{"id":20372,"date":"2023-09-06T19:07:32","date_gmt":"2023-09-06T19:07:32","guid":{"rendered":"https:\/\/picamfg.com\/blinde-und-vergrabene-mikrovias\/"},"modified":"2026-03-05T20:46:24","modified_gmt":"2026-03-05T20:46:24","slug":"blinde-und-vergrabene-mikrovias","status":"publish","type":"page","link":"https:\/\/picamfg.com\/de\/blinde-und-vergrabene-mikrovias\/","title":{"rendered":"Blinde und vergrabene Mikrovias"},"content":{"rendered":"\t\t<div data-elementor-type=\"wp-post\" data-elementor-id=\"20372\" class=\"elementor elementor-20372 elementor-7212\" data-elementor-post-type=\"page\">\n\t\t\t\t<section class=\"elementor-element elementor-element-8599005 e-flex e-con-boxed e-con e-parent\" data-id=\"8599005\" data-element_type=\"container\">\r\n\t\t\t\t\t<div class=\"e-con-inner\">\r\n\t\t\t\t<div class=\"elementor-element elementor-element-760954f elementor-widget elementor-widget-template\" data-id=\"760954f\" data-element_type=\"widget\" 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design, showcasing advanced manufacturing techniques to create compact, efficient connections within multiple PCB layers for high-performance devices\" \/><\/figure><\/a><\/div>\t\t\t<\/div>\n\t\t\t\t\t\t\t\n\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-0591f76 elementor-widget elementor-widget-spacer\" data-id=\"0591f76\" data-element_type=\"widget\" data-widget_type=\"spacer.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"elementor-spacer\">\n\t\t\t<div class=\"elementor-spacer-inner\"><\/div>\n\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-449a230 elementor-widget elementor-widget-template\" data-id=\"449a230\" data-element_type=\"widget\" data-widget_type=\"template.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"elementor-template\">\n\t\t\t\t\t<div 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16px;\n    border-radius: 15px;\n    cursor: pointer;\n    transition: background-color 0.3s ease;\n    box-shadow: 3px 3px 9px rgba(0, 0, 0, 0.7);\n    display: flex;\n    align-items: center;\n    justify-content: space-between;\n    width: 325px;\n    text-decoration: none;\n  }\n\n  .contact-button:hover {\n    background-color: #0056b3;\n  }\n\n  .contact-button img {\n    width: 70px;\n    height: auto;\n    display: block;\n  }\n<\/style>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-345e8ab elementor-widget elementor-widget-spacer\" data-id=\"345e8ab\" data-element_type=\"widget\" data-widget_type=\"spacer.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"elementor-spacer\">\n\t\t\t<div class=\"elementor-spacer-inner\"><\/div>\n\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-f97e524 e-con-full e-flex e-con e-child\" data-id=\"f97e524\" data-element_type=\"container\">\r\n\t\t\t\t<div class=\"elementor-element elementor-element-2c1c4fb elementor-widget elementor-widget-heading\" data-id=\"2c1c4fb\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">Blind- und vergrabene Mikrovias f\u00fcr hochdichte Verbindungen<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-aa9dffe elementor-widget elementor-widget-heading\" data-id=\"aa9dffe\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h4 class=\"elementor-heading-title elementor-size-default\">Fortschrittliche Via-Strukturen f\u00fcr ein kompaktes, leistungsstarkes Leiterplattendesign<\/h4>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-e1aef5d elementor-widget elementor-widget-text-editor\" data-id=\"e1aef5d\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>Blind-, Buried- und lasergebohrte Mikrovia-Architekturen erm\u00f6glichen extrem dichtes HDI-Routing. Dies f\u00fchrt zu k\u00fcrzeren Signalwegen, minimierten Via-Stubs, pr\u00e4ziserer <a href=\"https:\/\/picamfg.com\/de\/impedanzkontrolle\/\">Impedanzkontrolle<\/a> und h\u00f6herem I\/O-Breakout unter Fine-Pitch-BGAs. Bei PICA kombinieren unsere HDI-Aufbauprozesse Laserbohren, Kupferf\u00fcllung, sequentielle Laminierung und IPC-4761-konformen Via-Schutz, um zuverl\u00e4ssige, miniaturisierte Schaltungen f\u00fcr Hochgeschwindigkeits-, HF- und raue Umgebungselektronik zu realisieren. <\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/section>\n\t\t<div class=\"elementor-element elementor-element-b2db8b1 e-flex e-con-boxed e-con e-parent\" data-id=\"b2db8b1\" data-element_type=\"container\">\r\n\t\t\t\t\t<div class=\"e-con-inner\">\r\n\t\t\t\t<div class=\"elementor-element elementor-element-7de3f97 elementor-widget elementor-widget-heading\" data-id=\"7de3f97\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h4 class=\"elementor-heading-title elementor-size-default\">Warum Blind- und Buried-Mikrovias w\u00e4hlen?<\/h4>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-672f9be elementor-widget elementor-widget-text-editor\" data-id=\"672f9be\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p><strong>\u2022 H\u00f6here Leiterbahndichte<\/strong> \u2013 Mehr Leiterbahnkan\u00e4le und I\/O-Anschl\u00fcsse durch gestapelte\/versetzte Mikro-Vias<\/p><p><strong>\u2022 Optimiertes BGA-Escape<\/strong> \u2013 Unterst\u00fctzt Via-in-Pad, Fine-Pitch-BGAs, mmWave-Geh\u00e4use und erweiterte HDI-Platzierung<\/p><p>\u2022 \u00dcberlegene Signalintegrit\u00e4t \u2013 K\u00fcrzere Verbindungen reduzieren parasit\u00e4re Effekte; kupfergef\u00fcllte Mikro-Vias eliminieren Hohlr\u00e4ume und Stubs<\/p><p>\u2022 Platz- und Kosteneffizienz \u2013 Weniger Lagen mit hoher Dichte f\u00fchren zu d\u00fcnneren, leichteren und wirtschaftlicheren Platten<\/p><p>\u2022 Fertigungskompetenz \u2013 Erfordert fortschrittliche Prozesskontrollen: Laserablation, Durchkontaktierungsf\u00fcllung, Mehrkernlaminierung, IPC-4761-Konformit\u00e4t<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-96070c8 e-flex e-con-boxed e-con e-parent\" data-id=\"96070c8\" data-element_type=\"container\">\r\n\t\t\t\t\t<div class=\"e-con-inner\">\r\n\t\t\t\t<div class=\"elementor-element elementor-element-25fc480 elementor-widget elementor-widget-heading\" data-id=\"25fc480\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h4 class=\"elementor-heading-title elementor-size-default\">Blind- und Buried-Microvias-Funktionen \u2013 Highlights<\/h4>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-f3e8884 elementor-widget elementor-widget-text-editor\" data-id=\"f3e8884\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<ul><li data-start=\"1521\" data-end=\"1650\"><p data-start=\"1523\" data-end=\"1650\">Lasergebohrte Mikro-Vias bis 0,15 mm oder kleiner f\u00fcr schichtweise Aufbauverbindungen<\/p><\/li><li data-start=\"1651\" data-end=\"1744\"><p data-start=\"1653\" data-end=\"1744\">Blind-Vias verbinden Oberfl\u00e4chenschichten mit bestimmten inneren Schichten ohne tiefe Durchdringung.<\/p><\/li><li data-start=\"1745\" data-end=\"1827\"><p data-start=\"1747\" data-end=\"1827\">ergrabene Durchkontaktierungen, die vollst\u00e4ndig innerhalb interner Schichten liegen, f\u00fcr fortschrittliches HDI-Routing<\/p><\/li><li data-start=\"1828\" data-end=\"1923\"><p data-start=\"1830\" data-end=\"1923\">Gestapelte oder versetzte, mit Kupfer gef\u00fcllte Mikro-Vias f\u00fcr hochzuverl\u00e4ssige BGA-Via-in-Pad-Strukturen<\/p><\/li><li data-start=\"1924\" data-end=\"1999\"><p data-start=\"1926\" data-end=\"1999\">Sequenzielle Laminierung und Mehrkernaufbau f\u00fcr fortgeschrittene HDI-Dichte<\/p><\/li><li data-start=\"2000\" data-end=\"2129\"><p data-start=\"2002\" data-end=\"2129\">Durchkontaktierungsunterst\u00fctzung mittels Epoxidharzf\u00fcllung und Kupferkappenbeschichtung gem\u00e4\u00df IPC 4761 Typ 7<\/p><\/li><li data-start=\"2130\" data-end=\"2200\"><p data-start=\"2132\" data-end=\"2200\">Kontrollierte Aspektverh\u00e4ltnisse, die eine zuverl\u00e4ssige Qualit\u00e4t der Durchkontaktierungen gew\u00e4hrleisten<\/p><\/li><li data-start=\"2201\" data-end=\"2362\"><p data-start=\"2203\" data-end=\"2362\">Zuverl\u00e4ssigkeitspr\u00fcfung einschlie\u00dflich <a href=\"https:\/\/picamfg.com\/expertise\/x-ray-inspection-on-site-service\/\">R\u00f6ntgenpr\u00fcfung<\/a>, Temperaturwechseltests, Querschnittspr\u00fcfung und elektrischer 4-Leiter-Pr\u00fcfung<\/p><\/li><\/ul>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-da2d36f e-flex e-con-boxed e-con e-parent\" data-id=\"da2d36f\" data-element_type=\"container\">\r\n\t\t\t\t\t<div class=\"e-con-inner\">\r\n\t\t\t\t<div class=\"elementor-element elementor-element-633208e elementor-widget elementor-widget-heading\" data-id=\"633208e\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h4 class=\"elementor-heading-title elementor-size-default\">Globale Design- und Fertigungsunterst\u00fctzung<\/h4>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-3869e55 elementor-widget elementor-widget-text-editor\" data-id=\"3869e55\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>Wir arbeiten fr\u00fchzeitig mit Ihrem Entwicklungsteam zusammen, um HDI-Stack-Ups zu definieren, geeignete Via-Schutztypen auszuw\u00e4hlen und das Routing unter BGA-Bauteilen zu optimieren. Durch die Abstimmung von IPC-Anforderungen, konsistenten Toleranzen und Fertigungstauglichkeit von Anfang an minimieren wir Risiken bei Prototypen und der Serienproduktion. <\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-945fbba e-flex e-con-boxed e-con e-parent\" data-id=\"945fbba\" data-element_type=\"container\">\r\n\t\t\t\t\t<div class=\"e-con-inner\">\r\n\t\t<div class=\"elementor-element elementor-element-1ac811d e-con-full e-flex e-con e-child\" data-id=\"1ac811d\" data-element_type=\"container\">\r\n\t\t\t\t<div class=\"elementor-element elementor-element-fb08e26 elementor-widget elementor-widget-heading\" data-id=\"fb08e26\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h6 class=\"elementor-heading-title elementor-size-default\">Vorteile von Blind- und vergrabenen Mikrokan\u00e4len<\/h6>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-013ca82 elementor-widget elementor-widget-text-editor\" data-id=\"013ca82\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p><strong>Extrem dichte Verbindungen \u2013 jetzt auch praktisch!<\/strong><br>Mikrovias erm\u00f6glichen Durchmesser unter 150 Mikrometern und reduzieren die Gesamtlagenanzahl durch den Wegfall von Bohrungen in voller Tiefe. Dies erm\u00f6glicht mehr Leiterbahnfl\u00e4che auf kleinerem Raum und verringert gleichzeitig die Gesamtgr\u00f6\u00dfe der Leiterplatte. <\/p><p data-start=\"3162\" data-end=\"3199\"><strong>Optimale Durchbruchstechnik unter BGAs<\/strong><br>Die Kombination aus Via-in-Pad und Kupferf\u00fcllung erm\u00f6glicht kompakte BGA-Durchbruchsl\u00f6sungen und macht aufwendige Fan-Out-Strategien \u00fcberfl\u00fcssig. Ideal f\u00fcr kompakte Computer, Wearables, HF-Module, SoC-Geh\u00e4use und miniaturisierte Elektronik. <\/p><p data-start=\"3415\" data-end=\"3461\"><strong>Verbesserter Signalweg und h\u00f6here HF-Integrit\u00e4t<\/strong><br>Kupfergef\u00fcllte Mikro-Vias beseitigen Hohlr\u00e4ume und reduzieren parasit\u00e4re Widerst\u00e4nde und Induktivit\u00e4ten. Dieser Vorteil ist entscheidend f\u00fcr Hochgeschwindigkeits-SERDES, 5G-mmWave-Ger\u00e4te und die HF-Kommunikationsleistung. <\/p><p data-start=\"3687\" data-end=\"3737\"><strong>Kleinere Bauform und geringere Lagenanzahl<\/strong><br>Durch die Verwendung von vergrabenen und blinden Durchkontaktierungen k\u00f6nnen weniger Lagen bei gleichzeitig h\u00f6herer Schaltungsdichte realisiert werden. Dies f\u00fchrt zu d\u00fcnneren Bauelementen mit geringeren Gesamtkosten und verbesserter Funktionalit\u00e4t. <\/p><p data-start=\"3916\" data-end=\"3969\"><strong>Zuverl\u00e4ssige Fertigung f\u00fcr die Serienproduktion<\/strong><br>Kontrolliertes Laserbohren, Harz- oder Kupferf\u00fcllung, Laminierungszyklen und IPC-qualifizierte Dichtungsstrategien gew\u00e4hrleisten eine wiederholbare HDI-Zuverl\u00e4ssigkeit von fr\u00fchen Prototypen bis hin zur Serienproduktion.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-dcb79aa e-con-full e-flex e-con e-child\" data-id=\"dcb79aa\" data-element_type=\"container\">\r\n\t\t\t\t<div class=\"elementor-element elementor-element-70f0e81 elementor-widget elementor-widget-heading\" data-id=\"70f0e81\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h6 class=\"elementor-heading-title elementor-size-default\">M\u00e4rkte, die wir mit Blind- und vergrabenen Mikrokan\u00e4len bedienen<\/h6>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-1aece28 elementor-widget elementor-widget-text-editor\" data-id=\"1aece28\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p data-start=\"4195\" data-end=\"4328\"><strong data-start=\"4195\" data-end=\"4230\"><a href=\"https:\/\/picamfg.com\/wearables-market\/\">Mobil- und Unterhaltungselektronik<\/a><\/strong><br data-start=\"4230\" data-end=\"4233\">Miniaturisierte HDI-Designs f\u00fcr faltbare Ger\u00e4te, SOCs, kompakte HF-Module und Kamerasubsysteme.<\/p><p data-start=\"4330\" data-end=\"4491\"><strong data-start=\"4330\" data-end=\"4349\"><a href=\"https:\/\/picamfg.com\/medical-market\/\">Medizinprodukte<\/a><\/strong><br data-start=\"4349\" data-end=\"4352\">Implantierbare Sensoren, tragbare \u00dcberwachungsplattformen und Mikroelektronik mit hoher Pin-Anzahl, bei der Zuverl\u00e4ssigkeit und Miniaturisierung von entscheidender Bedeutung sind.<br><br><\/p><p data-start=\"4493\" data-end=\"4687\"><strong data-start=\"4493\" data-end=\"4526\"><a href=\"https:\/\/picamfg.com\/automotive-market\/\">Automobil- und Transportwesen<\/a><\/strong><br data-start=\"4526\" data-end=\"4529\">HDI-Leiterplatten in Umgebungen mit starken Vibrationen und hohen Temperaturen, die eine robuste mechanische Unterst\u00fctzung f\u00fcr Blind- und vergrabene Durchkontaktierungen erfordern.<\/p><p data-start=\"4689\" data-end=\"4855\"><strong data-start=\"4689\" data-end=\"4733\"><a href=\"https:\/\/picamfg.com\/communications-market\/\">Telekommunikations- und 5G-Infrastruktur<\/a><\/strong><br data-start=\"4733\" data-end=\"4736\">mmWave-Module, Router, Switching Blades und HF-Signalverarbeitungsplattformen, die saubere Impedanz\u00fcberg\u00e4nge erfordern.<\/p><p data-start=\"4857\" data-end=\"5016\"><strong data-start=\"4857\" data-end=\"4895\"><a href=\"https:\/\/picamfg.com\/industrial-electronics\/\">Industrieelektronik und Verteidigungselektronik<\/a><\/strong><br data-start=\"4895\" data-end=\"4898\">Satellitensysteme, Flugcomputer, Drohnen und platzsparende Rechenmodule, bei denen robuste Dichte unerl\u00e4sslich ist.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-b04fbc3 e-flex e-con-boxed e-con e-parent\" data-id=\"b04fbc3\" data-element_type=\"container\">\r\n\t\t\t\t\t<div class=\"e-con-inner\">\r\n\t\t\t\t<div class=\"elementor-element elementor-element-dce17bc elementor-widget-divider--view-line elementor-widget elementor-widget-divider\" data-id=\"dce17bc\" data-element_type=\"widget\" data-widget_type=\"divider.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"elementor-divider\">\n\t\t\t<span class=\"elementor-divider-separator\">\n\t\t\t\t\t\t<\/span>\n\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<section class=\"elementor-element elementor-element-56e7c63 e-flex e-con-boxed e-con e-parent\" data-id=\"56e7c63\" data-element_type=\"container\">\r\n\t\t\t\t\t<div class=\"e-con-inner\">\r\n\t\t\t\t<div class=\"elementor-element elementor-element-92ae974 elementor-widget elementor-widget-text-editor\" data-id=\"92ae974\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p><strong><a href=\"https:\/\/picamfg.com\/via-protection-white-paper-download\/\">Erfahren Sie mehr \u00fcber Vias und Via-Schutz in unseren Whitepapers: <\/a><\/strong><\/p><p><a href=\"https:\/\/picamfg.com\/via-protection-white-paper-download\/\">Der unverzichtbare Leitfaden zum Durchkontaktierungsschutz auf Leiterplatten: Strategien und Standards.<\/a><\/p><p><a href=\"http:\/\/The%20Essential%20Guide%20to%20PCB%20Via%20Protection:%20Strategies%20and%20Standards.\" data-wplink-url-error=\"true\">Durchkontaktierungen auf Leiterplatten verstehen: Durchgangsl\u00f6cher, Blinddurchkontaktierungen, vergrabene Durchkontaktierungen und mehr<\/a><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/section>\n\t\t<section class=\"elementor-element elementor-element-750ce07 e-flex e-con-boxed e-con e-parent\" data-id=\"750ce07\" data-element_type=\"container\">\r\n\t\t\t\t\t<div class=\"e-con-inner\">\r\n\t\t<div class=\"elementor-element elementor-element-2474e45 e-con-full e-flex e-con e-child\" data-id=\"2474e45\" data-element_type=\"container\">\r\n\t\t\t\t<div class=\"elementor-element elementor-element-2f29ff4 elementor-widget elementor-widget-image\" data-id=\"2f29ff4\" data-element_type=\"widget\" data-widget_type=\"image.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<img fetchpriority=\"high\" decoding=\"async\" width=\"768\" height=\"492\" src=\"https:\/\/picamfg.com\/wp-content\/uploads\/2024\/04\/PICA-Manufacturing-Solutions-WP-768x492.png\" class=\"attachment-medium_large size-medium_large wp-image-20376\" alt=\"Download &#039;The Essential Guide to PCB Via Protection: Strategies and Standards&#039; by Tyson Mortimer, offering comprehensive strategies for protecting PCB vias in electronic manufacturing.\" srcset=\"https:\/\/picamfg.com\/wp-content\/uploads\/2024\/04\/PICA-Manufacturing-Solutions-WP-768x492.png 768w, https:\/\/picamfg.com\/wp-content\/uploads\/2024\/04\/PICA-Manufacturing-Solutions-WP-640x410.png 640w, https:\/\/picamfg.com\/wp-content\/uploads\/2024\/04\/PICA-Manufacturing-Solutions-WP-400x256.png 400w, https:\/\/picamfg.com\/wp-content\/uploads\/2024\/04\/PICA-Manufacturing-Solutions-WP-367x235.png 367w\" sizes=\"(max-width: 768px) 100vw, 768px\" \/>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-02d3a2f elementor-widget elementor-widget-text-editor\" data-id=\"02d3a2f\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>Allzu oft werden Leiterplatten als einfache zweidimensionale Fl\u00e4chen betrachtet. Nirgends wird diese Vereinfachung deutlicher als in der komplexen Struktur der Durchkontaktierungen (Vias). Diese essenziellen Strukturen sind entscheidend f\u00fcr Form und Funktion jeder Leiterplatte mit mehr als einer Lage. Ohne diese Vias w\u00e4re moderne Elektronik in ihrer heutigen Form nicht m\u00f6glich. Dieser Artikel beleuchtet die Bedeutung des Via-Schutzes, die Empfehlungen des Institute for Printed Circuits (IPC), die verschiedenen Arten des Via-Schutzes, ihre Anwendungen sowie die damit verbundenen Einschr\u00e4nkungen und Kompromisse.    <\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-a7b005e elementor-align-center elementor-widget elementor-widget-button\" data-id=\"a7b005e\" data-element_type=\"widget\" data-widget_type=\"button.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div class=\"elementor-button-wrapper\">\n\t\t\t\t\t<a class=\"elementor-button elementor-button-link elementor-size-md\" href=\"https:\/\/picamfg.com\/via-protection-white-paper-download\/\">\n\t\t\t\t\t\t<span class=\"elementor-button-content-wrapper\">\n\t\t\t\t\t\t\t\t\t<span class=\"elementor-button-text\">Whitepaper herunterladen<\/span>\n\t\t\t\t\t<\/span>\n\t\t\t\t\t<\/a>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-37487ec e-con-full e-flex e-con e-child\" data-id=\"37487ec\" data-element_type=\"container\">\r\n\t\t\t\t<div class=\"elementor-element elementor-element-d046b5a elementor-widget elementor-widget-image\" data-id=\"d046b5a\" data-element_type=\"widget\" data-widget_type=\"image.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<img decoding=\"async\" width=\"768\" height=\"910\" src=\"https:\/\/picamfg.com\/wp-content\/uploads\/2025\/02\/Understanding-PCB-Via-Holes-WP-Cover-768x910.png\" class=\"attachment-medium_large size-medium_large wp-image-20377\" alt=\"PICA Manufacturing Solutions White Paper on PCB Via holes cover\" srcset=\"https:\/\/picamfg.com\/wp-content\/uploads\/2025\/02\/Understanding-PCB-Via-Holes-WP-Cover-768x910.png 768w, https:\/\/picamfg.com\/wp-content\/uploads\/2025\/02\/Understanding-PCB-Via-Holes-WP-Cover-640x758.png 640w, https:\/\/picamfg.com\/wp-content\/uploads\/2025\/02\/Understanding-PCB-Via-Holes-WP-Cover-400x474.png 400w, https:\/\/picamfg.com\/wp-content\/uploads\/2025\/02\/Understanding-PCB-Via-Holes-WP-Cover-367x435.png 367w\" sizes=\"(max-width: 768px) 100vw, 768px\" \/>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-665984c elementor-widget elementor-widget-text-editor\" data-id=\"665984c\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>Leiterplatten (PCBs) bilden das R\u00fcckgrat moderner elektronischer Ger\u00e4te und bieten die physische Plattform f\u00fcr die Montage und Verbindung elektronischer Bauteile. Zu den wesentlichen Elementen im PCB-Design geh\u00f6ren Durchkontaktierungen \u2013 kleine L\u00f6cher, die elektrische Verbindungen zwischen verschiedenen Lagen der Leiterplatte erm\u00f6glichen. Durchkontaktierungen tragen zu einer effizienten Signalf\u00fchrung, einem optimierten W\u00e4rmemanagement und einer effizienteren Platznutzung in komplexen Mehrlagenplatinen bei.  <\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-3ef6249 elementor-align-center elementor-widget elementor-widget-button\" data-id=\"3ef6249\" data-element_type=\"widget\" data-widget_type=\"button.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div class=\"elementor-button-wrapper\">\n\t\t\t\t\t<a class=\"elementor-button elementor-button-link elementor-size-md\" href=\"https:\/\/picamfg.com\/understanding-pcb-via-holes-white-paper\/\">\n\t\t\t\t\t\t<span class=\"elementor-button-content-wrapper\">\n\t\t\t\t\t\t\t\t\t<span class=\"elementor-button-text\">Whitepaper herunterladen<\/span>\n\t\t\t\t\t<\/span>\n\t\t\t\t\t<\/a>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/section>\n\t\t<div class=\"elementor-element elementor-element-fb07945 e-flex e-con-boxed e-con e-parent\" data-id=\"fb07945\" data-element_type=\"container\">\r\n\t\t\t\t\t<div class=\"e-con-inner\">\r\n\t\t\t\t<div class=\"elementor-element elementor-element-e007e65 elementor-widget-divider--view-line elementor-widget elementor-widget-divider\" data-id=\"e007e65\" data-element_type=\"widget\" data-widget_type=\"divider.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"elementor-divider\">\n\t\t\t<span class=\"elementor-divider-separator\">\n\t\t\t\t\t\t<\/span>\n\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-993c27a e-flex e-con-boxed e-con e-parent\" data-id=\"993c27a\" data-element_type=\"container\">\r\n\t\t\t\t\t<div class=\"e-con-inner\">\r\n\t\t\t\t<div class=\"elementor-element elementor-element-d84230e elementor-widget elementor-widget-spacer\" data-id=\"d84230e\" data-element_type=\"widget\" data-widget_type=\"spacer.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"elementor-spacer\">\n\t\t\t<div class=\"elementor-spacer-inner\"><\/div>\n\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-cec1de5 elementor-widget elementor-widget-text-editor\" data-id=\"cec1de5\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>Die unten aufgef\u00fchrten Blogs erweitern den Inhalt dieser Seite und bieten detaillierte Einblicke in spezifische Design-, Fertigungs- und Anwendungsthemen, die Ingenieuren und Entscheidungstr\u00e4gern zus\u00e4tzliche Relevanz und einen tieferen Kontext bieten.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-0b67450 elementor-widget elementor-widget-spacer\" data-id=\"0b67450\" data-element_type=\"widget\" data-widget_type=\"spacer.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"elementor-spacer\">\n\t\t\t<div class=\"elementor-spacer-inner\"><\/div>\n\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<section class=\"elementor-element elementor-element-ca1ee15 e-flex e-con-boxed e-con e-parent\" data-id=\"ca1ee15\" data-element_type=\"container\">\r\n\t\t\t\t\t<div class=\"e-con-inner\">\r\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/section>\n\t\t\t\t<\/div>\n\t\t","protected":false},"excerpt":{"rendered":"<p>Blind- und vergrabene Mikrovias f\u00fcr hochdichte Verbindungen Fortschrittliche Via-Strukturen f\u00fcr ein kompaktes, leistungsstarkes Leiterplattendesign Blind-, Buried- und lasergebohrte Mikrovia-Architekturen erm\u00f6glichen extrem dichtes HDI-Routing. Dies f\u00fchrt zu k\u00fcrzeren Signalwegen, minimierten Via-Stubs, pr\u00e4ziserer Impedanzkontrolle und h\u00f6herem I\/O-Breakout unter Fine-Pitch-BGAs. Bei PICA kombinieren unsere HDI-Aufbauprozesse Laserbohren, Kupferf\u00fcllung, sequentielle Laminierung und IPC-4761-konformen Via-Schutz, um zuverl\u00e4ssige, miniaturisierte Schaltungen f\u00fcr Hochgeschwindigkeits-,&#8230;&nbsp;<a class=\"moretag\" href=\"https:\/\/picamfg.com\/de\/blinde-und-vergrabene-mikrovias\/\">READ MORE<\/a><\/p>\n","protected":false},"author":13,"featured_media":20373,"parent":0,"menu_order":118,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_acf_changed":false,"content-type":"","footnotes":""},"tags":[84],"class_list":["post-20372","page","type-page","status-publish","has-post-thumbnail","hentry","tag-sachverstand"],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.1.1 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Blind- und vergrabene Mikro-Vias in HDI-Leiterplatten | Hochdichtes Design<\/title>\n<meta name=\"description\" content=\"PICA erm\u00f6glicht hochdichte Leiterplattendesigns mit verdeckten und vergrabenen Mikro-Vias. 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