{"id":20442,"date":"2023-09-06T18:29:24","date_gmt":"2023-09-06T18:29:24","guid":{"rendered":"https:\/\/picamfg.com\/traeger-fuer-integrierte-schaltungen\/"},"modified":"2026-03-17T18:26:29","modified_gmt":"2026-03-17T18:26:29","slug":"traeger-fuer-integrierte-schaltungen","status":"publish","type":"page","link":"https:\/\/picamfg.com\/de\/traeger-fuer-integrierte-schaltungen\/","title":{"rendered":"Tr\u00e4ger f\u00fcr integrierte Schaltungen"},"content":{"rendered":"\t\t<div data-elementor-type=\"wp-post\" data-elementor-id=\"20442\" class=\"elementor elementor-20442 elementor-7160\" data-elementor-post-type=\"page\">\n\t\t\t\t<section class=\"elementor-element elementor-element-8599005 e-flex e-con-boxed e-con e-parent\" data-id=\"8599005\" data-element_type=\"container\">\r\n\t\t\t\t\t<div class=\"e-con-inner\">\r\n\t\t\t\t<div class=\"elementor-element elementor-element-a9b7f9b elementor-widget elementor-widget-template\" data-id=\"a9b7f9b\" data-element_type=\"widget\" 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}\n<\/style>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-4b1a698 e-con-full e-flex e-con e-child\" data-id=\"4b1a698\" data-element_type=\"container\">\r\n\t\t\t\t<div class=\"elementor-element elementor-element-13d94dd elementor-widget elementor-widget-heading\" data-id=\"13d94dd\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">IC-Substrat- und Tr\u00e4gerl\u00f6sungen<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-c684a92 elementor-widget elementor-widget-heading\" data-id=\"c684a92\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h4 class=\"elementor-heading-title elementor-size-default\">Hochdichte Chip-Tr\u00e4ger-Architekturen f\u00fcr fortschrittliche Verpackungen<\/h4>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-e1aef5d elementor-widget elementor-widget-text-editor\" data-id=\"e1aef5d\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>IC-Substrattr\u00e4ger schlie\u00dfen die L\u00fccke zwischen Chip und <a href=\"https:\/\/picamfg.com\/de\/products\/gedruckte-leiterplatten-pcbs\/\">Leiterplatte<\/a> und erm\u00f6glichen ultrafeine Leiterbahnf\u00fchrung, hochzuverl\u00e4ssige Materialien und pr\u00e4zise Mikro-Via-Architekturen. PICA bietet IC-Substrattr\u00e4ger f\u00fcr kompakte Geh\u00e4use, thermische Spannungsreduzierung und Hochfrequenzverbindungen. <\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/section>\n\t\t<div class=\"elementor-element elementor-element-78d02a4 e-flex e-con-boxed e-con e-parent\" data-id=\"78d02a4\" data-element_type=\"container\">\r\n\t\t\t\t\t<div class=\"e-con-inner\">\r\n\t\t\t\t<div class=\"elementor-element elementor-element-fba610a elementor-widget elementor-widget-heading\" data-id=\"fba610a\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h4 class=\"elementor-heading-title elementor-size-default\">Warum IC-Substrat- und Tr\u00e4gerl\u00f6sungen w\u00e4hlen? <\/h4>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-412cb7a elementor-widget elementor-widget-text-editor\" data-id=\"412cb7a\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>\u2022 Ultrafeine Leiter \u2013 Typische Leiterquerschnitte bis zu 30\/30 \u00b5m; F&amp;E entwickelt bis zu 20\/20 \u00b5m.<\/p><p>\u2022 Mikro-Via-Pr\u00e4zision \u2013 Via-Durchmesser bis hinunter zu 50 \u00b5m durch laserdefinierte Prozesse.<\/p><p>\u2022 Thermische und Dimensionsstabilit\u00e4t \u2013 Materialien mit einer Glas\u00fcbergangstemperatur (Tg) im Bereich von 250-300 \u00b0C und einem W\u00e4rmeausdehnungskoeffizienten (CTE) in X\/Y-Richtung von nur 2-5 ppm\/\u00b0C.<\/p><p>\u2022 Anwendungen f\u00fcr fortschrittliche Geh\u00e4use \u2013 Ideal f\u00fcr Flip-Chip-Module, SiP, CSP, SLP und andere hochdichte Integrationen.<\/p><p>\u2022 Fr\u00fche DFM- und Materialunterst\u00fctzung \u2013 PICA arbeitet mit Konstruktionsingenieuren zusammen, um Schichtaufbauten, Materialsets und Mikro-Via-Architekturen vom Konzept bis zur Produktion zu definieren.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-6b287d1 e-flex e-con-boxed e-con e-parent\" data-id=\"6b287d1\" data-element_type=\"container\">\r\n\t\t\t\t\t<div class=\"e-con-inner\">\r\n\t\t\t\t<div class=\"elementor-element elementor-element-64a72b0 elementor-widget elementor-widget-heading\" data-id=\"64a72b0\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h4 class=\"elementor-heading-title elementor-size-default\"> IC-Substrat- und Tr\u00e4gerf\u00e4higkeiten \u2013 Highlights<\/h4>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-eeba4f2 elementor-widget elementor-widget-text-editor\" data-id=\"eeba4f2\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>\u2022 Unterst\u00fctzt Linien-\/Abstandsgeometrien von 30\/30 \u00b5m und Forschung &amp; Entwicklung bis hinunter zu 20\/20 \u00b5m.<\/p><p>\u2022 Laserdefinierte Durchkontaktierungen mit Durchmessern bis zu 50 \u00b5m.<\/p><p>\u2022 Hochleistungsmaterialien: BT-Harzsysteme, Keramiksubstrate, Laminate mit hoher Glas\u00fcbergangstemperatur (Tg).<\/p><p><strong>\u2022<\/strong> Niedriger WAK(&lt; 5 ppm\/\u00b0C) Substrate und pr\u00e4zise Ma\u00dfkontrolle f\u00fcr hochzuverl\u00e4ssige Geh\u00e4use.<\/p><p>\u2022 Spezialisierte Unterst\u00fctzung f\u00fcr Flip-Chip-, SiP- und andere fortschrittliche Geh\u00e4useformate einschlie\u00dflich Substrat-\u00e4hnlicher Leiterplatten (SLP).<\/p><p>\u2022 Zusammenarbeit im Engineering von der Definition des Schichtaufbaus \u00fcber die Fertigung bis hin zum Testen von hochdichten Chipplattformen.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-58a30ea e-flex e-con-boxed e-con e-parent\" data-id=\"58a30ea\" data-element_type=\"container\">\r\n\t\t\t\t\t<div class=\"e-con-inner\">\r\n\t\t\t\t<div class=\"elementor-element elementor-element-1f70452 elementor-widget elementor-widget-heading\" data-id=\"1f70452\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h4 class=\"elementor-heading-title elementor-size-default\">Globale Design- und Fertigungsunterst\u00fctzung<\/h4>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-e8b7942 elementor-widget elementor-widget-text-editor\" data-id=\"e8b7942\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>PICA bietet umfassende Unterst\u00fctzung \u00fcber den gesamten Produktlebenszyklus hinweg \u2013 von der Entwicklung in den USA bis hin zur fortschrittlichen Fertigung \u2013 mit fundierter Expertise in Mikro-Via-Architektur, Substratmaterialauswahl und hochdichtem Layout. Durch die fr\u00fchzeitige Einbindung in das Projekt k\u00f6nnen wir Materials\u00e4tze abstimmen, leistungsstarke Schichtaufbauten definieren und fertigungsgerechte Substrattr\u00e4ger mit hoher Ausbeute f\u00fcr anspruchsvolle Packaging-Anwendungen gew\u00e4hrleisten. <\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-a4a6d44 e-flex e-con-boxed e-con e-parent\" data-id=\"a4a6d44\" data-element_type=\"container\">\r\n\t\t\t\t\t<div class=\"e-con-inner\">\r\n\t\t<div class=\"elementor-element elementor-element-736091d e-con-full e-flex e-con e-child\" data-id=\"736091d\" data-element_type=\"container\">\r\n\t\t\t\t<div class=\"elementor-element elementor-element-8325d4e elementor-widget elementor-widget-heading\" data-id=\"8325d4e\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h6 class=\"elementor-heading-title elementor-size-default\">Vorteile von IC-Substrat- und Tr\u00e4gerl\u00f6sungen<\/h6>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-1d5fb3b elementor-widget elementor-widget-text-editor\" data-id=\"1d5fb3b\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>Miniaturisierung &amp; Dichte<br>Tr\u00e4gersubstrate erm\u00f6glichen die Realisierung einer gro\u00dfen Anzahl von I\/Os auf kleinem Raum und erm\u00f6glichen so kompakte Geh\u00e4use, gestapelte Chips und Multi-Chip-Module.<\/p><p>Hochfrequenz und Signalintegrit\u00e4t<br>Ultrafeine Leiterf\u00fchrung und Hochleistungsmaterialien unterst\u00fctzen anspruchsvolle Anforderungen an die Signal-\/Stromversorgung in HF-, rechenintensiven und Hochgeschwindigkeitsanwendungen.<\/p><p>Thermische und dimensionale Zuverl\u00e4ssigkeit<br>Dank Laminaten mit hoher Glas\u00fcbergangstemperatur (Tg) und Substraten mit niedrigem W\u00e4rmeausdehnungskoeffizienten (CTE) behalten diese Tr\u00e4ger ihre strukturelle und elektrische Integrit\u00e4t auch unter thermischer Belastung und hohen Verpackungsbedingungen bei.<\/p><p>Integrationsflexibilit\u00e4t<br>Von traditionellen Leiterplattenformfaktoren bis hin zu substrat\u00e4hnlichen Leiterplatten (SLP), Flip-Chip- und SiP-Modulen erm\u00f6glichen Ihnen Tr\u00e4gerl\u00f6sungen die Verbindung von Chip und Leiterplatte mit einer optimierten Verbindungsarchitekt<\/p><p>Hohe Fertigungsausbeute<br>Durch die fr\u00fchzeitige Definition von Designregeln und Materialien tr\u00e4gt PICA dazu bei, Risiken zu reduzieren, die Ausbeute zu verbessern und produktionsreife Mengen f\u00fcr fortschrittliche Geh\u00e4use zu unterst\u00fctzen.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-f0764c4 e-con-full e-flex e-con e-child\" data-id=\"f0764c4\" data-element_type=\"container\">\r\n\t\t\t\t<div class=\"elementor-element elementor-element-17fdcfd elementor-widget elementor-widget-heading\" data-id=\"17fdcfd\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h6 class=\"elementor-heading-title elementor-size-default\">M\u00e4rkte, die wir mit IC-Substrat- und Tr\u00e4gerl\u00f6sungen bedienen<\/h6>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-240a749 elementor-widget elementor-widget-text-editor\" data-id=\"240a749\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>M\u00e4rkte, die wir mit IC-Substrat- und Tr\u00e4gerl\u00f6sungen bedienen<\/p><p>Mobilger\u00e4te &amp; <a href=\"https:\/\/picamfg.com\/wearables-market\/\">Unterhaltungselektronik<\/a><br>Premium-Smartphones, Faltger\u00e4te, Wearables und IoT-Ger\u00e4te ben\u00f6tigen ultrakompakte, hochdichte Tr\u00e4ger, um fortschrittliche Funktionen und Formfaktoren zu unterst\u00fctzen.<\/p><p><a href=\"https:\/\/picamfg.com\/automotive-market\/\">Automobil-<\/a> und ADAS-Systeme<br>Fortschrittliche Fahrerassistenzsysteme (ADAS), Sensor-Hubs und Rechenmodule ben\u00f6tigen zuverl\u00e4ssige Geh\u00e4use mit thermischer Robustheit und hoher Signalintegrit\u00e4t.<\/p><p>Netzwerktechnik &amp; <a href=\"https:\/\/picamfg.com\/communications-market\/\">Telekommunikation<\/a><br>5G\/6G-Module, optische Transceiver und Hochgeschwindigkeitsnetzwerkkarten ben\u00f6tigen dichte Verbindungssubstrate mit kontrollierter Impedanz und thermischer Leistung.<\/p><p>Luft- und Raumfahrt, Verteidigung und missionskritische Systeme Wenn Zuverl\u00e4ssigkeit, Miniaturisierung und Leistung unabdingbar sind, bilden Substrattr\u00e4ger das Verbindungsger\u00fcst f\u00fcr robuste Module mit hoher Dichte.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-522c688 e-flex e-con-boxed e-con e-parent\" data-id=\"522c688\" data-element_type=\"container\">\r\n\t\t\t\t\t<div class=\"e-con-inner\">\r\n\t\t\t\t<div class=\"elementor-element elementor-element-a0afb96 elementor-widget elementor-widget-spacer\" data-id=\"a0afb96\" data-element_type=\"widget\" data-widget_type=\"spacer.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"elementor-spacer\">\n\t\t\t<div class=\"elementor-spacer-inner\"><\/div>\n\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-4c4e3aa elementor-widget elementor-widget-spacer\" data-id=\"4c4e3aa\" data-element_type=\"widget\" data-widget_type=\"spacer.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"elementor-spacer\">\n\t\t\t<div class=\"elementor-spacer-inner\"><\/div>\n\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<section class=\"elementor-element elementor-element-19ca9f8 e-flex e-con-boxed e-con e-parent\" data-id=\"19ca9f8\" data-element_type=\"container\">\r\n\t\t\t\t\t<div class=\"e-con-inner\">\r\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/section>\n\t\t\t\t<\/div>\n\t\t","protected":false},"excerpt":{"rendered":"<p>IC-Substrat- und Tr\u00e4gerl\u00f6sungen Hochdichte Chip-Tr\u00e4ger-Architekturen f\u00fcr fortschrittliche Verpackungen IC-Substrattr\u00e4ger schlie\u00dfen die L\u00fccke zwischen Chip und Leiterplatte und erm\u00f6glichen ultrafeine Leiterbahnf\u00fchrung, hochzuverl\u00e4ssige Materialien und pr\u00e4zise Mikro-Via-Architekturen. PICA bietet IC-Substrattr\u00e4ger f\u00fcr kompakte Geh\u00e4use, thermische Spannungsreduzierung und Hochfrequenzverbindungen. Warum IC-Substrat- und Tr\u00e4gerl\u00f6sungen w\u00e4hlen? \u2022 Ultrafeine Leiter \u2013 Typische Leiterquerschnitte bis zu 30\/30 \u00b5m; F&amp;E entwickelt bis zu 20\/20&#8230;&nbsp;<a class=\"moretag\" href=\"https:\/\/picamfg.com\/de\/traeger-fuer-integrierte-schaltungen\/\">READ MORE<\/a><\/p>\n","protected":false},"author":13,"featured_media":20443,"parent":0,"menu_order":121,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_acf_changed":false,"content-type":"","footnotes":""},"tags":[84],"class_list":["post-20442","page","type-page","status-publish","has-post-thumbnail","hentry","tag-sachverstand"],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.1.1 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>IC-Substrattr\u00e4ger | Fortschrittliches Packaging &amp; HDI-Design<\/title>\n<meta name=\"description\" content=\"PICA unterst\u00fctzt IC-Substrattr\u00e4ger mit Feinleitungsf\u00fchrung, HDI-Design und Materialien f\u00fcr fortschrittliche Chipgeh\u00e4use und Signalintegration.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/picamfg.com\/de\/traeger-fuer-integrierte-schaltungen\/\" \/>\n<meta property=\"og:locale\" content=\"de_DE\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"IC-Substrattr\u00e4ger | Fortschrittliches Packaging &amp; HDI-Design\" \/>\n<meta property=\"og:description\" content=\"PICA unterst\u00fctzt IC-Substrattr\u00e4ger mit Feinleitungsf\u00fchrung, HDI-Design und Materialien f\u00fcr fortschrittliche Chipgeh\u00e4use und Signalintegration.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/picamfg.com\/de\/traeger-fuer-integrierte-schaltungen\/\" \/>\n<meta property=\"og:site_name\" content=\"PICA Manufacturing Solutions\" \/>\n<meta property=\"article:publisher\" content=\"https:\/\/www.facebook.com\/Picamfg\" \/>\n<meta property=\"article:modified_time\" content=\"2026-03-17T18:26:29+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/picamfg.com\/wp-content\/uploads\/2023\/09\/IC-Substrate1.jpg\" \/>\n\t<meta property=\"og:image:width\" content=\"2000\" \/>\n\t<meta property=\"og:image:height\" content=\"1500\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/jpeg\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Gesch\u00e4tzte Lesezeit\" \/>\n\t<meta name=\"twitter:data1\" content=\"8\u00a0Minuten\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\/\/schema.org\",\"@graph\":[{\"@type\":\"WebPage\",\"@id\":\"https:\/\/picamfg.com\/de\/traeger-fuer-integrierte-schaltungen\/\",\"url\":\"https:\/\/picamfg.com\/de\/traeger-fuer-integrierte-schaltungen\/\",\"name\":\"IC-Substrattr\u00e4ger | Fortschrittliches Packaging & HDI-Design\",\"isPartOf\":{\"@id\":\"https:\/\/picamfg.com\/de\/#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\/\/picamfg.com\/de\/traeger-fuer-integrierte-schaltungen\/#primaryimage\"},\"image\":{\"@id\":\"https:\/\/picamfg.com\/de\/traeger-fuer-integrierte-schaltungen\/#primaryimage\"},\"thumbnailUrl\":\"https:\/\/picamfg.com\/wp-content\/uploads\/2023\/09\/IC-Substrate1.jpg\",\"datePublished\":\"2023-09-06T18:29:24+00:00\",\"dateModified\":\"2026-03-17T18:26:29+00:00\",\"description\":\"PICA unterst\u00fctzt IC-Substrattr\u00e4ger mit Feinleitungsf\u00fchrung, HDI-Design und Materialien f\u00fcr fortschrittliche Chipgeh\u00e4use und Signalintegration.\",\"breadcrumb\":{\"@id\":\"https:\/\/picamfg.com\/de\/traeger-fuer-integrierte-schaltungen\/#breadcrumb\"},\"inLanguage\":\"de\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\/\/picamfg.com\/de\/traeger-fuer-integrierte-schaltungen\/\"]}]},{\"@type\":\"ImageObject\",\"inLanguage\":\"de\",\"@id\":\"https:\/\/picamfg.com\/de\/traeger-fuer-integrierte-schaltungen\/#primaryimage\",\"url\":\"https:\/\/picamfg.com\/wp-content\/uploads\/2023\/09\/IC-Substrate1.jpg\",\"contentUrl\":\"https:\/\/picamfg.com\/wp-content\/uploads\/2023\/09\/IC-Substrate1.jpg\",\"width\":2000,\"height\":1500,\"caption\":\"PICA Manufacturing Solutions integrated circuit substrate carrier, showcasing high-precision substrates with low CTE, high Tg, and advanced vias for optimized performance in electronic applications.\"},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\/\/picamfg.com\/de\/traeger-fuer-integrierte-schaltungen\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\/\/picamfg.com\/de\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"Tr\u00e4ger f\u00fcr integrierte Schaltungen\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\/\/picamfg.com\/de\/#website\",\"url\":\"https:\/\/picamfg.com\/de\/\",\"name\":\"PICA Manufacturing Solutions\",\"description\":\"Pick a Partner - 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