e9dicaux<\/strong><br \/>Capteurs implantables, plateformes de monitoring portables et micro\u00e9lectronique haute densit\u00e9 de broches pour lesquelles la fiabilit\u00e9 et la miniaturisation sont critiques.<\/p><p><strong>Automobile et transports<\/strong><br \/>Circuits HDI pour environnements soumis \u00e0 de fortes vibrations et \u00e0 des chocs thermiques, exigeant une tenue m\u00e9canique renforc\u00e9e des vias aveugles et enterr\u00e9s.<\/p><p><strong>T\u00e9l\u00e9communications et infrastructures 5G<\/strong><br \/>Modules ondes millim\u00e9triques, routeurs, cartes de commutation et plateformes traitement signaux RF requ\u00e9rant transitions d&rsquo;imp\u00e9dance optimales.<\/p><p><strong>\u00c9lectronique industrielle et d\u00e9fense<\/strong><br \/>Syst\u00e8mes satellites, calculateurs de vol, drones et modules informatiques contraints en espace n\u00e9cessitant une densit\u00e9 robuste maximale.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-b04fbc3 e-flex e-con-boxed e-con e-parent\" data-id=\"b04fbc3\" data-element_type=\"container\">\r\n\t\t\t\t\t<div class=\"e-con-inner\">\r\n\t\t\t\t<div class=\"elementor-element elementor-element-dce17bc elementor-widget-divider--view-line elementor-widget elementor-widget-divider\" data-id=\"dce17bc\" data-element_type=\"widget\" data-widget_type=\"divider.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"elementor-divider\">\n\t\t\t<span class=\"elementor-divider-separator\">\n\t\t\t\t\t\t<\/span>\n\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<section class=\"elementor-element elementor-element-56e7c63 e-flex e-con-boxed e-con e-parent\" data-id=\"56e7c63\" data-element_type=\"container\">\r\n\t\t\t\t\t<div class=\"e-con-inner\">\r\n\t\t\t\t<div class=\"elementor-element elementor-element-92ae974 elementor-widget elementor-widget-text-editor\" data-id=\"92ae974\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p><strong><a href=\"https:\/\/picamfg.com\/via-protection-white-paper-download\/\">D\u00e9couvrez les vias et leur protection dans nos livres blancs :<\/a><\/strong><\/p><p><a href=\"https:\/\/picamfg.com\/via-protection-white-paper-download\/\">Guide complet de la protection des vias de circuits imprim\u00e9s : strat\u00e9gies et standards.<br \/><\/a><\/p><p><a href=\"http:\/\/The%20Essential%20Guide%20to%20PCB%20Via%20Protection:%20Strategies%20and%20Standards.\" data-wplink-url-error=\"true\">Tout savoir sur les vias : trous traversants, vias aveugles, vias enterr\u00e9s et autres types.<\/a><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/section>\n\t\t<section class=\"elementor-element elementor-element-750ce07 e-flex e-con-boxed e-con e-parent\" data-id=\"750ce07\" data-element_type=\"container\">\r\n\t\t\t\t\t<div class=\"e-con-inner\">\r\n\t\t<div class=\"elementor-element elementor-element-2474e45 e-con-full e-flex e-con e-child\" data-id=\"2474e45\" data-element_type=\"container\">\r\n\t\t\t\t<div class=\"elementor-element elementor-element-2f29ff4 elementor-widget elementor-widget-image\" data-id=\"2f29ff4\" data-element_type=\"widget\" data-widget_type=\"image.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<img fetchpriority=\"high\" decoding=\"async\" width=\"768\" height=\"492\" src=\"https:\/\/picamfg.com\/wp-content\/uploads\/2024\/04\/PICA-Manufacturing-Solutions-WP-768x492.png\" class=\"attachment-medium_large size-medium_large wp-image-18884\" alt=\"Download &#039;The Essential Guide to PCB Via Protection: Strategies and Standards&#039; by Tyson Mortimer, offering comprehensive strategies for protecting PCB vias in electronic manufacturing.\" srcset=\"https:\/\/picamfg.com\/wp-content\/uploads\/2024\/04\/PICA-Manufacturing-Solutions-WP-768x492.png 768w, https:\/\/picamfg.com\/wp-content\/uploads\/2024\/04\/PICA-Manufacturing-Solutions-WP-640x410.png 640w, https:\/\/picamfg.com\/wp-content\/uploads\/2024\/04\/PICA-Manufacturing-Solutions-WP-400x256.png 400w, https:\/\/picamfg.com\/wp-content\/uploads\/2024\/04\/PICA-Manufacturing-Solutions-WP-367x235.png 367w\" sizes=\"(max-width: 768px) 100vw, 768px\" \/>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-02d3a2f elementor-widget elementor-widget-text-editor\" data-id=\"02d3a2f\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>Bien trop souvent, les circuits imprim\u00e9s sont consid\u00e9r\u00e9s comme de simples surfaces planes \u00e0 deux dimensions. Cette simplification excessive est particuli\u00e8rement \u00e9vidente lorsqu&rsquo;on examine la structure complexe des vias. Ces \u00e9l\u00e9ments essentiels sont d\u00e9terminants pour la conception et le fonctionnement de tout circuit imprim\u00e9 multicouche. Sans ces vias, l&rsquo;\u00e9lectronique moderne telle que nous la connaissons aujourd&rsquo;hui ne pourrait exister. Ce document examine l&rsquo;importance de la protection des vias, les recommandations de l&rsquo;Institute for Printed Circuits (IPC), les diff\u00e9rents types de protection, leurs applications, ainsi que les contraintes et arbitrages associ\u00e9s.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-a7b005e elementor-align-center elementor-widget elementor-widget-button\" data-id=\"a7b005e\" data-element_type=\"widget\" data-widget_type=\"button.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div class=\"elementor-button-wrapper\">\n\t\t\t\t\t<a class=\"elementor-button elementor-button-link elementor-size-md\" href=\"https:\/\/picamfg.com\/via-protection-white-paper-download\/\">\n\t\t\t\t\t\t<span class=\"elementor-button-content-wrapper\">\n\t\t\t\t\t\t\t\t\t<span class=\"elementor-button-text\">T\u00e9l\u00e9charger le livre blanc<\/span>\n\t\t\t\t\t<\/span>\n\t\t\t\t\t<\/a>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-37487ec e-con-full e-flex e-con e-child\" data-id=\"37487ec\" data-element_type=\"container\">\r\n\t\t\t\t<div class=\"elementor-element elementor-element-d046b5a elementor-widget elementor-widget-image\" data-id=\"d046b5a\" data-element_type=\"widget\" data-widget_type=\"image.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<img decoding=\"async\" width=\"768\" height=\"910\" src=\"https:\/\/picamfg.com\/wp-content\/uploads\/2025\/02\/Understanding-PCB-Via-Holes-WP-Cover-768x910.png\" class=\"attachment-medium_large size-medium_large wp-image-18885\" alt=\"PICA Manufacturing Solutions White Paper on PCB Via holes cover\" srcset=\"https:\/\/picamfg.com\/wp-content\/uploads\/2025\/02\/Understanding-PCB-Via-Holes-WP-Cover-768x910.png 768w, https:\/\/picamfg.com\/wp-content\/uploads\/2025\/02\/Understanding-PCB-Via-Holes-WP-Cover-640x758.png 640w, https:\/\/picamfg.com\/wp-content\/uploads\/2025\/02\/Understanding-PCB-Via-Holes-WP-Cover-400x474.png 400w, https:\/\/picamfg.com\/wp-content\/uploads\/2025\/02\/Understanding-PCB-Via-Holes-WP-Cover-367x435.png 367w\" sizes=\"(max-width: 768px) 100vw, 768px\" \/>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-665984c elementor-widget elementor-widget-text-editor\" data-id=\"665984c\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>Les circuits imprim\u00e9s (PCB) forment la structure fondamentale des dispositifs \u00e9lectroniques modernes, offrant le support physique n\u00e9cessaire au montage et \u00e0 l&rsquo;interconnexion des composants \u00e9lectroniques. Parmi les \u00e9l\u00e9ments cl\u00e9s de la conception de circuits imprim\u00e9s, les vias \u2014 ces petites perforations permettant les connexions \u00e9lectriques entre les diff\u00e9rentes couches de la carte \u2014 occupent une place centrale. Les vias sont essentiels pour garantir un acheminement optimal des signaux \u00e9lectriques, ma\u00eetriser les performances thermiques et optimiser l&rsquo;utilisation de l&rsquo;espace dans les cartes multicouches complexes.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-3ef6249 elementor-align-center elementor-widget elementor-widget-button\" data-id=\"3ef6249\" data-element_type=\"widget\" data-widget_type=\"button.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div class=\"elementor-button-wrapper\">\n\t\t\t\t\t<a class=\"elementor-button elementor-button-link elementor-size-md\" href=\"https:\/\/picamfg.com\/understanding-pcb-via-holes-white-paper\/\">\n\t\t\t\t\t\t<span class=\"elementor-button-content-wrapper\">\n\t\t\t\t\t\t\t\t\t<span class=\"elementor-button-text\">T\u00e9l\u00e9charger le livre blanc<\/span>\n\t\t\t\t\t<\/span>\n\t\t\t\t\t<\/a>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/section>\n\t\t<div class=\"elementor-element elementor-element-fb07945 e-flex e-con-boxed e-con e-parent\" data-id=\"fb07945\" data-element_type=\"container\">\r\n\t\t\t\t\t<div class=\"e-con-inner\">\r\n\t\t\t\t<div class=\"elementor-element elementor-element-e007e65 elementor-widget-divider--view-line elementor-widget elementor-widget-divider\" data-id=\"e007e65\" data-element_type=\"widget\" data-widget_type=\"divider.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"elementor-divider\">\n\t\t\t<span class=\"elementor-divider-separator\">\n\t\t\t\t\t\t<\/span>\n\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<section class=\"elementor-element elementor-element-ca1ee15 e-flex e-con-boxed e-con e-parent\" data-id=\"ca1ee15\" data-element_type=\"container\">\r\n\t\t\t\t\t<div class=\"e-con-inner\">\r\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/section>\n\t\t\t\t<\/div>\n\t\t","protected":false},"excerpt":{"rendered":"<p>Microvias borgnes et enterr\u00e9s pour interconnexions haute densit\u00e9 Architectures de vias avanc\u00e9es pour circuits imprim\u00e9s compacts et performants Les structures de microvias borgnes, enterr\u00e9s et perc\u00e9s au laser permettent un routage HDI ultra-dense, avec des chemins de signal raccourcis, desc r\u00e9sidus de vias limit\u00e9s, un contr\u00f4le d&rsquo;imp\u00e9dance optimal et une extraction d&rsquo;entr\u00e9es\/sorties accrue sous BGA&#8230;&nbsp;<a class=\"moretag\" href=\"https:\/\/picamfg.com\/fr\/microvias-borgnes-et-enterrees\/\">READ MORE<\/a><\/p>\n","protected":false},"author":13,"featured_media":18881,"parent":0,"menu_order":119,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_acf_changed":false,"content-type":"","footnotes":""},"tags":[83],"class_list":["post-18880","page","type-page","status-publish","has-post-thumbnail","hentry","tag-expertise"],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.1.1 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Blind &amp; Buried Microvias in HDI PCBs | High-Density Design<\/title>\n<meta name=\"description\" content=\"PICA enables high-density PCB designs with blind and buried microvias. 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