{"id":20468,"date":"2023-09-06T19:01:56","date_gmt":"2023-09-06T19:01:56","guid":{"rendered":"https:\/\/picamfg.com\/fineline-pcb-hochdichte-verbindung\/"},"modified":"2026-03-06T21:20:31","modified_gmt":"2026-03-06T21:20:31","slug":"fineline-pcb-hochdichte-verbindung","status":"publish","type":"page","link":"https:\/\/picamfg.com\/de\/fineline-pcb-hochdichte-verbindung\/","title":{"rendered":"Fineline PCB (Hochdichte-Verbindung)"},"content":{"rendered":"\t\t<div data-elementor-type=\"wp-post\" data-elementor-id=\"20468\" class=\"elementor elementor-20468 elementor-7201\" data-elementor-post-type=\"page\">\n\t\t\t\t<section class=\"elementor-element elementor-element-8599005 e-flex e-con-boxed e-con e-parent\" data-id=\"8599005\" data-element_type=\"container\">\r\n\t\t\t\t\t<div class=\"e-con-inner\">\r\n\t\t\t\t<div class=\"elementor-element elementor-element-cbf9d43 elementor-widget elementor-widget-template\" data-id=\"cbf9d43\" data-element_type=\"widget\" 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class=\"e-con-inner\">\r\n\t\t\t\t<div class=\"elementor-element elementor-element-e54765c elementor-widget elementor-widget-html\" data-id=\"e54765c\" data-element_type=\"widget\" data-widget_type=\"html.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<a href=\"https:\/\/picamfg.com\/contact\/\" class=\"contact-button\">\n  <span>CONTACT AN ENGINEER<\/span>\n  <img decoding=\"async\" src=\"https:\/\/picamfg.com\/wp-content\/uploads\/2025\/05\/Contact-Engineer-Button-scaled.png\" alt=\"Customer service\">\n<\/a>\n\n<style>\n  .contact-button {\n    background-color: #1d3a85;\n    color: white;\n    border: none;\n    padding: 10px 23px;\n    font-size: 16px;\n    border-radius: 15px;\n    cursor: pointer;\n    transition: background-color 0.3s ease;\n    box-shadow: 3px 3px 9px rgba(0, 0, 0, 0.7);\n    display: flex;\n    align-items: center;\n    justify-content: space-between;\n    width: 325px;\n    text-decoration: none;\n  }\n\n  .contact-button:hover {\n    background-color: #0056b3;\n  }\n\n  .contact-button img {\n    width: 70px;\n    height: auto;\n    display: block;\n  }\n<\/style>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-ad706da e-con-full e-flex e-con e-child\" data-id=\"ad706da\" data-element_type=\"container\">\r\n\t\t\t\t<div class=\"elementor-element elementor-element-eddc281 elementor-widget elementor-widget-heading\" data-id=\"eddc281\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">Fineline- und HDI-Leiterplatten<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-b15bccb elementor-widget elementor-widget-heading\" data-id=\"b15bccb\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h4 class=\"elementor-heading-title elementor-size-default\">Ultrafeine Rasterteilung, hochdichte Schaltungen f\u00fcr kompakte, leistungsstarke Elektronik<\/h4>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-e1aef5d elementor-widget elementor-widget-text-editor\" data-id=\"e1aef5d\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p><a href=\"https:\/\/blog.picamfg.com\/designing-for-hdi-pcb-and-fine-line-etching-what-you-need-to-know\">Fineline- und HDI-Leiterplatten (High Density Interconnect)<\/a> sind f\u00fcr Miniaturisierung, Hochgeschwindigkeitssignale und hohe Bauteildichte ausgelegt. PICAs fortschrittliche<a href=\"https:\/\/picamfg.com\/de\/products\/gedruckte-leiterplatten-pcbs\/\"> Leiterplatten-<\/a> und <a href=\"https:\/\/picamfg.com\/de\/products\/flexible-leiterplatten-flex-leiterplatte\/\">Flex-Fertigung<\/a> erm\u00f6glicht feinste Leiterbahnbreiten, lasergebohrte Mikro-Vias, ultrad\u00fcnne Dielektrika und mehrlagige Aufbauten, die den Anforderungen moderner Wearables, HF-, Medizin-, Automobil- und Hochfrequenzsysteme gerecht werden.. <\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/section>\n\t\t<div class=\"elementor-element elementor-element-253a348 e-flex e-con-boxed e-con e-parent\" data-id=\"253a348\" data-element_type=\"container\">\r\n\t\t\t\t\t<div class=\"e-con-inner\">\r\n\t\t\t\t<div class=\"elementor-element elementor-element-9a53e97 elementor-widget elementor-widget-heading\" data-id=\"9a53e97\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h4 class=\"elementor-heading-title elementor-size-default\">Warum Fineline-\/HDI-Leiterplatten w\u00e4hlen?<\/h4>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-31f5d29 elementor-widget elementor-widget-text-editor\" data-id=\"31f5d29\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>\u2022 \u00dcberlegene Komponentendichte \u2013 Erm\u00f6glicht die Integration von mehr Ein-\/Ausg\u00e4ngen und Funktionalit\u00e4t auf kleinerem Raum.<br><br data-start=\"956\" data-end=\"959\">\u2022 Ultrafeine Leiterbahnf\u00fchrung \u2013 Erreichen von Linien-\/Abstandsbreiten bis zu 25\u201350 \u00b5m durch subtraktive oder mSAP\/mSAP-\u00e4hnliche Verfahren.<br><br data-start=\"1083\" data-end=\"1086\">\u2022 Unterst\u00fctzung f\u00fcr Micro-Vias und Via-in-Pads \u2013 Lasergebohrte Micro-Vias, gestapelt oder versetzt, erm\u00f6glichen die Leitungsf\u00fchrung aus dichten BGAs und Geh\u00e4usen mit hoher Pin-Anzahl.<br><br data-start=\"1238\" data-end=\"1241\">\u2022 Hohe Geschwindigkeit &amp; HF-taugliche Leistung \u2013 <a href=\"https:\/\/picamfg.com\/de\/impedanzkontrolle\/\">Kontrollierte Impedanz<\/a>, ultrad\u00fcnne Dielektrika (bis zu 12\u201325 \u00b5m) und verlustarme Materialien unterst\u00fctzen Hochfrequenz- und Mixed-Signal-Designs.<br><br data-start=\"1424\" data-end=\"1427\">\u2022 Herstellbarkeit und Zuverl\u00e4ssigkeit \u2013 Fr\u00fchzeitige Einbindung des <a href=\"https:\/\/blog.picamfg.com\/the-dfm-design-for-manufacturing-dilemma\">DFM<\/a>-Ansatzes, strenge \u00c4tzkontrolle und 100% AOI gew\u00e4hrleisten hohe Ausbeuten bei Feinstruktur-Aufbauten.<br><br data-start=\"1565\" data-end=\"1568\">\u2022 Flex-HDI &amp;<a href=\"https:\/\/picamfg.com\/de\/dynamischer-flex\/\"> Dynamic-Flex<\/a> Optionen \u2013 Kombinieren Sie flexible Arme mit HDI-Kernen oder sogar dynamisch-flexible Feinlinienabschnitte f\u00fcr bewegliche Anwendungen.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-7a6c129 e-flex e-con-boxed e-con e-parent\" data-id=\"7a6c129\" data-element_type=\"container\">\r\n\t\t\t\t\t<div class=\"e-con-inner\">\r\n\t\t\t\t<div class=\"elementor-element elementor-element-1976189 elementor-widget elementor-widget-heading\" data-id=\"1976189\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h4 class=\"elementor-heading-title elementor-size-default\">Fineline PCB-Funktionen \u2013 Highlights<\/h4>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-242ca42 elementor-widget elementor-widget-text-editor\" data-id=\"242ca42\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>\u2022 Laser Direct Imaging (LDI) f\u00fcr Linien\/Abst\u00e4nde \u22481 mil (\u224825 \u00b5m) in <a href=\"https:\/\/picamfg.com\/de\/products\/starrflex-leiterplatten-starrflex-pcb\/\">starren,<\/a> flexiblen und starr-flexiblen Konstruktionen.<br><br data-start=\"1861\" data-end=\"1864\">\u2022 Ultrad\u00fcnne Kupferoptionen, einschlie\u00dflich walzgegl\u00fchter (RA) und d\u00fcnner elektrolytischer Folien f\u00fcr eine verbesserte Feinleitungsf\u00fchrung und Biegezuverl\u00e4ssigkeit.<br><br data-start=\"2007\" data-end=\"2010\">\u2022 Mehrfach aufgebaute HDI-Stack-ups wie 1+N+1, 2+N+2 und flexible HDI-Aufbaustrukturen.<br><br data-start=\"2103\" data-end=\"2106\">\u2022 Blind-, vergrabene, gestapelte und versetzte Mikro-Vias \u2264 0,15 mm mit Kupferf\u00fcllung und Via-in-Pad-Optionen.<br><br data-start=\"2210\" data-end=\"2213\">\u2022 Modifiziertes semi-additives Verfahren (mSAP \/ mSAP-\u00e4hnlich) f\u00fcr&lt;50 \u00b5m Feinlinienf\u00fchrung und kontrollierte Seitenwandgeometrie.<br><br data-start=\"2331\" data-end=\"2334\">\u2022 D\u00fcnne dielektrische Materialien (bis zu ~12\u201325 \u00b5m) f\u00fcr Impedanzziele, HF-Leistung und kompakte Leiterbahntrennung.<br><br data-start=\"2454\" data-end=\"2457\">\u2022 Integrierte starr-flexible HDI-, dynamisch flexible + Feinlinien-Hybrid-Designs und D\u00fcnnkernoptionen f\u00fcr raue Umgebungen.<br><br data-start=\"2576\" data-end=\"2579\">\u2022 Inspektion &amp; Qualit\u00e4tssicherung: <a href=\"https:\/\/blog.picamfg.com\/omron-aoi-blog\">AOI,<\/a> <a href=\"https:\/\/picamfg.com\/expertise\/x-ray-inspection-on-site-service\/\">R\u00f6ntgen<\/a>, Flying Probe, Impedanzpr\u00fcfung und Mikroschnittanalyse.<br><br data-start=\"2694\" data-end=\"2697\">\u2022 Technische Unterst\u00fctzung: fr\u00fchzeitige Layoutpr\u00fcfung, Optimierung des Schichtaufbaus, Mikro-Via-Strategie, Zuverl\u00e4ssigkeitsmodellierung und Materialauswahl.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-c99cb12 e-flex e-con-boxed e-con e-parent\" data-id=\"c99cb12\" data-element_type=\"container\">\r\n\t\t\t\t\t<div class=\"e-con-inner\">\r\n\t\t\t\t<div class=\"elementor-element elementor-element-7b702d7 elementor-widget-divider--view-line elementor-widget elementor-widget-divider\" data-id=\"7b702d7\" data-element_type=\"widget\" data-widget_type=\"divider.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"elementor-divider\">\n\t\t\t<span class=\"elementor-divider-separator\">\n\t\t\t\t\t\t<\/span>\n\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<section class=\"elementor-element elementor-element-202d954 e-flex e-con-boxed e-con e-parent\" data-id=\"202d954\" data-element_type=\"container\">\r\n\t\t\t\t\t<div class=\"e-con-inner\">\r\n\t\t\t\t<div class=\"elementor-element elementor-element-5746e55 elementor-widget elementor-widget-text-editor\" data-id=\"5746e55\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<h3>F\u00fcr technische Informationen zu den Fineline Flex PCB-Funktionen von PICA klicken Sie auf die Schaltfl\u00e4che unten. <\/h3>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/section>\n\t\t<section class=\"elementor-element elementor-element-650f2fc e-flex e-con-boxed e-con e-parent\" data-id=\"650f2fc\" data-element_type=\"container\">\r\n\t\t\t\t\t<div class=\"e-con-inner\">\r\n\t\t\t\t<div class=\"elementor-element elementor-element-c5a7cc5 elementor-widget elementor-widget-porto_button\" data-id=\"c5a7cc5\" data-element_type=\"widget\" data-settings=\"{&quot;align&quot;:&quot;center&quot;}\" data-widget_type=\"porto_button.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<a class=\"btn btn-lg btn-primary btn-modern\" href=\"https:\/\/picamfg.com\/de\/fineline-flex-pcb-faehigkeiten\/\"><span >Technische Informationen <\/span><\/a>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/section>\n\t\t<div class=\"elementor-element elementor-element-39e2f0f e-flex e-con-boxed e-con e-parent\" data-id=\"39e2f0f\" data-element_type=\"container\">\r\n\t\t\t\t\t<div class=\"e-con-inner\">\r\n\t\t\t\t<div class=\"elementor-element elementor-element-3f65ef7 elementor-widget-divider--view-line elementor-widget elementor-widget-divider\" data-id=\"3f65ef7\" data-element_type=\"widget\" data-widget_type=\"divider.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"elementor-divider\">\n\t\t\t<span class=\"elementor-divider-separator\">\n\t\t\t\t\t\t<\/span>\n\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-d169c0a e-flex e-con-boxed e-con e-parent\" data-id=\"d169c0a\" data-element_type=\"container\">\r\n\t\t\t\t\t<div class=\"e-con-inner\">\r\n\t\t\t\t<div class=\"elementor-element elementor-element-42e57dc elementor-widget elementor-widget-heading\" data-id=\"42e57dc\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h4 class=\"elementor-heading-title elementor-size-default\">Globale Unterst\u00fctzung f\u00fcr Design und Fertigung<\/h4>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-5b9a3ad elementor-widget elementor-widget-text-editor\" data-id=\"5b9a3ad\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p data-start=\"2958\" data-end=\"3341\">Mit Entwicklungsteams in den USA und Fertigung in Malaysia unterst\u00fctzt PICA Prototypen bis hin zur Serienproduktion. Wir arbeiten fr\u00fchzeitig zusammen, um die Leiterbahnstruktur zu optimieren, verlustarme Materialien auszuw\u00e4hlen, die Mikro-Via-Strategie zu verfeinern, Leitungs- und Platzbeschr\u00e4nkungen zu minimieren und die Impedanz von Anfang an zu kontrollieren. Dies verhindert Kosten\u00fcberschreitungen, verbessert die Ausbeute und beschleunigt die Markteinf\u00fchrung hochdichter Bauteile.  <\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-3749e9c e-flex e-con-boxed e-con e-parent\" data-id=\"3749e9c\" data-element_type=\"container\">\r\n\t\t\t\t\t<div class=\"e-con-inner\">\r\n\t\t<div class=\"elementor-element elementor-element-4265386 e-con-full e-flex e-con e-child\" data-id=\"4265386\" data-element_type=\"container\">\r\n\t\t\t\t<div class=\"elementor-element elementor-element-026e0a5 elementor-widget elementor-widget-heading\" data-id=\"026e0a5\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h6 class=\"elementor-heading-title elementor-size-default\">Vorteile von Fineline-\/HDI-Schaltungen<\/h6>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-4c85126 elementor-widget elementor-widget-text-editor\" data-id=\"4c85126\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p data-start=\"3392\" data-end=\"3421\">Hochdichte Designs<br>Fineline\/HDI-Aufbauten erm\u00f6glichen eine h\u00f6here Leiterbahndichte und Bauteilplatzierung in kleineren Formfaktoren \u2013 ideal f\u00fcr kompakte HF-, Sensor- und Hochgeschwindigkeitsmodule.<\/p><p data-start=\"3576\" data-end=\"3610\">Verbesserte Signalintegrit\u00e4t<br>Ultrad\u00fcnne Dielektrika, enge Leiterbahnabst\u00e4nde und pr\u00e4zises \u00c4tzen verbessern die Impedanzgenauigkeit, reduzieren die Verzerrung und erhalten verlustarme \u00dcbertragungswege aufrecht.<\/p><p data-start=\"3760\" data-end=\"3790\">Miniaturisierungsbereit<br>Leiterbahnen unter 50 \u00b5m und gestapelte Mikro-Vias erm\u00f6glichen kleinere Platinen, mehr Funktionen und leichtere Baugruppen ohne Einbu\u00dfen bei der Zuverl\u00e4ssigkeit.<\/p><p data-start=\"3926\" data-end=\"3959\">Fertigungseffizienz<br>Kontrolliertes \u00c4tzen, LDI, Kupferf\u00fcllung von Via-in-Pads und automatisierte Inspektion sorgen f\u00fcr eine hohe Erstausbeute und minimalen Ausschuss \u2013 wodurch die Gesamtkosten gesenkt werden.<\/p><p data-start=\"4106\" data-end=\"4131\">Doppelte Flexibilit\u00e4t<br>HDI ist nicht auf starre Leiterplatten beschr\u00e4nkt. PICA unterst\u00fctzt starr-flexible HDI- und dynamisch-flexible Feinstruktur-Aufbauten und erm\u00f6glicht so Bewegung und Dichte in einem Schaltkreis. <\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-9eb5add e-con-full e-flex e-con e-child\" data-id=\"9eb5add\" data-element_type=\"container\">\r\n\t\t\t\t<div class=\"elementor-element elementor-element-c2a2b15 elementor-widget elementor-widget-heading\" data-id=\"c2a2b15\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h6 class=\"elementor-heading-title elementor-size-default\">M\u00e4rkte, die wir mit Fineline-\/HDI-Schaltungen bedienen<\/h6>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-a424bbd elementor-widget elementor-widget-text-editor\" data-id=\"a424bbd\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p data-start=\"4312\" data-end=\"4480\"><a href=\"https:\/\/picamfg.com\/wearables-market\/\">Mobile und tragbare Ger\u00e4te <\/a><br data-start=\"4341\" data-end=\"4344\">Faltbare, kompakte Wearables und IoT-Module ben\u00f6tigen ultradichte Leiterplattenfl\u00e4chen und pr\u00e4zise Verbindungen \u2013 ideal f\u00fcr HDI und flexibles HDI.<\/p><p data-start=\"4482\" data-end=\"4642\"><a href=\"https:\/\/picamfg.com\/medical-market\/\">Medizinprodukte<\/a><br data-start=\"4501\" data-end=\"4504\">Miniaturisierte Sensoren, Implantate und Mikrobaugruppen erfordern ultrafeine Leiterbahnf\u00fchrung, kontrollierte Impedanz und hochzuverl\u00e4ssige Mikro-Vias.<\/p><p data-start=\"4644\" data-end=\"4809\"><a href=\"https:\/\/picamfg.com\/automotive-market\/\">Automobil &amp; Transportwesen<\/a><br data-start=\"4675\" data-end=\"4678\">ADAS-Module, Radarsysteme und Steuerungssysteme f\u00fcr raue Umgebungen profitieren von feinlinigem HDI, das Vibrationen und thermischer Belastung standh\u00e4lt.<\/p><p data-start=\"4811\" data-end=\"4986\"><a href=\"https:\/\/picamfg.com\/communications-market\/\">Telekommunikation &amp; 5G-Infrastruktur<\/a><br data-start=\"4853\" data-end=\"4856\">HF-Module, mmWave-Antennenarrays und Interposer erfordern ultrad\u00fcnne Dielektrika, feine Leitungsf\u00fchrung und stabile Impedanzkontrolle.<\/p><p data-start=\"4988\" data-end=\"5165\"><a href=\"https:\/\/picamfg.com\/industrial-electronics\/\">Industrieelektronik &amp; Verteidigungselektronik<\/a><br data-start=\"5024\" data-end=\"5027\">Robuste Systeme in UAVs, der Luft- und Raumfahrt sowie in hochdichten Sensormodulen erfordern h\u00f6chste Langlebigkeit, Zuverl\u00e4ssigkeit und extreme Miniaturisierung.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-b9c4b9c e-flex e-con-boxed e-con e-parent\" data-id=\"b9c4b9c\" data-element_type=\"container\">\r\n\t\t\t\t\t<div class=\"e-con-inner\">\r\n\t\t\t\t<div class=\"elementor-element elementor-element-e96c088 elementor-widget elementor-widget-spacer\" data-id=\"e96c088\" data-element_type=\"widget\" data-widget_type=\"spacer.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"elementor-spacer\">\n\t\t\t<div class=\"elementor-spacer-inner\"><\/div>\n\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-e9ae9be elementor-widget elementor-widget-text-editor\" data-id=\"e9ae9be\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>Die unten aufgef\u00fchrten Blogs erweitern den Inhalt dieser Seite und bieten detaillierte Einblicke in spezifische Design-, Fertigungs- und Anwendungsthemen, die Ingenieuren und Entscheidungstr\u00e4gern zus\u00e4tzliche Relevanz und einen tieferen Kontext bieten.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-844ccec elementor-widget elementor-widget-spacer\" data-id=\"844ccec\" data-element_type=\"widget\" data-widget_type=\"spacer.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"elementor-spacer\">\n\t\t\t<div class=\"elementor-spacer-inner\"><\/div>\n\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<section class=\"elementor-element elementor-element-636eb83 e-flex e-con-boxed e-con e-parent\" data-id=\"636eb83\" data-element_type=\"container\">\r\n\t\t\t\t\t<div class=\"e-con-inner\">\r\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/section>\n\t\t\t\t<\/div>\n\t\t","protected":false},"excerpt":{"rendered":"<p>Fineline- und HDI-Leiterplatten Ultrafeine Rasterteilung, hochdichte Schaltungen f\u00fcr kompakte, leistungsstarke Elektronik Fineline- und HDI-Leiterplatten (High Density Interconnect) sind f\u00fcr Miniaturisierung, Hochgeschwindigkeitssignale und hohe Bauteildichte ausgelegt. PICAs fortschrittliche Leiterplatten- und Flex-Fertigung erm\u00f6glicht feinste Leiterbahnbreiten, lasergebohrte Mikro-Vias, ultrad\u00fcnne Dielektrika und mehrlagige Aufbauten, die den Anforderungen moderner Wearables, HF-, Medizin-, Automobil- und Hochfrequenzsysteme gerecht werden.. Warum Fineline-\/HDI-Leiterplatten w\u00e4hlen?&#8230;&nbsp;<a class=\"moretag\" href=\"https:\/\/picamfg.com\/de\/fineline-pcb-hochdichte-verbindung\/\">READ MORE<\/a><\/p>\n","protected":false},"author":13,"featured_media":20469,"parent":0,"menu_order":117,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_acf_changed":false,"content-type":"","footnotes":""},"tags":[84],"class_list":["post-20468","page","type-page","status-publish","has-post-thumbnail","hentry","tag-sachverstand"],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.1.1 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Fineline PCB | HDI PCB-Elektronikfertigung<\/title>\n<meta name=\"description\" content=\"HDI-Leiterplatten bieten Platz f\u00fcr zahlreiche Bauteile mit komplexen Kupferleiterbahnen und Durchkontaktierungen und optimieren so die Signal- und Strom\u00fcbertragung.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/picamfg.com\/de\/fineline-pcb-hochdichte-verbindung\/\" \/>\n<meta property=\"og:locale\" content=\"de_DE\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Fineline PCB | HDI PCB-Elektronikfertigung\" \/>\n<meta property=\"og:description\" content=\"HDI-Leiterplatten bieten Platz f\u00fcr zahlreiche Bauteile mit komplexen Kupferleiterbahnen und Durchkontaktierungen und optimieren so die Signal- und Strom\u00fcbertragung.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/picamfg.com\/de\/fineline-pcb-hochdichte-verbindung\/\" \/>\n<meta property=\"og:site_name\" content=\"PICA Manufacturing Solutions\" \/>\n<meta property=\"article:publisher\" content=\"https:\/\/www.facebook.com\/Picamfg\" \/>\n<meta property=\"article:modified_time\" content=\"2026-03-06T21:20:31+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/picamfg.com\/wp-content\/uploads\/2023\/09\/HDI-PCB-1-1.jpg\" \/>\n\t<meta property=\"og:image:width\" content=\"2000\" \/>\n\t<meta property=\"og:image:height\" content=\"1500\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/jpeg\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Gesch\u00e4tzte Lesezeit\" \/>\n\t<meta name=\"twitter:data1\" content=\"5\u00a0Minuten\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\/\/schema.org\",\"@graph\":[{\"@type\":\"WebPage\",\"@id\":\"https:\/\/picamfg.com\/de\/fineline-pcb-hochdichte-verbindung\/\",\"url\":\"https:\/\/picamfg.com\/de\/fineline-pcb-hochdichte-verbindung\/\",\"name\":\"Fineline PCB | HDI PCB-Elektronikfertigung\",\"isPartOf\":{\"@id\":\"https:\/\/picamfg.com\/de\/#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\/\/picamfg.com\/de\/fineline-pcb-hochdichte-verbindung\/#primaryimage\"},\"image\":{\"@id\":\"https:\/\/picamfg.com\/de\/fineline-pcb-hochdichte-verbindung\/#primaryimage\"},\"thumbnailUrl\":\"https:\/\/picamfg.com\/wp-content\/uploads\/2023\/09\/HDI-PCB-1-1.jpg\",\"datePublished\":\"2023-09-06T19:01:56+00:00\",\"dateModified\":\"2026-03-06T21:20:31+00:00\",\"description\":\"HDI-Leiterplatten bieten Platz f\u00fcr zahlreiche Bauteile mit komplexen Kupferleiterbahnen und Durchkontaktierungen und optimieren so die Signal- und Strom\u00fcbertragung.\",\"breadcrumb\":{\"@id\":\"https:\/\/picamfg.com\/de\/fineline-pcb-hochdichte-verbindung\/#breadcrumb\"},\"inLanguage\":\"de\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\/\/picamfg.com\/de\/fineline-pcb-hochdichte-verbindung\/\"]}]},{\"@type\":\"ImageObject\",\"inLanguage\":\"de\",\"@id\":\"https:\/\/picamfg.com\/de\/fineline-pcb-hochdichte-verbindung\/#primaryimage\",\"url\":\"https:\/\/picamfg.com\/wp-content\/uploads\/2023\/09\/HDI-PCB-1-1.jpg\",\"contentUrl\":\"https:\/\/picamfg.com\/wp-content\/uploads\/2023\/09\/HDI-PCB-1-1.jpg\",\"width\":2000,\"height\":1500,\"caption\":\"PICA Manufacturing Solutions Fineline PCB \/ High Density Interconnect (HDI) showcasing advanced technology with intricate copper traces and vias for efficient signal transmission and compact, high-performance electronic devices\"},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\/\/picamfg.com\/de\/fineline-pcb-hochdichte-verbindung\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\/\/picamfg.com\/de\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"Fineline PCB (Hochdichte-Verbindung)\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\/\/picamfg.com\/de\/#website\",\"url\":\"https:\/\/picamfg.com\/de\/\",\"name\":\"PICA Manufacturing Solutions\",\"description\":\"Pick a Partner - 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